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Multiple Lamination Materials in Pb-free Project Idea

Multiple Lamination Materials in Pb-free Project Idea. Joe Smetana Alcatel-Lucent HDPUG Member Meeting May 18, 2011 Shenzhen, PRC. Possible Project Background.

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Multiple Lamination Materials in Pb-free Project Idea

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  1. Multiple Lamination Materials in Pb-freeProject Idea Joe Smetana Alcatel-Lucent HDPUG Member Meeting May 18, 2011 Shenzhen, PRC

  2. Possible Project Background • Material and Board Fabricators have identified challenges in materials used in multiple lamination cycles and then exposed to Pb-free reflow • Our MRT projects only use single laminations and don’t directly evaluate this

  3. Idea • Create a project to evaluate Pb-free survivability of materials after multiple lamination cycles (3?) • Test by exposure to • 6X@288ºC – cross-sections • 6X@260ºC Reflow – cross-sections • IST • Other testing? TBD • Evaluate at 1mm and 0.8mm pitch • Buried Via Array • Through Via Array • Stacked Microvias (2) on Buried Via Array

  4. Requires • New Test Vehicle Design • New IST coupon design(s) • Material Selection • Material suppliers to support • Fabricators to support

  5. Is there an interest? • Note – ALU will likely support this project but has no plans to lead it… • Project Leader would be needed

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