MarketsandMarkets Presents Liquid Encapsulation Materials Market is projected to grow at a CAGR of 6.7% between 2015 and 2020 Browse 76 market data Tables and 105 Figures spread through 187 Pages and in-depth TOC on "Liquid Encapsulation Materials Market - Global Forecast to 2020"
Encapsulation is one of the advanced packaging processes of almost all semiconductor devices that offer low stress, low warpage, and high thermal conductivity. Encapsulation can be of two forms, namely, solid and liquid. Solid encapsulants are epoxy-molding compounds (EMC) that are a blend of solid epoxy resins, hardeners, flame retardants, fillers, and several additives. Liquid encapsulants have similar compositions, but the resin and hardener are liquid and allow the material to be directly applied onto the chip; they interconnect typically by wire bonding instead of molding. Furthermore, the encapsulants can be of three types, namely, glass, ceramic, & metal (hermetic type), plastic (non-hermetic type), and polymer (near-hermetic package (NHP)). http://www.marketsandmarkets.com/Market-Reports/liquid-encapsulation-material-market-189457289.html One of the major reasons for choosing the encapsulation technique for devices is the growing trend of miniaturization, where smaller and complex structures of devices can be managed without harming its performance. In the liquid encapsulation process, liquid encapsulant materials are implanted on the device to overcome issues such as misconnection of electrical components on devices and to ensure the proper functioning of the device.
The report describes the market trends and challenges for the global liquid encapsulation materials market and forecasts the market till 2020, on the basis of material, product, application, and geography. It also features a detailed competitive landscape which includes the identification of the key players in the global market, in addition to identifying the major strategies adopted by these players. The report provides the drivers, restraints, opportunities, and challenges for the global market. The report estimates the global liquid encapsulation materials market in terms of value and also forecasts the same for the different regions, namely, the Americas, Europe, Asia–Pacific (APAC), and Rest of the World (RoW. Ask for PDF @ http://www.marketsandmarkets.com/pdfdownload.asp?id=189457289 The major players in the global liquid encapsulation materials market are Shin-Etsu Chemical Co., Ltd. (Japan), Sumitomo Bakelite Co., Ltd. (Japan), Hitachi Chemical Co. Ltd. (Japan), Henkel AG and Co. KGaA (Germany), Kyocera Corporation (Japan), Nagase & Co., Ltd. (Japan), Nitto Denko Corporation (Japan), Panasonic Corporation (Japan), BASF Se (Germany), Sanyu Rec Co. Ltd. (Japan), Resin Technical Systems (U.K.), and Epic Resins (U.S.) among others.
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