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Open Book, Open Note 3-4 Multipart Questions

Open Book, Open Note 3-4 Multipart Questions. Business Processes Organization and Roles Annual Business Cycles and Processes Standard, Performance Requirement Types Sales, CM, OM and Net Income Business Cases for New Product Development Design Inputs, Design Outputs and Reviews

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Open Book, Open Note 3-4 Multipart Questions

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  1. Open Book, Open Note 3-4 Multipart Questions • Business Processes • Organization and Roles • Annual Business Cycles and Processes • Standard, Performance Requirement Types • Sales, CM, OM and Net Income • Business Cases for New Product Development • Design Inputs, Design Outputs and Reviews • Verification and Validation • Product Program Milestones and Process

  2. Requirements, Flowdown, Block Diagram • Aspects of Good Requirements, Poor Requirements • Validation and Verification • Standard Requirements • Performance Requirements • Allocation and Margin • Association • External Interfaces • Block Requirements and Bl-Bl Interfaces • Analog, Digital and Power Interface Signal Requirements

  3. Electromagnetic Compliance & Global Power • Nominal Voltage & Frequency vs Country • Robust Operational Ranges of Voltage and Frequency • EMC Certification, Engineering Tests and Technical Justifications • Emission Tests and Limits • CISPR11 Radiated and Conducted E Field Emission • EN61001-3-2 Powerline Harmonic Emission • EN61001-3-3 Voltage Fluctuation and Flicker Emissions • Susceptibility Tests • Standard Response Levels, Classifications • EN61000-4-2 Electrostatic Discharge Stress • EN61000-4-3 Radiated E-Field Stress • EN61000-4-4 Electrical Fast Transient Stress • EN61000-4-5 Power Surge Stress • EN61000-4-6 RF Conducted Electrical Stress • EN61000-4-8 Power Frequency B-Field Stress • EN61000-4-11 Power Dropout, Variation Stress

  4. Safety • Test Labs, Standards Bodies and Government Agencies • Common Hazards • NEC • Underwriters Labs • CSA • ISO • IEC • US Government Departments & Applicable Agencies • US DoD Organization • Common Applicable Standards, MIL-STDs, UL-STDs • CE Mark • Key Aspects of Product Safety, Electrical, Mechanical, EHS

  5. Prototyping Systems • Methods • Breadboard • Wirewrap • Perfboard with and without pads • Deadbug • PCB’s handmade transfer, photolitho and outsourced • Guidelines • Soldering • Substrates & Boards • Overall Prototyping Systems and Limitations • Thru Hole vs SMT Packages • Sockets, Interconnection Systems

  6. Analog Design For Mass Production • Op Amp Basic Inverting, Non-inverting configurations, Nom Gains • Op Amp Vio, Iio, Ib, Ad, Ac, CMRR, Slew Rate • DC Errors caused by Vio, Iio, Ib • Gain Errors caused by Ad • Total Error Voltage and Effects of Resistor Tolerance • Slew Rate Distortion • Op Amp max Vout, Iout • Basic frequency response circuit analysis • Finding Av(s) from circuit analysis • Steady State Response Av(jw) • Finding Mag |Av(jw)|, Phase |Av(jw)|, from Av(s) • Discrete Component Specification • Noise Sources & Analysis • What types of Analysis are Required or Suggested for Subcircuits

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