Ryan Rivers rdrivers@eecs.berkeley (510) 809-8627

1. Processing Ryan Rivers rdrivers@eecs.berkeley.edu (510) 809-8627 Jeff Clarkson jclarks@berkeley.edu (510) 809-8628 Richelieu Hemphill rhemp@eecs.berkeley.edu (510) 809-8615 Kim Chan kim@eecs.berkeley.edu (510) 809-8631 Marilyn Kushner marilyn@eecs.berkeley.edu (510) 809-8629

2. Research Community Commitment Community Communication Assistance Awareness

3. Nanolab Engineers Process and Equipment engineers are here to assist you Each tool has assigned engineers Process/Equipment Engineer 1 is in charge of that equipment Process Engineer 1 approves special processes on equipment

4. Plan Your Work ! Time = Money Some tools are heavily reserved Plan ahead one week – minimize idle time

5. Working in the NanoLab Nanolab Rule #1: NEVER WORK ALONE 3rd to last person to leave must go notify the other two!

6. Working in the NanoLab Entrance Checklist: • Passed the Safety Quiz • There are no announcements preventing lab access • The HazMat alarm is not active • Have blue shoe covers on • No food or drink on person

7. Gowning Procedure: Top Down Bouffant Cap Bunny Suit Shoe Covers Enter Gowning Shoe Covers Gloves Safety Glasses Complete De-gowning occurs in reverse order

8. Entering the Lab Area Gowning Checklist: • No chemicals in storage box • Safety Glasses on • Name tag visible on coverall • Changed damaged or stained coveralls/shoes/other gear • Using proper size coverall and shoe cover • Log on at the computer terminal before entering lab

9. Equipment Qualification Complete Prerequisite Requirements Read the Manual Get Training (Any Qualified Member) Take Equipment Test (520 SDH Front Desk) Oral Qualification (Superuser) When in doubt – ASK STAFF

10. Complete Prerequisite Qualifications • Many equipment sets have prerequisite qualifications and/or classes offered by staff • Evaporation, SEM, E-beam Litho, and confocal microscopy classes are offered periodically • Some toolsets have gateway tools (e.g. msink 6/8, tystar1-4, Leo SEM)

11. Read the Manual All major equipment has a lab manual on website Process engineers update manual – send any suggestions to us! Manual inconsistencies are reported on Mercury as process faults

12. Training – All qualified can train! Check reservations for the tool Find a member using equipment E-mail: <membername>@silicon.eecs.berkeley.edu Request to observe run and get training Each One Teach One – Train someone at least 1x per semester

13. Take Equipment Test Equipment tests available at 520 SDH (Front Desk) Usually available online via Mercury Specific tests are written only – copies at front desk

14. Oral Qualification – Superuser Only Check Mercury for superuser names/email E-mail: <membername>@silicon.eecs.berkeley.edu Request qualification. Make reservation with superuser Sometimes process staff are the only superusers

15. Quality Monitoring • Quality Monitor tracks processes • Data is posted monthly on MercuryWeb

16. Quality Monitoring • Quality monitor reports show valuable data trends • Reports also show standard process conditions for the monitor

17. Material and Process Compatibility • The Nanolab is a diverse processing environment • Nanolab materials restrictions are as open as possible • Many processes are very sensitive (e.g., Sinks/Furnaces) • Duplicate process capability allows separation of materials • Materials restrictions are given by tool and group • Materials restricted by: • Substrate, Process, and Maintenance

18. The Lab Manual

19. Ch 1 - Material and Process Compatibility • Chapter 1.7 – Furnace pre-clean & substrate restrictions • Equipment manuals define material compatibility/cleaning • Every piece of equipment has specific material restrictions • Several equipment may have group contamination protocols • Specific tools and processes require specific cleaning

20. Ch 1 - Material and Process Compatibility

21. Ch 2 - Sink Information / Restrictions

22. Ch 2 - Working at the Sinks • PPE must be worn when working at the sinks! • Chemically resistant gloves • Face shield • Chemically resistant apron

