1 / 36

Corporate Presentation HEAD Electronics BV

Corporate Presentation HEAD Electronics BV. • Presentation of HEAD Electronics BV. History -Culture. • Supplier Overview • History Culture. Founded in 1987 by our director A. van Leeuwen Company privately held HEAD = Holland Electronics Advanced Development

kalare
Download Presentation

Corporate Presentation HEAD Electronics BV

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. CorporatePresentationHEAD Electronics BV • Presentation of HEAD Electronics BV

  2. History-Culture • • SupplierOverview • History Culture • Founded in 1987 by our director A. van Leeuwen • Company privately held • HEAD = Holland Electronics Advanced Development • Started as component shop + design engineer • Customer needs leads to grow in capabilities and in organisation • Nowadays Electronic Manufacturing Services Company as a One Stop Shop for Industrial Electronics • 45 employees, incl. partime • Informal, flat structured organization, documented processes and improvements

  3. Memberships • • SupplierOverview• History Culture • FHI: Federatie Het InstrumentExhibition Electronics & Automation 2003 – 2012 • Nevat: Nederlandse Vereniging Algemene Toelevering Member andsecretary of the Technology-taskforce Managing the website forTechnology-taskforce

  4. Product Offerings • SupplierOverview• Product Offerings

  5. One Stop Shop • From idea to product • Product-redesign and - engineering • Purchasing of components • PCB work preparation and purchasing • Assembling of SMD and THT (trough hole) • Prototyping, pre-production, series production • Assemble in housing or system, cabling • In-house testing of product and CE-EMC • Deliveries on call (JIT) and as series • Logistics, warehouse, outscoursing • Service, upgrades and customer repairs • • SupplierOverview• Product Offerings

  6. Locations, Geografic • • SupplierOverview• Locations, Geografic HEAD Electronics BV Ambachtsweg 172222 AH Katwijk zhTel. +31 (0)71 - 40 29 154Fax. +31 (0)71 - 40 30 091

  7. Markets served • SupplierOverview• Markets Served - Products & Geographic

  8. Customer Service Capabilities Chooseyourownmenu… • Project definition • Electronics development / Design • Project management / engineering support • Assembling of electronics • Mechatronics, wiring, coating etc. • Testing, test engineering • Logistics • After sales • Prototypes • • SupplierOverview • Customer Service Capabilities • Menu

  9. Customer Service Capabilities • • SupplierOverview • Customer Service Capabilities • Menu explained • Project definition(product, specification, planning etc) • Electronics development / design (by customer and/or HEAD) • Project management / engineering support (workpreparation PCB & BOM, documenting, overall view, etc) • PCB assembly (SMD, THT, manual soldering, etc.) • Mechatronics(total assemblies, wiring, coating etc.) • Testengineering (AOI, EMC, X-rayetc) • Purchase & Logistics(forecast, purchasing, storage, consignment, etc.) • After sales (upgrades, changes, customer repairs, etc) • Prototyping & pre-production(hand + machine & machine)

  10. Project Definition • • Manufacturing• Capabilities • Menu • Project Definition • Defining a project (enquiry, requirements, specs, etc) • Calculation(BOM, labour, machine costs, etc) • Specification(PCB, BOM, etc.) • Planning (lead times) • Purchasepreparation(BOM + planning in MRP) • Terms & conditions(general, planning, warranty, payments, etc) QUOTATION + ORDER + ORDER CONFORMATION

  11. Project Definition - RFQ • Manufacturing• Capabilities • Menu • Project Definition • RFQ

  12. Electronics Development • • Manufacturing• Capabilities • Menu • Development / Design Fromideatofunctioning product Balancingdevelopment vs. product costs • Specification • Hardware • Embedded software • Availability of components • Costpricecomponents • Productionfriendly • Programming & testing • CE, EMC pre-compliant • Workingprototype • TPD Technical Product Documentation

  13. Project Management • • Manufacturing• Capabilities • Menu • Project Management • General Customer partnership • Operations management • Project management • Quality management • Work preparation PCB/BOM • Documentation in AEGIS • Logistics, purchase, storage • Outsourcing • Planning, controlling • Cost control, invoicing

  14. WorkPreparation PCB • • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation PCB Panellizing and specification before purchasing: • PCB data • Multilayer PCB • Panelizationwith CAM350 • Design/edit with Pulsonics • Own internet tool for PCB specification • Enquire PCB-quotations • Prepare purchase of PCB’s

  15. WorkPreparation BOM • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation BOM

  16. WorkPreparation Machines • Manufacturing• Capabilities • Menu • Project Management • WorkPreparation Machines

  17. WorkPreparationDocumentation • • Manufacturing• Capabilities • Menu • Project Management • WorkPreparationDocumentation (MOS) Documentation in AEGIS MOS = Manufacturing Operations Software

  18. Floor Documentation • • Manufacturing• Capabilities • Menu • Project Management • Floor Documentation Shop Floor paperless by AEGIS

