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Lect 09: Memory and I/O Interface and Memory Devices. Memory Interface Circuitry. Memory interface block diagram See Fig 9.25 on page 398 Address latches and buffers ALE (Address Latch Enable) enable-to-output propagation delay (ex: 74F373: 13 ns)

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Lect 09: Memory and I/O Interface and Memory Devices


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    1. Lect 09: Memory and I/O Interface and Memory Devices

    2. Memory Interface Circuitry • Memory interface block diagram • See Fig 9.25 on page 398 • Address latches and buffers • ALE (Address Latch Enable) • enable-to-output propagation delay(ex: 74F373: 13 ns) • 74F373, 74F374 : See Fig 9.26, Fig 9.27, Fig 9.28 • Buffering effect : • 386 address lines can sink only 4 mA • F373 latch can sink a maximum of 24 mA

    3. Memory interface block diagram

    4. 74F373 (Octal D-type Latches with 3-state output)

    5. 74F373 Data Sheet

    6. 74F373 Data Sheet

    7. 74F374 (Octal D-type Flip-Flops with 3-state output)

    8. Memory Interface Circuitry • Data Bus Transceivers • DT/R (data transmit/receive) ; DEN (data bus enable) • 74F245 : See Fig 9.30, Fig 9.31 • propagation delay : 7 ~ 8 ns • Buffering Effect: • 386 data lines : 4mA • F245 : 64 mA

    9. Memory Interface Circuitry • Address Decoders • 74F139 dual 2-line-to-4-line decoder • 74F138 single 3-line-to-8-line decoder • Bus Control logic • System Controller • PLAs, GALs, and EPLDs • PALs : bipolar technology - burning out fuse links GALs : CMOS technology - electrically erasable read-only memory (EEROM) EPLDs : CMOS technology - electrically programmable read only memory (EPROM)

    10. Input/Output • Isolated Input/Output • Isolated I/O space : See Fig 9.47 • page 0 : 0-255 ; direct access • Advantages • Full memory space • Special Instructions - maximize I/O performance • Disadvantages • Restricted Instruction Power • Separate I/O control signals

    11. The Isolated I/O Interface

    12. The Isolated I/O Interface

    13. Memory Mapped Input/Output • Memory mapped I/O • Advantages • Powerful Instruction set • No I/O control signals • Disadvantages • Part of Memory space is lost • the memory instructions tend to execute slower than those specially designed for isolated I/O

    14. Memory Devices and Subsystem Design • Memory Subsystem Design Read-only Memory Random access read/write memories FLASH memory Wait-state Circuitry Cache memory Cache controller • Read-Only Memory • ROM, PROM, EPROM • ROM BIOS(Basic Input/Output System) • Read Operation : See Fig 10.4 • Standard EPROM ICs : See Fig 10.6, 10.7, 10.9

    15. Read-Only Memory

    16. 27C256 ROM Data Sheet

    17. 27C256 ROM Data Sheet

    18. RAM • Random Access Read/Write Memories • Static and Dynamic RAMs • SRAM • DRAM : refreshing • Static RAM • Block Diagram and Standard SRAM ICs : See Fig 10.11, 10.12, 10.13, 10.16 • Read/Write Operation : See Fig 10.17, 10.18

    19. Block Diagram and Standard SRAM ICs

    20. Standard SRAM ICs

    21. Read/Write-Cycle Timing

    22. Dynamic RAM • Dynamic RAM • Standard DRAM ICs : See Fig 10.19, 10.20, 10.21 • Block Diagram of DRAM : See Fig 10.21, 10.22 • Read/Write Operation

    23. Block Diagram of DRAM

    24. Read/Write-Cycle Timing

    25. Reading Assignment • Read Chapter 10 • Flash Memory • Cache Memory • Cache Controller