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MagnaChip Semiconductors, Ltd.

The Corporate NPI Process - New Technology & Product Introduction (V 3.0). January 30, 2010. MagnaChip Semiconductors, Ltd. Contents. General Provisions 1.1 Purpose, scope, and standardization committee 1.2 Role & responsibility NPI basics 2.1 Project & NPI stages

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MagnaChip Semiconductors, Ltd.

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  1. The Corporate NPI Process - New Technology & Product Introduction(V 3.0) January 30, 2010 MagnaChip Semiconductors, Ltd.

  2. Contents • General Provisions • 1.1 Purpose, scope, and standardization committee • 1.2 Role & responsibility • NPI basics • 2.1 Project & NPI stages • 2.2 Project type definition • 2.3 Stepwise progress check • 2.4 Cross functional project management • 2.5 Change management • 2.6 Performance metrics • MC brand product development process • 3.1 Project classification • 3.2 Key activities • 3.3 Overall development process • 3.4 Key review points (P1 ~ P7) • 3.5 Summary of checkpoint approvers & deliverables • 3.6 Change management R&R • Foundry product development process • 4.1 ~ 4.6: Same order as section 3.1~3.6 • MC brand technology development process • 5.1 Project classification • 5.2 Key activities • 5.3 Overall development process • 5.4 Key review points (T1~ T7) • 5.5 Summary of checkpoint approvers & deliverables • 5.6 Change management R&R • 5.7 DK update process • 6. COTT process • 6.1 ~ 6.6: Same order as section 5.1 ~ 5.6 • 7. Qualification criteria • 7.1 Key summary of qualification test criteria • 7.2 Technology qualification items • 7.3 Product qualification items • 7.4 Product re-qualification criteria – general • 7.5 Product re-qualification criteria – power product • 7.6 Reliability test checklist • Appendix • A1.Yield calculation model • A2. Terminologies

  3. 6. COTT (Customer-own technology transfer) 5.1 Project classification 5.2 Key activities 5.3 Overall development process 5.4 Key review points (T1 ~ T7) 5.5 Summary of checkpoint approvers & deliverables 5.6 Change management R&R

  4. 6.1 Project classification T1 Project Planning T2 Process module T3 Pre POR T4 Si verification T5 Tech freeze T6 Product level qual MC brand Technology Platform O O O O O O

  5. 6.4 Key review points (T1 ~ T7) T2 Kick off & key process T3 Pre POR T4 Si verification T5 Tech freeze T6 Product level qual T1 Planning R&D MFG Communication for production Equipment Correlation P7 Yield Up TDRB TCP CP CP TCP TDRB CP & Approver TDRB Dir Manager Manager Dir TDRB Stage review TDRB TCP TCP TCP TDRB CP reject pass Internal review Tuning CP Revision CP CP CP CP CP CP CP CP CP Yield >70% Product yield CUM ≥ 90% Project charter Kick off Process review POR 0.0 Si verified spec POR 0.1 & PCM 0.1 Process freeze POR 0.9 & PCM spec PQV design & evaluation Product level qual Equipment review Inline, PCM spec Platform review FMEA DR review Biz impact review CP CP POR 1.0 review Tech maintenance 1st POR review Milestone Risk review Spec Key deliverables • Project charter • Process review • Equipment review • DR review • Pre POR • 1st POR data • 1st PCM data • POR v 0.9 • FMEA • PCM spec • Customer qual data • Development report • POR 1.0 • Inline, PCM spec • Performance index • Product yield trend • Equipment multiplication • Tech maintenance

  6. 6.4.1.1 T1 – deliverables Deliverables Category Key contents Timeline • Business impact analysis • Target customer & spec Project charter (Marketing, PE, & QRA) • Marketability (account manager) Before T1 TDRB review • Technical feasibility & risks (PE & MEC) • Technical issues (equip capability, etc) • Development plan (PE) • Key milestones, development cost • Risk assessment (FMEA) • Project priority • NPV (ROI) data • Strategic importance Project code (PE) • Project code generation • Code generation request After T1 TDRB approval

  7. 6.4.2 T2 Kick off& key process –TCP & deliverables Step 1: Kick off Step 2: Process review (TCP) Div PE Process review done (Go to T3) TCP review Kick off review meeting no yes Process review DR review MEC Equipment review Timeline (week) W0 • T2 TCP: Div PE director approves W0 + 2 W0 + 2 Deliverables Category Key contents Timeline Process review (PE) • Key process review data • Process flow review • Process module review At T2 TCP review DR review (PE) • DR review data • Critical DR review Equipment review (PE) • Equipment capability review data • Equipment capability review

