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MHI#16 号機の2回目の EP2 - PowerPoint PPT Presentation


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MHI#16 号機の2回目の EP2. Period : 2011/5/10 ~ 5/16 Process : CP @flanges, EP2(5 μ m) under low current density, Improved 1 st Water Rinsing, Brushing @HOM & Flange using FM-20, Degreasing(FM-20, 2%) [1hour], Brushing @Flange, HPR x 2 [10 hours], Assembly in C.R., Vacuum evacuation,

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mhi 16 ep2

MHI#16号機の2回目のEP2

Period : 2011/5/10 ~5/16

Process : CP @flanges, EP2(5μm) under low current density, Improved 1st Water Rinsing,

Brushing @HOM & Flange using FM-20, Degreasing(FM-20, 2%) [1hour],

Brushing @Flange, HPR x 2 [10 hours], Assembly in C.R., Vacuum evacuation,

Leak check, Baking @100℃ (48hours)

Preparation : Washing vacuum components with ultrasonic, Cleaning in C.R.

Workers : M. Sawabe, Kirk, M. Satoh (KEK),

K. Nakamura, N. Tasaki, F. Tsukada (Assist Engineering Co.),

T. Okada (K-VAC),

M. Asano, S. Imada, T. Yanagimachi (Nihon Advanced Technology)

Process log

Status of working

Monitor data during EP & Rinsing process

Comparison of EP2

STF Cavity Group Meeting @2011/5/16

Kirk

condition of ep2 rinsing
Condition of EP2 & Rinsing

EP2を1~2回行ったぐらいではたいして変化しない

  • EP acid (4/20のサンプルを使用)
      • Nb ingredient : 9.6g/ℓ
      • HF ingredient : 25 g/ℓ (全体34g/ℓの65%が反応に使われる)
      • Al ingredient : 18mg/ℓ
      • Current density : ~37mA/cm2 (最近の傾向より)
      • Cavity surface temperature : <35℃
      • Control Voltage : 温度と電流密度を見ながら制御
      • With normal N2 gas flow during extracting EP acid (8ℓ/min)
  • 1st water rinsing (1.5hours)
      • Improved version (25ℓ/minで20分間上下から流し続ける)
      • 1分毎に1秒間水抜きを繰り返す(40分間)
      • 最後の30分は10min (storing)/3min (flushing)で行う
  • Degreasing (1 hour)
      • FM-20(2%)
  • HPR (~10 hours)
      • 5h17m (6 turns, w/o blind flanges)
      • 4h23m (5 turns, w/ blind flanges)

Brushing @HOM & Flange

using FM-20

Brushing @Flange

using FM-20

STF Cavity Group Meeting @2011/5/16

process log
Process log ①

5/10 9:40 Check every flange / Polishing input port by scotch bright

9:55~ Attachment of jigs for EP

10:17 HPR operation starts without cavity

10:44 Set cavity to EP bed with crane

11:00 Installation of cathode bar to cavity [O.K.]

11:04 Meeting for tomorrow’s working procedure

11:12 Set data logger to cavity (totally 12ch)

11:30 Leak check with N2 gas [O.K.]

12:00 Lunch time

13:20 HPR operation stops

Preparation for EP is completed

14:00~ Vacuum parts rinsing with ultrasonic in C.R.

15:30 fin.

STF Cavity Group Meeting @2011/5/16

process log1
Process log ②

5/11 10:10 Cavity rotation starts / EP acid flow starts

10:30 EP2 starts

10:47 EP2 stops [17m00s] / Idling rotation (3 rpm / 20min) / Plastic case detachment

11:07 Idling rotation stops

11:10 EP acid is removed from cavity with N2 gas flow(0.020MPa)

11:23 First rinsing with ultra pure water starts

12:54 First rinsing with ultra pure water stops [1h30m]

13:00 Detachment of restriction jigs / Data logger detached

13:20 Un-installation of cathode bar from cavity / washing cathode bar (No black mark)

13:28 transferring cavity from EP bed to wagon / Checking inside cavity [O.K.]

13:50 Detachment of jigs for EP / Detaching every blind teflon flange

/ Checking inside cavity (white mark is found at cell#9)

14:00 Brushing at every flange and HOM couplers using FM-20 / Shower rinsing

14:10Checking inside cavity (white mark is found at cell#9)

14:13 Attachment of flanges for degreasing

14:23 Flowing FM-20 into cavity

14:27 Degreasing with ultrasonic starts

15:27 Degreasing with ultrasonic stops [1hour]

15:30 Removing FM-20 from cavity

15:40 Detachment of flanges for degreasing

Checking inside cavity (white mark is found at cell#9)

15:45 Brushing at every flange using FM-20 / Shower rinsing

STF Cavity Group Meeting @2011/5/16

process log2
Process log ③

5/11 16:00 Transferring cavity from wagon on turntable for HPR using crane

16:05 Checking tolerance between position of nozzle and center of beam pipe

16:19 1st HPR for inside cavity starts

21:35 1st HPR for inside cavity stops [5h17m] (6 turns)

21:40 Attaching every blank flange in C.R.

22:09 fin.

5/12 9:08 HPR outside cavity with blind flanges starts [15mins]

9:24 2nd HPR for inside cavity with blind flanges starts

13:47 2nd HPR for inside cavity with blind flanges stops [4h23m] (5 turns)

13:55 Cavity enters into C.R.