23. Ch 2 - Working at the Sinks • Mixing chemistry can get HOT! • Always use caution when adding chemicals and be aware of exothermic reactions • Working at general purpose sinks (MSink16/18) • You MUST be qualified • Describe your processes to each other • Process Tag all work at the station • Do not heat up a solvent directly on the heater chuck

24. Ch 2 - General Wet Chemistry Cabinets • Located in 582A, 381/383 • Standard chemicals available to members at no charge • Special chemical storage needs pre-approval and label • Use partial bottles first! If empty – ask staff to restock

25. Ch 2 - Changing Organic Bottles

26. Ch 2 - Chemical Waste ManagementLog Sheet Every pour requires an entry with a volume!

27. Ch 3 - Mask Making at MNL MNL provides in-house mask making • L-Edit Layout Software • GCA 3600 Pattern Generator • Refer to MNL Chapter 3 for complete details • Contact Process Engineer Jeff Clarkson for assistance

28. Ch 4 - Photolithography Equipment Crestec CABL 9510 E-Beam Typical Resolution: 40 nm Minimum Resolution :10 nm PE1: Kim Chan EE1: Greg Mullins ASML 5500/300 4X DUV Stepper Typical Resolution: 0.35 um Minimum Resolution: 0.25 um PE1: Jeff Clarkson EE1: Greg Mullins GCA 8500 5X i-Line Stepper Typical Resolution: 0.8 um Minimum Resolution: 0.6 um PE1: Jeff Clarkson EE1: Greg Mullins Quintel Q4000 Mask Aligner Typical Resolution: 2.5 um Minimum Resolution: 1.0 um PE1: Kim Chan EE1: Greg Mullins Karl Suss MA6 Mask Aligner Typical Resolution: 2.5 um Minimum Resolution: 1.0 um PE1: Kim Chan EE1: Greg Mullins Canon 4X Projection MA Typical Resolution: 1.5 um Minimum Resolution: 1.0 um PE1: Kim Chan EE1: Greg Mullins

29. Ch 5 - Furnaces – AP and LPCVD Tystar 5-7, Dry/Wet Ox, Dopant Diffusion, Anneal, 4”, 6” & 8” wafers Tystar 13-16, Dopant Diffusion, SiC, poly-Si, a-Si, 4” & 6” wafers Tystar 1-4, Dry/Wet Ox, Anneal, Sinter, 4” & 6” wafers Tystar 9-12, Nitride, poly-Si, a-Si, Low-Temp Oxide, 4” & 6” wafers 1. Furnaces are divided into MOS & non-MOS. 2. Substrates must be cleaned before furnace use. Last pre-furnace step: Msink6 for non-metal substrates, and, Msink1 for metal substrates going into metal approved furnaces. 3. III-V compounds are not allowed in any furnace. Tystar 17-20, Nitride, Hi-Temp Oxide, Sinter, Si-Ge, 4” & 6” wafers

30. Ch 5 - Rapid Thermal Processors RTP3 – Si non-MOS, metals; up to 6” wafers RTP4 – Si MOS, silicidation; up to 6” wafers RTP1 – III-V, PZT, metals; up to 6” wafers RTP2 – III-V; process up to 6” wafers Rapid Thermal Processing has time scales on the order of seconds to reach up to 1100ºC. Applications include thermal oxidation, anneal, dopant activation and metal reflow. RTP8 – Si MOS Gate Oxidation; Process up to 8” wafers

31. Ch 6 - Thin Film Deposition – PECVD/HFCVD

32. Ch 6 - Thin Film Deposition – ALD

33. Ch 6 - Thin Film Dep – PVD Sputter All PVD tools require use of light blue “vacuum” gloves

34. Ch 6 - Thin Film Dep – PVD Evaporation Evaporators require Evaporation Training Workshop Qualification

35. Ch 7 – Etching Systems – Plasma

36. Ch 7 – Etching Systems – Other

37. Ch 8 -Testing and Inspection Equipment MNL has a wide range of test and inspection equipment. See Chapter 8 in the MNL Manual for a complete list. Contact MNL Process Engineer Jeff Clarkson for assistance.

38. Thank You for your attention!