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Standards and Specifications The Seven Wonders of Design Innovation

Standards and Specifications The Seven Wonders of Design Innovation. INTRODUCTION TO IPC & STANDARDIZATION. Minimum Standards Tool Kit. Membership Development. PCB Manufacturers 382 EMS Companies 374 Suppliers 636 OEMs 753 Government/Others _ 198__

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Standards and Specifications The Seven Wonders of Design Innovation

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  1. Standards and SpecificationsThe Seven Wonders of Design Innovation INTRODUCTION TO IPC & STANDARDIZATION

  2. Minimum Standards Tool Kit

  3. Membership Development • PCB Manufacturers 382 • EMS Companies 374 • Suppliers 636 • OEMs 753 • Government/Others _198__ Total 2,343 Companies • IPC Designers Council 1,100 Individuals

  4. Major IPC Program Areas • Management Programs • Industry Programs • Technical Programs • Education, Training & Certification • Market Research/Statistical Programs • Public Policy Advocacy

  5. Technical Programs • Standards & Specifications • Technical Committees • Activities with Other Organizations • International Activities • Current Major Initiatives

  6. Technical Programs Standards & Specifications • Standards, specifications and guidelines developed for PCB design, manufacture and assembly • ANSI-Accredited Standards Developing Organization (SDO) • Industry technology roadmaps • Software Code Standards for Interoperability

  7. Technical Programs Technical Committees • 21 General Committees • 160 Subcommittees and Task Groups • Consist of industry peers • Started writing standards in 1959 (46 years ago) • Responsible for round robin test programs • Managed by Technical Activities Executive Committee (TAEC)

  8. Technical Programs Activities with Other Organizations Membership and Active Participation • National Electronics Manufacturing Initiative (NEMI) now iNEMI • American National Standards Institute (ANSI) • Underwriters Laboratories (UL)

  9. Technical Programs Activities with Other Organizations Joint Standards Activity • Japan Printed Circuit Association (JPCA) • Wiring and Harness Manufacturers Association (WHMA) • Electronic Industries Alliance (EIA) • Joint Electron Device Engineering Council (JEDEC) • Jisso International Council (JIC)

  10. Technical Programs International Activities • Liaison “D” Status to IEC TC91 • U.S. Technical Advisor (TA) IEC TC91 on SMT • Chairmanship of IEC TC91 on SMT • Secretary, US TAG on IEC TC93 on EDA • US TAG of ISO Task group on Solder materials • IPC standards internationally recognized

  11. Technical Programs Current Major Initiatives • Optoelectronics • Lead-Free & Halogen Free issues • Embedded components • Wire Harness workmanship • Electronics enclosures • 2004/2005 International Technology Roadmap • Material Declaration • Enterprise Communication Standards

  12. 004/2005 2004/2005 2002 - 2003 2004-2005

  13. IPC Membership Location • A Global Membership • 78% North America • 11% Europe • 9% Asia • 2% Rest of World • Members in 47 Countries

  14. How Does the Standards Process Work? • Task groups develop drafts of new standards and resolve comments at IPC meetings • Participants represent their company • Four stages to get comments from industry • Project Submission - TAEC approves form • Working Draft - gets project started • Proposal -solicits comments from industry • Interim Final - resolves comments for balloting

  15. Standard Development Cycle Industry Needs Working Drafts Project Approval Expert review Proposal Final Ballot Distribution

  16. Terms and Definitions • Terminology is the key to good communication • IPC-T-50 initial release in 1965 • Next revision is “H” scheduled for 2007 • Use of the Treutler Classification Code • Builds on the standardization process • Contains over 2000 terms • Has international recognition • IEC 60194 – identical except spelling

  17. Classification Code • 1-Administration • 2-Engineering and Design for elect. pkg • 3-Components for electronic packaging • 4-Materials for electronic packaging • 5-Interconnect board fabrication processes • 6-Types/performance for Interconnections • 7-Assembly processes • 8-Types/performance for assemblies • 9-Quality/reliability for boards/assembly

  18. Second Digit Family 6 ID • 60-General terms • 61-Rigid printed boards (organic) • 62-Flexible printed boards (organic) • 63-Flex-rigid printed boards (organic) • 64-Discrete wiring boards (organic) • 65-Inorganic printed boards (ceramic etc.) • 66-Molded structures (three dimensional) • 67-Hybrid/Multichip module structures • 68-(Reserved for future expansion) • 69-Other interconnecting structure terms

  19. CC Description Examples 22. PRINTED BOARD AND PRINTED BOARD ASSEMBLY DESIGN Contains terms related to printed board and printed board assembly. Includes, but is not limited to computer aided design (CAD) equipment and software algorithms, such items as design rule checks, direct input from CAE work stations, gate assignment or gate swapping, fixed grid snap-in, force field component manipulation, heat sensitivity analysis, multi-directional conductor routing etc. 77. REWORK, REPAIR AND MODIFICATION Contains terms related to the techniques, tools, materials and equipment used to remove, replace, or add components to an interconnecting structure, or to correct/change a circuit feature in the structure itself, and terms related to restoring the assembly to its proper function.

