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Resist Outgassing Work in ExCITe W.-D. Domke; Infineon

Resist Outgassing Work in ExCITe W.-D. Domke; Infineon. ExCITe/More Moore Meeting May 12, 2005 Athens, Greece. P. Legend: M - main chamber P - photodiode Q - quadrupole mass spectrometer S - sample ion pump turbomolecular pump diaphragm pump

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Resist Outgassing Work in ExCITe W.-D. Domke; Infineon

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  1. Resist Outgassing Work in ExCITe W.-D. Domke; Infineon ExCITe/More Moore Meeting May 12, 2005 Athens, Greece

  2. P Legend: M - main chamber P - photodiode Q - quadrupole mass spectrometer S - sample ion pump turbomolecular pump diaphragm pump inverted magnetron gauge valve M beam Q S beam 30º 60º Q Synchrotrone Trieste – EUV outgassing setup • EUV beam incidence on resist on silicon samples was at an angle of 30 ° • quadrupole mass spectrometer was located at 60°, distance from wafer was 15 mm. • chamber volume is 3.1 liter • EUV outgassing is sampled at different spots of a coated wafer to allow fast mass spectrometer scanning (10 amu channels per exposure); spot size was 2.5 x 0.5 mm

  3. Measurement of EUV total outgassing • Total outgassing pressure (10-9 mbar) is integrated over a total exposure time of 2 min. • total outgassing of different resist samples varied by 3 orders of magnitude; low outgassing resists resulting in 10+12 molecules/cm2 sec

  4. Evaluation of mass spectra • Samples are exposed for 120 sec • 10 mass channels are measured simultaneously • time-dependent mass signals are evaluated per peak value or per integral • mass spectra are then reconstructed from all available channels

  5. acrylic CO / C2H4 CO2 C3H7 C4H8 C6H6 C4H3 ESCAP C2H5O CH3J J round robin CF3 EUV fragments comparison The highest outgassing fragments are deblocking group fragments and CO2 One order of magnitude less is the outgassing of PAG fragments and polymer chain fragments Another order of magnitude less is the outgasssing of iodine-containing fragments from the PAG

  6. Advantages/Disadvantages • Easy Online Setup • high EUV power • only in-band (13.4nm) radiation   • only few synchrotron exposure slots available • high time consumption of total evaluation • not sensitive enough for low-outgassing materials Remark: some tool supplier (ASML, Nikon) set very different outgassing requirements

  7. Status and Plan for Infineon Outgassing Work • Good cooperation with Elettra/Synchrotrone Trieste for EUV Outgassing Work • Experimental setup refined and screening of some resist classes done • Impact of fine-tuning resist formulation (PAG, quencher) on outgassing under evaluation • Comparison of Outgassing Methodology done in IEUVI Resist TWG • Plans for IEUVI-initiated round robin experiments

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