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Embodiment 2: PoP bottom pkg Height 를 낮추기 위하여 , die 를 PCB 속으로 넣어서 TCNCP process 를 진행 함 .

NCP writing. flip chip bonding. Embodiment 2: PoP bottom pkg Height 를 낮추기 위하여 , die 를 PCB 속으로 넣어서 TCNCP process 를 진행 함 . heating. Current. Invention. TCNCP process.

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Embodiment 2: PoP bottom pkg Height 를 낮추기 위하여 , die 를 PCB 속으로 넣어서 TCNCP process 를 진행 함 .

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  1. NCP writing flip chip bonding • Embodiment 2: PoP bottom pkgHeight를 낮추기 위하여, die를 PCB 속으로 넣어서 TCNCP process를 진행 함. heating Current Invention • TCNCP process

  2. Embodiment 3: PoP top pkg Current의 경우는 top pkg가 CABGA or SCSP type으로써 wire loop height로 인하여 mold cap height가 높아짐.Invention의 경우는 invention bottom pkg를 뒤집어서 PoP의 top pkg를 구현하므로 current보다는 얇은 pkg height를 구현 할 수 있음. Current Invention + +

  3. Embodiment 4 : pre-stacking for top and bottom pkgCurrent의 경우는 top pkg의 solder ball을 이용한 pre-stacking 방식으로 써, solder paste를 사용한 pre-stacking구현 방식보다는 total top height가 높음. Invention Current Die thickness is included within PCB thickness BGA connection for interface of top and bottom pkg LGA connection for interface of top and bottom pkg

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