14:35 Assembly in C.R. (Class 10) starts

16:20 Assembly in C.R. (Class 10) finishes / Moving out from Class10 to Class1000

16:34 Vacuum evacuation starts with heat guns

16:45 Turbo pump status 100%

17:15 Leak check thoroughly @~2.0x10-3Pa

 Leak occurred at three ICF gaskets around bellows (Too low quality again!!!)

 Re-tightening screws / stop the leak / Re-leak check  O.K.

17:45 Baking @100℃ starts

Max Vacuum Level just after baking start : ~1.20 x 10-3Pa

18:17 Cavity vacuum : 1.08 x 10-3Pa @76℃/81℃/50℃/60℃/48℃/53℃/19℃

(Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

19:55 Cavity vacuum : 3.78 x 10-4Pa @100℃/104℃/86℃/85℃/?℃/79℃/19℃

(Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

STF Cavity Group Meeting @2011/5/16

process log3
Process log ④

5/13 12:00 Cavity vacuum : 3.31 x 10-5Pa @100℃/105℃/89℃/100℃/87℃/90℃/21℃

(Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

5/14 17:25 Cavity vacuum : 2.61 x 10-5Pa @100℃/105℃/88℃/100℃/86℃/97℃/22℃

(Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

17:30 Baking Off

17:43 Ion Pump ON

17:50 Cavity vacuum : 2.20 x 10-6Pa @82℃/86℃/?℃/71℃/78℃/90℃/22℃

(Cell#3/Cell#7/Top/Bottom/Input/Probe/Room)

5/16 8:50 Cavity vacuum : 0.99 x 10-7Pa @22℃ (0.0 x 10-8Pa @I.P.)

9:30 MHI#16 moves to V.T. stand

STF Cavity Group Meeting @2011/5/16

mhi 16
MHI#16号機で見つかった白い模様

2回目のEP2後

1回目のEP2後

STF Cavity Group Meeting @2011/5/16

slide8
色々な空洞で見つかった白い模様

MHI#14号機の1回目のEP2後

MHI#15号機の2回目のEP2後

MHI#16号機の2回目のEP2後

STF Cavity Group Meeting @2011/5/16

slide9
最近よく起こるICFのリーク箇所

STF Cavity Group Meeting @2011/5/16

slide10
今回の組み立て中に見つかった不良のヘリコフレックス今回の組み立て中に見つかった不良のヘリコフレックス

スズメッキ

インジウムメッキ

STF Cavity Group Meeting @2011/5/16

status of 2 nd ep2 for mhi 16
Status of 2nd EP2 for MHI#16 ①

Tcavity

voltage [V]

voltage

current

Treservoir

Troom

Tcavity

平均電流密度が37mA/cm2程度になるように電圧を調整する。

(low current density EP)

average current density [mA/cm2]

average current density

STF Cavity Group Meeting @2011/5/16

status of 2 nd ep2 for mhi 161
Status of 2nd EP2 for MHI#16 ②

左図は平均電流密度と電圧の相関

右図は定常状態での分布

target

STF Cavity Group Meeting @2011/5/16

slide13
最近の定常状態の比較

今回は研磨量が5μmと少ないためドリフトの影響が少ない。

STF Cavity Group Meeting @2011/5/16

status of 2 nd ep2 for mhi 162
Status of 2nd EP2 for MHI#16 ③

EP2の間の空洞表面温度の状況。

#1

#2

#3

#4

#5

#6

#7

#8

#9

#10

#11

#12

STF Cavity Group Meeting @2011/5/16

Steady state: 34.0 29.0 31.4 29.1 30.6 28.1 25.4 31.1 29.7 28.7 28.9 11.3

status of 2 nd ep2 for mhi 163
Status of 2nd EP2 for MHI#16 ④

EP2の間の空洞表面温度の状況(前ページの最後の拡大図)。

#1

#2

#3

#4

#5

#6

#7

#8

#9

#10

#11

#12

STF Cavity Group Meeting @2011/5/16

status of uwr for mhi 16
Status of UWR for MHI#16 ①

通信不良によるデータの跳びが最後になって急増した。

#1

#2

#3

#4

#5

#6

#7

#8

#9

#10

#11

#12

STF Cavity Group Meeting @2011/5/16

Steady state: 20.8 19.8 20.7 18.7 18.9 19.2 19.1 19.8 19.0 19.3 19.8 18.0

status of uwr for mhi 161
Status of UWR for MHI#16 ②

一次洗浄中の空洞温度の状況(前ページの拡大図)

#1

#2

#3

#4

#5

#6

#7

#8

#9

#10

#11

#12

STF Cavity Group Meeting @2011/5/16

status of uwr for mhi 162
Status of UWR for MHI#16 ③

①は最初の注水完了時。

②は流量を増やした状態での洗浄中。

③は流量を戻した状態での洗浄中。

STF Cavity Group Meeting @2011/5/16

status of hpr for mhi 16
Status of HPR for MHI#16

ノズルは1st HPRでは6往復、2nd HPRでは5往復させた。

2回目はTOC、Particle共に、最良の状態に戻っている。

STF Cavity Group Meeting @2011/5/16