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Why we clean; What we clean.

Learn why cleaning electronic assemblies is crucial for performance, cosmetics, and reliability. Understand the standards, materials, and protocols involved in the cleaning process to ensure optimal results and avoid costly repairs. Discover the importance of removing particulate matter, flux residue, and other contaminants to maintain product integrity. Make informed decisions to protect your investments and reputation in the electronics industry.

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Why we clean; What we clean.

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  1. Why we clean; What we clean. Selecting a Winning Combination for Electronic Assembly

  2. Why clean? Performance Cosmetics Contractual Reliability It Pays to CLEAN

  3. IPC/EIA J-STD 001/DRequires Clean BoardsClass B & C Electronics • 8.3.1 No Particulate matter (all classes) • No lint, solder splash, dross, wire clippings • No loose or dislogable solder balls • 8.3.2 Unless otherwise specified (all classes), assemblies shall be cleaned and be: • Free from flux residue (1X) • < 1.56 micrograms/cm2 NaCl equivalent ionizables • Appendix B standardizes a testing protocol to be used when implementing new flux materials or validating a cleaning process change • SIR, ROSE, Ion Chromatography

  4. Confusion leads to poor choices • Saving a dollar by not cleaning may cost $100’s of repairs or worst, lost customers • Exponential rule of repair • Repair @ board level = $1 • Repair @ assembly level = $10 • Repair @ customer level = $100

  5. Soils to Clean Dust & Dirt Solder balls Oils Solder Paste Plating salts Adhesives Finger prints Fluxes

  6. Critical Questions to answer in Selecting a Winning Cleaning Process • What are we cleaning? • What standard(s) apply? • What solvent are we using? • What equipment is selected? • How are we going to qualify • and control the process?

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