  8. 6.4.3 T3 Preliminary POR – CP & deliverables Step 1: Preliminary POR ready Step 2: Pre POR review (CP) Div PE NG Pre POR review T2 Process review pass Preliminary POR ready Pre POR (Go to T4) Short loop to verify process feasibility Timeline (week) W0 • T3 CP: Div PE manager approves W0 + 2 W0 + 2 Deliverables Category Key contents Timeline POR 0.0 (PE) • Control plan • Control plan & e-sheet v 0.0 At T3 CP review

  9. 6.4.4 T4 Si verification – CP Step 1: MDV design & evaluation Step 2: 1st POR review & PDK v 0.1 (TCP) Customer Customer pizza mask design TCP review Fab ok POR 0.1 & PCM data Div PE T3 pre POR Si verified spec (Go to T5) NG Equipment margin review • Si verified spec • 1st POR & PCM data MEC Timeline (week) W0 W0 + 4 W0 + 9 W0 + 10 • T4 CP: Div PE manager approves Deliverables Category Key contents Timeline 1st POR data (PE) • Control plan & e-sheet data • Control plan & e-sheet v 0.0 At T4 CP review 1st PCM data (PE) • PCM data • Inline, PCM data

  10. 6.4.5 T5 Technology freeze – TCP Step 1: TDV design & evaluation Step 2: Process freeze & 1st WLR pass (TCP) Div PE Plan revision NG POR v 0.9 TCP review T4 Si verified spec ok Tech freeze (Go to T6) Process optimization Fab & evaluation Inline, PCM spec Equipment review MEC Timeline (week) W0 W0 + 7 W0 + 8 W0 + 8 • T5 TCP: Div PE director approves Deliverables Category Key contents Timeline POR v 0.9 (PE) • Control plan & e-sheet • Control plan & e-sheet At T5 TCP review • In-line data, PCM spec • Equipment capability review PCM spec (PE) • Inline, PCM spec FMEA (PE) • FMEA (technical issues) • Technical issues review data

  11. 6.4.6.1 T6 – deliverables Deliverables Category Key contents Timeline Customer qual data (Customer) • Customer qualification data • PQV reliability test data (QRA) At T6 TDRB Product level qualification review Development completion report (PE) • Development report • Development completion report • Product or IP/Lib evaluation data (Test) POR 1.0 (PE) • Control plan & e-sheet • Control plan & e-sheet, Inline spec which are reviewed with MEC PCM spec (PE) • Final inline, PCM spec • Final inline, PCM spec • Cpk data Performance index (PE & TM) • R&D performance (PM) • Market performance ™. • On-time rate, revision times, revenue hit rate, NPI obedience rate, etc. Project code (PE) • Project code closure • Code close request After T6 TDRB approval • For option project: Div PE can replace project manager’s role.

  12. 6.4.7.1 T7 Yield up – deliverables Deliverables Category Key contents Timeline Yield trend data (MEC) • Yield data • Process data • Yield trend data • Process control data • Lesson learned & PFMEA During yield up activities Equipment multiplication (MEC) • Recipe review data • Process uniformity check • Equipment model based recipe checkup • Cp / Cpk review Before mass production PCRB data If required for platform change (MEC) • PCRB data • Yield trend data • Process control data • Lesson learned & PFMEA • Reason for why platform technology changes During yield up activities • Tech maintenance data • Tech maintenance data • - tech vehicle review • - process control data • - Fab data review • - yield data • - issues • Reason for why platform technology changes After quarterly tech maintenance

  13. 6.5 Summary of check point approvers & deliverables

  14. 6.6 Change management R&R

  15. 7. Qualification criteria 7.1 Key summary of qualification test criteria 7.2 Technology qualification items 7.3 Product qualification items 7.4 Product re-qualification criteria – general 7.5 Product re-qualification criteria – power product 7.6 Reliability checklist

  16. P1 P2 P3 P4 P5 P6 P7 / T7 Yield Up R&D T1 T2 T3 T4 T5 T6 MFG Communication for Production Equipment Correlation MCP/TDRB TCP/CP TCP TCP/CP TCP TCP/TDRB Check point 7.1 Key summary of qualification test criteria P5: Characterization report w/ ESD data T5: 1st WLR data P6: Product qual. report w/ reliability test result T6: 2nd & 3rd WLR data P1: Product qual criteria T1: Tech WLR criteria Quality Test ■ Qualification test criteria WLR (Tech) Product Reliability (Product) ESD / Latch up (Product) Platform New process: 3 lots, 504 hours Else: 1 lot, 504 hours (Power IC & discrete: 1008hr) Platform 3 lots ESD HBM: 2KV MM: 200V CDM: 1kV (MDDI: 500V) 3 lots Derivative Derivative 1 lot, 168 hours (power discrete: 504hr) Latch up Current, Vdd-Vss (all static conditions) Option 1 lot (discuss w/ QRA) Option No check (discuss w/ QRA) • If there is a special request from customer, it prevails this regulation. ■ Re-qualification when design change / process optimization occurs after P6 TCP pass. Major change Redo all the reliability test items again from start (same number of lots) Redo limited items which are related to the changes (reliability test: 1 lot) Minor change Others Nothing

  17. 7.2 Technology qualification items • WLR criteria • WLR test items

  18. 7.3 Product qualification criteria – general • Qualification criteria • Reliability test items • General: means all the products which apply for reliability test except power products. • (For power products, see next page)

  19. 7.3.1 Product qualification criteria – power product • Product qualification criteria • Reliability test items * D: discrete

  20. 7.4 Product re-qualification criteria - general • Product re-qualification after mask revision or process modification • General: means all the products which are not the power products.

