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Global Review and Insights on Module Bonding Quality and Challenges from Bonding Working Group

This report presents a comprehensive overview of module bonding production from the Bonding Working Group led by Salvatore Costa at Università di Catania and INFN Sezione di Catania. It includes global insights on quality indicators, recent production issues, and highlights from individual center reports. Key topics covered are module pull test results, bonding challenges in hybrid modules, and equipment updates. The report emphasizes the importance of quality control and ongoing monitoring while detailing improved bonding times and enhanced machine reliability across various facilities.

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Global Review and Insights on Module Bonding Quality and Challenges from Bonding Working Group

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  1. Report fromModule BondingWorking Group Salvatore Costa Università di Catania and INFN – Sezione di Catania

  2. Outline • Global info on production bonding of the Modules • Global review of Module bonding quality indicators • Open issues • Selected highlights from individual Center reports

  3. Global review of Module bonding qualitythat is,Module Pull Test results

  4. # Modules Pull Tested

  5. Mean pull forces

  6. Mean pull forces

  7. StDev/Mean of pull forces

  8. StDev/Mean of pull forces

  9. Open issues

  10. Hybrid-related issues • Bonding problems on PA encountered while bonding APV’s to PA in some TIB hybrids [mentioned by Alan/Gabriella] • Display additional warning in Pre-bonding section of DB Interface • Faulty hybrids, with intermittent FHIT errors, erroneously sent to CERN from HAS, then to Gantry Centers and some already built into modules. [mentioned by Gabriella] • All Gantry and Bonding/Testing Centers alerted • I plan to generate from DB and distribute affected Module list

  11. ModProd DB Browser Tool At Gian Mario’s request, non-prod quality objects (modules, sensors, hybrids) now excluded:

  12. Jigs for TEC Module bonding We are continuing to monitor the preparation of attidional jigs for Center backup in TEC. This is a table already showed at last Meeting, but with updates added yesterday.

  13. Selected highlights fromindividual Center Reports

  14. Catania: new facilities • New bonding machine: Delvotec 6400 (100 kHz) • Since March 8th • Oldest of 2 Hughes dismissed • Now in clean room: Delvotec, newest of 2 Hughes • Bonding times down: • TIB34: 8’ 10”vs. 45’ + x • TIB12: 12’ 15”vs. 65’ + x • Backs: 15”vs. 1’ + x • Reliability improved: • Machine failure rate: negligible • Bonding failures: negligible • PHL- (DEAD) channels: none so far • Experience: • 45 modules bonded w/ new machine • Programs for all module types ready: TIB34, TIB12, TIB12sl, TIB12sr (back/front/pulltest/after_pulltest) • Usable bonding parameters window narrower than in Hughes • Best Pull forces achieved: ~10g • New operators • 2nd operator fully trained since last meeting already. • 3rd operator: Russian engineer with temporary contract.

  15. Catania’s Delvotec 6400

  16. Other Center’s highlights • FNAL: Last 2 weeks found problems related to excessive flex of PA ends. Had to ask assemblers to move glue points. This helped but not yet satisfactory. • Firenze: In some latest TIB modules dirty area of PA near end (but not at end) made bond difficult there. • Padova: Uploaded pull test data after shipping modules to Pisa  usual DB problem: pull test appears performed in Pisa • recommendation: upload all of your data before shipping modules to another center • Torino: Due to share with Alice had to change Delvotec’s U/S frequency from 100 to 60 kHz. New parameters. Similar performance. • Vienna: Bonded 25 modules with new Delvotec 6400 (140 kHz). Pull forces were marginally better than 100kHz. Observes whiskers on 2nd bond (on PA). • Zurich: Machines now equipped with additional USB camera (+ PC) to ease the strain of looking all the time through microscope during bonding. Model details available.

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