2009 Interconnect TWG Brussels Workshop Members

1. Christopher Case (The Linde Group) Osamu Yamazaki (Sharp) Shuhei Amakawa (Tokyo Institute of Technology) Larry Smith (SEMATECH) Scott List (SRC) Michele Stucchi (IMEC) Philip Pieters (IMEC) Didier Louis (CEA-LETI) 2009 Interconnect TWGBrussels Workshop Members

2. Scope Introduction & executive summary Product drivers & interconnect roadmap progression Logic Memory More Moore vs. more than Moore Interconnect approaches Current, near term, emerging Tables Technology requirements Difficult Challenges Interconnect architectures 2D 3D Passives Reliability and performance Reliability Electromigration, dielectric breakdown, … Performance RC-delay, Power, … Process modules Introduction Dielectric Conventional low-k, PMD, airgaps, … Barrier Nucleation layers Metallization Contact, Cu, W, Al, … Etch / strip / clean surface prep., etch, … Planarization Bond pad / global contacts TSV processes Emerging interconnects Optical, CNT, graphene, wireless, … Cross-TWG interactions Modeling, metrology, yield, ESH, … 2009 Interconnect Chapter Outline