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Report from Module Bonding Working Group

Report from Module Bonding Working Group. Salvatore Costa Universit à di Catania and INFN – Sezione di Catania. Outline. Global info on production bonding of the Modules Global review of Module bonding quality indicators Open issues Selected highlights from individual Center reports.

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Report from Module Bonding Working Group

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  1. Report fromModule BondingWorking Group Salvatore Costa Università di Catania and INFN – Sezione di Catania

  2. Outline • Global info on production bonding of the Modules • Global review of Module bonding quality indicators • Open issues • Selected highlights from individual Center reports

  3. Global review of Module bonding qualitythat is,Module Pull Test results

  4. # Modules Pull Tested

  5. Mean pull forces

  6. Mean pull forces

  7. StDev/Mean of pull forces

  8. StDev/Mean of pull forces

  9. Open issues

  10. Hybrid-related issues • Bonding problems on PA encountered while bonding APV’s to PA in some TIB hybrids [mentioned by Alan/Gabriella] • Display additional warning in Pre-bonding section of DB Interface • Faulty hybrids, with intermittent FHIT errors, erroneously sent to CERN from HAS, then to Gantry Centers and some already built into modules. [mentioned by Gabriella] • All Gantry and Bonding/Testing Centers alerted • I plan to generate from DB and distribute affected Module list

  11. ModProd DB Browser Tool At Gian Mario’s request, non-prod quality objects (modules, sensors, hybrids) now excluded:

  12. Jigs for TEC Module bonding We are continuing to monitor the preparation of attidional jigs for Center backup in TEC. This is a table already showed at last Meeting, but with updates added yesterday.

  13. Selected highlights fromindividual Center Reports

  14. Catania: new facilities • New bonding machine: Delvotec 6400 (100 kHz) • Since March 8th • Oldest of 2 Hughes dismissed • Now in clean room: Delvotec, newest of 2 Hughes • Bonding times down: • TIB34: 8’ 10”vs. 45’ + x • TIB12: 12’ 15”vs. 65’ + x • Backs: 15”vs. 1’ + x • Reliability improved: • Machine failure rate: negligible • Bonding failures: negligible • PHL- (DEAD) channels: none so far • Experience: • 45 modules bonded w/ new machine • Programs for all module types ready: TIB34, TIB12, TIB12sl, TIB12sr (back/front/pulltest/after_pulltest) • Usable bonding parameters window narrower than in Hughes • Best Pull forces achieved: ~10g • New operators • 2nd operator fully trained since last meeting already. • 3rd operator: Russian engineer with temporary contract.

  15. Catania’s Delvotec 6400

  16. Other Center’s highlights • FNAL: Last 2 weeks found problems related to excessive flex of PA ends. Had to ask assemblers to move glue points. This helped but not yet satisfactory. • Firenze: In some latest TIB modules dirty area of PA near end (but not at end) made bond difficult there. • Padova: Uploaded pull test data after shipping modules to Pisa  usual DB problem: pull test appears performed in Pisa • recommendation: upload all of your data before shipping modules to another center • Torino: Due to share with Alice had to change Delvotec’s U/S frequency from 100 to 60 kHz. New parameters. Similar performance. • Vienna: Bonded 25 modules with new Delvotec 6400 (140 kHz). Pull forces were marginally better than 100kHz. Observes whiskers on 2nd bond (on PA). • Zurich: Machines now equipped with additional USB camera (+ PC) to ease the strain of looking all the time through microscope during bonding. Model details available.

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