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MSP430 & Cortex Motor Driver

MSP430 & Cortex Motor Driver. LT Thomas TJ Volinski Pat O’Hara Kole Reece. Outline. Background Information DRV8824 MSP430 Stellaris (Cortex M3) Software Proposed Solution Budget Fabrication and Assembly Risk Analysis Agenda. Project Overview. DRV8824EVM

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MSP430 & Cortex Motor Driver

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  1. MSP430 & Cortex Motor Driver LT Thomas TJ Volinski Pat O’Hara Kole Reece

  2. Outline • Background Information • DRV8824 • MSP430 • Stellaris (Cortex M3) • Software • Proposed Solution • Budget • Fabrication and Assembly • Risk Analysis • Agenda Design Team 6

  3. Project Overview • DRV8824EVM • Max Drive Current 1.6 A • Dual Motors Control • MSP430 and DRV8824 IC • Protective Features • Over Current • Short Circuit Protection • Temperature Protection • Applications • ATM, Printers, • Handling Machines Video Security Cameras, Printers, Scanners Design Team 6

  4. DRV8824 • H-Bridge Structure (Dual Bridges) • MOSFET Implementation • Pulse Width Modulated Current Regulation • Switching Frequency 500kHz • Problem Modularity. More Robust Design Needed! Design Team 6

  5. MSP430 • Mixed Signal 16-bit RISC MCU • Low cost, Low Power embedded systems • 8MHz Clock • 55KB Flash • 5KB RAM • 5 Power SavingModes Design Team 6

  6. MSP430 Design Team 6

  7. Stellaris(Cortex M3) • ARM architecture allowsfor low power embeddedelectronics • Thumb 2 instruction set • 32-bit RISC MCU • 80MHz Clock • 256KB Flash • 96KB SRAM Design Team 6

  8. Software Background • Code structured to enable any chip to be used • Uses RS232 standard to communicate with microcontroller • PC connects to DIMM through USB • Sends signals such as direction, step, and mode Design Team 6

  9. Proposed Solution • Removal of MSP430F1612 and definition of DIMM ports Design Team 6

  10. Proposed Solution • Design of MSP430F1612 control card • Map pins between MSP430 and Cortex • Port MSP430 code to Cortex M3 Analog GPIB RS232 PWM JTAG Design Team 6

  11. Budget Design Team 6

  12. Fabrication • 4 - Layer Board • Top and Bottom Layer Traces • Ground Layer • Kelvin • Drill holes, Contacts, and Labels • 4PCB Company Quote: Design Team 6

  13. Assembly • Bill of Materials - $55.97 for DIMM and DRV • SSOP IC’s (Surface Mount) on DRV • LQFP IC on the DIMM • ECE Shop will assemble only as low as SSOP • OneStopAssembly Quote: Design Team 6

  14. Risk Analysis Design Team 6

  15. Agenda Design Team 6

  16. Questions? Design Team 6

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