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Tracker Upgrade Mechanical/Thermal Engineering

Tracker Upgrade Mechanical/Thermal Engineering. 3 June meeting theme: Modules and Structures News on Phase 1 BPIX Upgrade Mechanics & Modules, R. Horisberger . S. Koenig / PSI Update on the Phase 1 FPIX Half Disk Design, S. Kwan / FNAL

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Tracker Upgrade Mechanical/Thermal Engineering

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  1. Tracker Upgrade Mechanical/Thermal Engineering 3 June meeting theme: Modules and Structures News on Phase 1 BPIX Upgrade Mechanics & Modules, R. Horisberger. S. Koenig / PSI Update on the Phase 1 FPIX Half Disk Design, S. Kwan / FNAL Phase 1 FPIX Mechanics - Plans for module assembly, K. Arndt / Purdue Phase 2 Outer Tracker Module analysis, S. Kyre / UCSB TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  2. BPIX module design • Reduction / optimisation of components from present version TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  3. BPIX prototypes and test structures • Barrel model structure in carbon-fibre • Module support with clamps • Thermal tests due to start in PSI, Lyon, CERN TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  4. Simon Kwan, Fermilab on behalf of the USCMS Pixel Mechanics R&D group FPIX Outer half-disk • Present Planned Phase 1 Inner half-disk MODULE LAYOUT • 12 identical half-disks • only 2x8 modules • One 2x8 module placed on each side of a substrate for all outer and inner radius blades • Substrate uses Thermal Pyrolytic Graphite – material with excellent in-plane thermal conductivity TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  5. Simon Kwan, Fermilab on behalf of the USCMS Pixel Mechanics R&D group FPIX 3.0 mm thick CC ring for cooling and support uses • Outer (inner) half-disk assembly with Edge Cooling Concept Ss tubing One piece ring made of CC 0.7 mm thick carbon fiber ring for support uses only Machined groove to house tubing Cf skin to enclose the tubing TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  6. Simon Kwan, Fermilab on behalf of the USCMS Pixel Mechanics R&D group FPIX • Half-disk assembly with Edge Cooling Concept ∆T = 5.2C across model ∆T = 3.4C Across sensor 0.06 cf + 0.88 TPG + 0.06 cf Blade 150% heat load, 7.3W per blade; sensor: 0.6 W; ROC: 6.7 W Configuration (1) Heat sink on outer edge only HDI being the outermost within module Cf supporting spokes TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  7. Kirk Arndt, Purdue on behalf of the USCMS Pixel Mechanics R&D group FPIX HDI pigtail • Module development – Various Integrated Module/Panel Concepts under study, here one example • Equipment for automated module assembly under development 2x8 BBM TPG HDI TBM TPG 2x8 BBM TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  8. Kirk Arndt, Purdue on behalf of the USCMS Pixel Mechanics R&D group FPIX • Requirements for adhesive: • Thermal conductivity: > 0.2 W/m-K • Soft: shear modulus < 50 N/mm^2 • Conformable to 50 micron non-flatness • Radiation hard • Electrically non-conductive • Curing at room temperature • Not flowing during application: adhesive confined within chip • Good wetting properties • Not creeping after curing • Allow integrated module replacement without damaging the support • Status • Begun a market survey of adhesives for pixel integrated module assembly with potential to meet requirements for SLHC (including adhesives used in current LHC detectors – ALICE, ATLAS, CMS, LHCb and TOTEM) • 6 primary candidate adhesives selected for further testing so far • Building mechanical grade samples using candidate adhesives for evaluation of mechanical properties before and after irradiation • Module development - Adhesives study FPIX adhesive sample for tensile testing after irradiation TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  9. Phase 1 FPIX Time-scale and milestones USCMS Pixel Mechanics R&D group • Module and disk conceptual design and studies are ongoing  baseline conceptual mechanical and electrical design this summer. • Small prototype development for testing will follow. • Goal to build full-scale prototypes for thermal and mechanical tests in early 2010. Time scale for Phase 1 TDR (Spring 2010) TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  10. Phase 2 Outer Modules Susanne Kyre, UCSB • First thermal analysis based on module design shown in April 09 tracker week • This is the start, and too early to refer to the first results. Need to work on module and support geometry, materials, power of components, cooling contacts, etc. • Bonding tests (inclined and long bonds) planned at UCSB TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  11. Summary • Design of Phase 1 BPIX and FPIX modules and structures advancing well. • Important gains (~ factor 2) in material budget seem achievable • BPIX design: basic concept same as in present detector, but important changes in support design, cooling pipe. • Prototyping of BPIX structures on-going, thermal tests about to start • Cooling pipe to structure gluing requires verification (common topic within the Tracker) • FPIX design: important changes in the mechanics concept: outer/inner disk, edge cooled modules. • Many details to be worked out, and prototyped, but seems in good track. • Performance of the edge cooling to be tested. • Module – coolant deltaT’s likely to be different in BPIX and FPIX due differences in cooling pipe position vs. modules • Is this a problem? • Work on the Phase 2 outer module mechanical/thermal engineering started TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

  12. On the Tracker-wide Mechanical/Thermal Engineering • Need to ensure coherent references on requirements (thermal, precision/accuracy), choice of materials (glues, cooling pipes, …), quality control, etc. • A lot of experience and know-how within the collaboration (and within other similar projects) – enhance communication and organization of documentation • Common entry web page(s) pointing to group pages. Email lists. • 1 &2 to be tackled by the Tracker Upgrade Engineering coordinators: A. Onnela, H. Postema, K. Arndt, R. Schmitt, S. Koenig • Tracker-wide Mechanical/Thermal Engineering meetings to be held every two months • Within ‘Tracker monthly’ or other suitable • We too need afternoon slots! • Tracker Upgrade Project Office (D. Abbaneo, S. Kwan) meets weekly/bi-weekly, and calls sessions on specific topics, including engineering. TK Upgrade Workshop June 09, Summary on Engineering / A.Onnela

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