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Proposed engineering changes for modular coil lead area include updates to upper chill plate, lower cladding, tracking distance hardware, and elimination of floating hardware. Recommendations aim to enhance insulation, eliminate potential future problems, and improve overall system efficiency.
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Suggested Engineering Changes to Modular Coil Lead Area James H. Chrzanowski June 13, 2006
Lead Area Design Changes • Lead Area upper chill plate • Lead Area lower cladding • Improve tracking distance hardware to jumpers • Eliminate floating Hardware • Jumper studs • Power bus joint
Lead Area Chill Plates - If possible eliminate upper chill plate - Difficult to insulate - Potential problem in future??
Lead Area Cladding- Lower • Replace lower cladding in lead area with G-11cr [eliminate floating pieces]
Power Bus Tie-in Area • Improve tracking distance- install barrier • Eliminate floating through bolts- tie studs to one side of joint
Improve Tracking Distance • Improve tracking distance • Install 032 in. thick G-11cr insulator under jumpers covering bolts
Lead Area Floating Hardware -Link the [3] jumper studs to the bottom jumper using G-11cr [1] insulator and copper plate [2] -Tie plate to jumper 1 lug [3] using wire 2 1 3