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IC 測試產業概論

IC 測試產業概論. Tsung-Chu Huang National Changhua University of Education 2008/05/21. Outline. 簡介 Moore’s Law 焦不離孟 – 封不離測 主要半導體產業策略或調查單位 XISA ITRS ITRI/IEK 全球與台灣主要封測產業概況 全球與台灣主要封測產業未來的趨勢. Introduction. Moore’s Law. 早期：

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IC 測試產業概論

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  1. IC測試產業概論 Tsung-Chu Huang National Changhua University of Education 2008/05/21

  2. Outline • 簡介 • Moore’s Law • 焦不離孟 – 封不離測 • 主要半導體產業策略或調查單位 • XISAITRS • ITRI/IEK • 全球與台灣主要封測產業概況 • 全球與台灣主要封測產業未來的趨勢

  3. Introduction

  4. Moore’s Law • 早期： • Moore's Law describes an important trend in the history of computer hardware: that the number of transistors that can be inexpensively placed on an integrated circuit is increasing exponentially, doubling approximately every two years • 每18個月增為兩倍 • 每15年增加一千倍

  5. “More than Moore’s Law”

  6. ITRS 國際半導體技術指標 • 機構 • International Technology Roadmap of Semiconductor • 各主要國家之ISA參與 • 主要任務 • 每年對半導體各細項做評估預測，開會討論後出版報告 • 常具權威性提供產學參考

  7. ITRS • TWG (Test Working Group)

  8. Semiconductor Industry

  9. Summary in ITRS2001

  10. 2008台灣IC產業產值概況 • IC四大產業：

  11. IC Packaging/TestingIndustry

  12. 6 10 ppm Y=1% D e f e c t L e Y=50% v e l Y=90% Y=99.99% 100 ppm 0 Defect Coverage 100% Defect Level ~退貨率

  13. Typical Test Procedure

  14. 自動測試機台(ATE) • ADVANTEST’s ATE:

  15. Probe Card

  16. ATE • Mount • Die Attach

  17. Advantest’s Handler

  18. Verigy’s 93000

  19. Constructing an RF ATE

  20. Displine & Corporation Research Skill & Creative Shmoos in Our Lab Hay, Wait for me…

  21. 焦不離孟 – 封不離測 • 何謂測試(IC Testing) • 何謂封裝(Packaging) • $P:$T=7:3  封當老大 • 焦不離孟、孟不離焦

  22. 全球半導體封測市場

  23. 2003-2005台灣主要封測廠商營收表現概況表

  24. 2002-2004全球前十大封測廠商

  25. 2006-2007測試產業排名

  26. 近年台灣IC產業產值概況 • 2006 • Dataquest指出，全球封測產值預估為428 億美元，2008年將達502億美元，維持穩定21% • 2007 • 記憶體產業釋單整合，預估測試產業全年產值可望較2007年成長9.3%，達到1118億元 • 2007DRAMVistia不如預期  茂德力晶等虧500億 • 2008年台灣IC產業產值年增4.4%(ITRI/IEK) • Q1:3428億元(-8.9% vs.07Q4, +0.4%vs.07Q1) • ITIS預估2008年台灣封裝業產值可達2525億元，較2007年成長 10.7%

  27. Who ATE the other half of the Pie?

  28. 台灣測試業重要指標

  29. 台灣測試業營業額比例

  30. Future Trends

  31. SoP, SiP, SoC, NoC

  32. Challenges in Future IC Test

  33. Challenges in Future IC Test

  34. ATE Cost

  35. 測試業產值

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