  20. IPC-T-50 Published • Embedded Component 30.0436 A discrete or active component that is fabricated as an integral part of a printed board. (See Figure E-1.)

  21. IPC-T-50 Published • Discrete Component 30.0392 A separate part of a printed board assembly that performs a circuit function, e.g., a resistor, a capacitor, a transistor,etc. • Active Device 30.0016 An electronic component whose basic character changes while operating on an applied signal. (This includes diodes, transistors, thyristors, and integrated circuits that are used for the rectification, amplification, switching, etc., of analog or digital circuits in either monolithic or hybrid form.) • Passive Component (Element) 30.1468 A discrete electronic device whose basic character does not change while it processes an applied signal. (This includes components such as resistors, capacitors, and inductors.)

  22. Terms and Definitions

  23. Terminology • Blank * 41.1339 An unprocessed or partially processed piece of base material or metal- clad base material, that has been cut from a sheet or panel, that has the rough dimensions of a printed board. (See also ‘‘Panel.’’) • Panel * 41.1463 A rectangular sheet of base material or metal-clad material of predetermined size that is used for the processing of one or more printed boards and, when required, one or more test coupons. (See also ‘‘Blank.’’) • Fabrication Panel A rectangular sheet of base material or metal-clad material of predetermined size that is used by a printed board manufacturer for the processing of one or more printed boards and, when required, one or more test coupons. (See also ‘‘Blank.’’) • Board * 60.0118 see ‘‘Printed Board,‘‘ and ‘‘Multilayer Printed Board.’’ • Printed Board (PB) * 60.1485 The general term for completely processed printed circuit and printed wiring configurations. (This includes single-sided, double-sided and multilayer boards with rigid, flexible, and rigid-flex base materials.)

  24. Terminology • Multilayer Printed Board * 60.1227 The general term for a printed board that consist of rigid or flexible insulation materials and three or more alternate printed wiring and/or printed circuit layers that have been bonded together and electrically interconnected. • Finished Board see “Printed Board” • Finished Panel A rectangular sheet of base material or metal-clad material of predetermined size that is used for the processing of one or more printed board designs and, when required, one or more test coupons which is extracted from the fabrication panel to deliver to the customer or to the next level of fabrication. (see Assembly Pallet) • Assembly* 80.1327 A number of parts, subassemblies or combinations thereof joined together. (Note: This term can be used in conjunction with other terms listed herein, e.g., ‘‘Printed Board Assembly’’) • Printed Board Assembly* 80.0911 The generic term for an assembly that uses a printed board for component mounting and interconnecting purposes. • Array* 22.0049 A group of elements or circuits arranged in rows and columns on a base material.

  25. Terminology • Printed Board Assembly Array A group of assemblies, all of the same design, arranged in rows and columns on a panel. • Assembly Pallet The generic term for the assembly that uses a finished panel, as delivered from the board fabricator, of the same or different designs, for element and circuit component mounting and attachment to the board interconnections layers. The board arrangement on the pallet may be random or in the form of an array; the pallet may also include coupons for testing.

  26. Hierarchy of IPC Design Standards(2220 Series) IPC-2220 IPC-2221 GENERIC IPC-2222 IPC-2223 IPC-2224 IPC-2225 IPC-2226 RIGID FLEX PCMCIA MCM-L HDI

  27. Hierarchy of Printed Board Performance Standards(6010 Series) IPC-6010 IPC-6011 GENERIC IPC-6012 IPC-6013 IPC-6014 IPC-6015 IPC-6016 RIGID FLEX PCMCIA MCM-L HDI

  28. Applicable IPC Standards • -SM-782; Land Pattern Considerations • -7095; BGA Process Implementation • -2315; HDI & Microvia Design Guide • -SM-785; SMT Reliability Testing • -D-279; Design for SMT Reliability • J-STD-001; Soldering Requirements • -A-610; Assembly Acceptability • -6010; Printed Board Series • J-STD-004/005; Solder Flux/Paste

  29. Scope Example (land patterns) • This standard provides information on land pattern geometries used for surface attachment of electronic components. • The intent of the information presented is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient area for the appropriate solder fillet or solder volume. • Also to allow for inspection, testing, and rework of those solder joints.

  30. Scope (continued) • Land pattern geometry may be different based on the type of soldering used to attach the electronic part, however land patterns are defined in such a manner that they are transparent to the process. • Standard configurations are for manual designs & for computer-aided design. • Parts are mounted on one or both sides, subjected to wave, reflow, or other type of soldering

  31. Scope (continued) • Although patterns are dimensionally defined and since they are a part of the printed board circuitry geometry, they are subject to the producibility levels and tolerances associated with plating, etching, assembly or other conditions. • The producibility aspects also pertain to the use of solder mask and the registration required between the solder mask and the conductor patterns.