  21. 7.4.1 Re-qualification criteria after mask revision << Mask revision after qualification pass >>

  22. 7.4.2 Re-qualification criteria after process modification << Process optimization after qualification pass >> Exceptions (Note 1) 1. For changes in raw material, in-line CD, thickness etc. (i.e. spec range adjustment) and the change is narrower than existing criteria, change approval process not required. 2. Back-up of part of process to a different fab is not considered Fab location change. It should be deemed as changes within same fab and thus follow the change approval process accordingly. (Except, site change (Gumi ↔ Cheongju) is deemed Fab location change.) 3. Changes in measurement cycle and measurement steps are excluded from approval. 4. Items not defined in the Process optimization table should be classified as “others”, when there are issues, adjust through FCCB. 5. “Consumable parts” is limited to Process kits. 6. Where there is direct impact to Process and internal evaluation is conducted for the first time, only new vendors should be considered “minor change.” Where the change is already verified in a higher-level Technology, the change can be applied to all products. Also, where there is no direct impact to process, it should be classified as “others”.

  23. 7.4.2.1 Process modification criteria (1)

  24. 7.4.2.2 Process modification criteria (2)

  25. 7.4.2.3 Process modification criteria (3)

  26. 7.5 Product re-qualification criteria – power product • Power product re-qualification after changing a package type or Fab conditions

  27. 7.5.1 Fab condition change – modification criteria (1) • Note: process modification items which are not defined in this modification criteria table, shall be adjusted by “FCCB”.

  28. 7.5.1 Fab condition change – modification criteria (2)

  29. 7.5.2 Fab condition change – test items (1) * HT: HTRB/HTGB (HTOL IC only), ESD: ESD & latch-up, DS: Die shear, BS: bond shear, SH: Solder heat, FT: Final test distribution

  30. 7.5.2 Fab condition change – test items (2) * HT: HTRB/HTGB (HTOL IC only), ESD: ESD & latch-up, DS: Die shear, BS: bond shear, SH: Solder heat, FT: Final test distribution

  31. 7.5.2 Fab condition change – test items (3) * HT: HTRB/HTGB (HTOL IC only), ESD: ESD & latch-up, DS: Die shear, BS: bond shear, SH: Solder heat, FT: Final test distribution * BM: Back Metal residue on Wfr Mount Tape

  32. 7.5.3 PKG change – modification criteria

  33. 7.5.4 PKG change – test items (1)

  34. 7.5.4 PKG change – test items (2) • DS: Die shera, Void: D/adhesive voids, BST: BST ( WST), CR: Crater, VI: Visual inspection, FT: final test distribution, DM: dimension measurement, CSAM: C-SAM (Lead, die top and pad top), SW: Solder ability and whisker • BC: only for bond related changes

  35. 7.6 Reliability test checklist (1) • Checklist for a reliability test plan • Incoming Inspection Check sheet of a Reliability Board

  36. 7.6 Reliability test checklist (2) • Checklist for reliability test setup

  37. Appendix A1. Yield calculation model A2. Terminologies

  38. 1 Y = ( 1 + 0.155*A*D0 )N A1.Yield calculation criteria Modified Bose Einstein Yield Model A: Chip size excluding scribe area ( Unit : cm2 ) D0: Defect density ( Unit : /cm2 ) N: Process complexity factor (determined by photo layer)

  39. A2.1Terminologies – general

  40. A2.2Terminologies – project type

  41. A2.3Terminologies – Original plan & revision plan

  42. n Σ Ct - C0 NPV = (1 + r)t t=1 A2.4Terminologies – NPV, WBS, etc.

  43. A2.5Terminologies – HTOL, Cpk, RMA, etc.

  44. Effective date

  45. Effective Date • [Legislation] • This Corporate NPI process replaces all the development processes which have been applied in each division of MagnaChip Semiconductor, Ltd. • All development projects of each division shall follow this Corporate NPI process as from December 1, 2006. • [Amendment] • The Corporate NPI process version 1.0 is updated into version 2.0 and effective from July 1, 2007. • The Corporate NPI process version 2.0 is updated into version 3.0 and effective from January 30, 2010. • The existing development projects under development shall follow this NPI process version 3.0 from new events from January 30, 2010.

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