  32. Performance Classes • Three performance classes have been established to reflect progressive increases in sophistication, functional performance requirements and testing/ inspection frequency. • There may be an overlap of equipment categories in different classes. • The user is responsible to specify, in the contract or purchase order, the product performance class.

  33. Class 1 - General Electronic Products Includes consumer products, some computer and computer peripherals suitable for applications where cosmetic imperfections are not important and the major requirement is function of the completed printed board.

  34. Class 2 - Dedicated Service Electronic Products Includes communications equipment, sophisticated business machines, instruments where high performance and extended life is required and for which uninterrupted service is desired but not critical. Certain cosmetic imperfections are allowed.

  35. Class 3 - High Reliability Electronic Products Includes the equipment and products where continued performance or performance on demand is critical. Equipment downtime cannot be tolerated and must function when required such as in life support items or flight control systems. Applications where high levels of assurance are required and service is essential.

  36. Interpretation “Shall,” the emphatic form of the verb, is used throughout this specification whenever a requirement is intended to express a provision that is binding. Deviation from a “shall” requirement may be considered if sufficient data is supplied to justify the exception. The words “should” and “may” are used whenever it is necessary to express non-mandatory provisions. “Will” is used to express a declaration of purpose. To assist the reader, the word “shall” is presented in bold characters.

  37. Complexity Levels • Land pattern determination methods: • Exact details based on component specifications, board manufacturing and component placement accuracy. The land patterns are restricted to a specific component, and have an identifying land pattern number • Equations used for new components or to alter the given information to achieve a more robust solder connection, when used in particular situations

  38. Level A: Maximum • For low-density product applications, the 'maximum' land pattern condition have been developed to accommodate wave or flow solder of leadless chip devices and leaded gull- wing devices. • The geometry furnished for these devices, as well as inward and “J”-formed lead contact device families, may provide a wider process window for reflow solder processes as well.

  39. Level B: Median • Products with a moderate level of component density should consider adapting the 'median' land patterns. • The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes. • The condition should suitable for wave or reflow soldering of leadless chip and leaded gull-wing type devices.

  40. Level C: Minimum • High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. • Selection of the minimum land pattern geometry may not be suitable for all product use categories.

  41. Combination of Issues • Performanceclasses 1, 2, and 3 are combined with that of complexity and density levels A, B, and C in defining electronic assembly conditions. • As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to understand fabrication and assembly requirements for manufacturing and end use environment.

  42. Test Requirements • Prior to starting a design, a testability review meeting should be held with fabrication, assembly, and testing. • Testability concerns, such as circuit visibility, density, operation, circuit controllability, partitioning, and special test requirements and specifications are discussed as a part of the test strategy

  43. Test Requirements • During the design testability review meeting, tooling concepts are established, and determinations are made as to the most effective tool cost versus board layout concept conditions. • During the layout process, any circuit board changes that impact the test program, or the test tooling, should be reported to determine the best compromise.

  44. Board Test Requirements • The testing concept should develop approaches that can check the board for problems, and also detect fault locations wherever possible. • The test concept and requirements should economically facilitate the detection, isolation, and correction of faults of the design verification, manufacturing, and field support of the printed board assembly life cycle.

  45. Assembly Testability • The printed board assembly testability philosophy also needs to be compatible with the overall integration, testing and maintenance plans. This includes: • The factory testers to be used • How integration and test is planned • When conformal coated is applied • Depot & field test equipment capability • Personnel skill level

  46. Need for Automation • Standards needed for design and assembly • New concepts in Business process optimization for competitiveness • A need for lower operating costs in business and Information Transfer (IT). • Tight business alignment with IT is essential • Development of internal and external Service Oriented Architecture is needed in order to manage the new culture change. • Shorten product development cycles • Increase product flexibility • Solutions require continuous monitoring of industry progress & infrastructure growth

  47. IPC to IEC Deployment • IPC-SM-782 provided by US to IEC • Countries agree to standardize • Japan found that one land pattern is insufficient to design Sony Minicam™ assemblies • Discussions review principles of mathematical model – tighten requirements • Three geometries proposed for future • IEC starts work on IEC-61188-5-1 thru -8 • IPC supersedes SM-782A with IPC-7351 • Computer model tested with PCB Libraries

  48. IPC-7351 Land Pattern Variations Density Level A: Maximum (Most) Land Protrusion - for low component density applications and products exposed to high shock or vibration. The solder pattern is the most robust and can be easily reworked if necessary. Density Level B: Median (Nominal) Land Protrusion - for products with a moderate level of component density and providing a more robust solder attachment. Density Level C: Minimum (Least) Land Protrusion - for miniature devices where the land pattern has the least amount of solder pattern to achieve the highest component packing density.

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