  19. Electronics AssemblingSurfaceMountedDevices • • Manufacturing• Capabilities • Menu • Electronics Assembling • SMD Fast, flexibleand accurate • Samsung CP 411-421 series SMD • Placing SMD-components to 0402 • Finepitch QFP 0,4 mm • Finepitch (µ)BGA • Preparedfor intelligent feeders • Up to 60k components / hour • SoltecMy Reflow 10 zone Reflow Oven • DEK Horizon 2 screenprinter

  20. Electronics AssemblingSurfaceMountedDevices • Manufacturing • Capabilities • Menu • Electronics Assembling • SMD Close up

  21. Electronics AssemblingSurfaceMountedDevices • Manufacturing • Capabilities • Menu • Electronics Assembling • SMD Barcode

  22. Electronics AssemblingSurfaceMountedDevices C1608-560pF C1608560PF9907141301 C1608-560pF C1608560PF9907141301 • Manufacturing • Capabilities • Menu • Electronics Assembling • SMD network DATABASE SERVER ETHERNET (TCP/IP) PART-STATION MACHINE FEEDER-STATION DeviceNet SM FEEDER BARCODE PRINTER REEL BARCODE READER REEL BARCODE READER Feeder ID Reading Feeder Event (insert, remove, …) DOCKING-CART

  23. Electronics Assembling Conventional Components • • Manufacturing • Capabilities • Menu • Electronics Assembling • Conventional • Component preparation as cut, bend etc. • Placing of all remaining components • Soldering of the leaded components • End-assembling, built in housings • Programming and loading of software • Routine testing • Packing, labeling

  24. Electronics Assembling Conventional Components • Manufacturing • Capabilities • Menu • Electronics Assembling • Conventional • Close up

  25. Electronics AssemblingWave Soldering • • Manufacturing • Capabilities • Menu • Electronics Assembling • Conventional • Wave Soldering • Wave soldering N2 with the Soltec “Deltawave” (leaded) • In-line wave soldering N2 met EPM IBL (RoHS)

  26. Electronics Assembling Selective Soldering • Selective soldering with the Soltec My Selective 6745 (RoHS) • • Manufacturing • Capabilities • Menu • Electronics Assembling • Conventional • Selective Soldering

  27. Electronics Assembling Mechatronics / Total Assembly • Cleaning of PCB’s • Coating of PCB’s • Potting of PCB’s • Cabling in house or outsourced • Total assemblies, housing, 19” racks etc. • Burn-in test • • Manufacturing • Capabilities • Menu • Electronics Assembling • Mechatronics

  28. Electronics Assembling Cleaning & Coating • Manufacturing • Capabilities • Menu • Electronics Assembling • Mechatronics • Cleaning & Coating

  29. Test, Test Engineering • • Manufacturing • Capabilities • Menu • Test, Test Engineering • PCB: Visual, probe tester, sleeves /microscope • SMD: AOI (Viscom), X-ray (Dage 2 M pixel) • CE- precompliant EMC • Product: Visual, Functional, In-circuit, self-test, climate-test • Realizationof project test tools withcustomers

  30. Logistics - Storage • • Manufacturing • Capabilities • Menu • LogisticsStorage • Year order, rolling forecast, MRP • Purchasing and incoming goods • Identification / inspection (ATEX) / part storage • Packing following instructions, ESD measures • Storage half and end products, consignation

  31. Logistics - Transportation • • Manufacturing • Capabilities • Menu • LogisticsTransportation • Just in time, track and trace • Destinations to customer and endcustomer • Transportation boxes with UPS in NL, UK (Europe) • Pallet Benelux with Wesseling Transport Sassenheim • Worldwide via expedition centres, airport etc.

  32. After Sales Service • • Manufacturing • Capabilities • Menu • After Sales Service • After sales service, upgrades, customer repair • For hard- and software • During the lifecycle of your product • Redesign and use of other/newer parts • Spare parts, obsolete part replacements

  33. Series / Proto Types • • Manufacturing • Capabilities • Menu • Series / Proto Types • Productionseries • Midserie 100 - 50k pcb’s • Pre-productionseries 10 - 100 pcb’s • Prototypes 1-10 pcb’s • Prototyping • Manual • Partly SMD-line • Paste stencil + reflowoven • Withcomponents from the series or specificsmall volume PO’sfromFarnell, Digikey etc.

  34. Quality Management • • Manufacturing • Quality Management • ISO 9001: 2008 accredited management system Scope Head Electronics BV: “Design and manufacturing of printed circuit boards and assemblies, Incl. SMD production. Design and manufacturing of electronic end products”. • Quality manual: • MSH Head electronics • IPC 6XX / IPC 4101B: • Bare Printed Circuits Boards • Assembling of PCB’s • Cabling • Repair activities • EU-Regulations: • RoHS, REACH by Manufacturer (assembling) • (CE/ WEEE) by Producer (market)

  35. Your contact persons • • HEAD • Contactpersons Managing Director: Arie van Leeuwen Marketing & Sales: Eric Verkerke Operations & Finances: Arjan van der Ploeg Production: Wim de Boer Head Electronics BVAmbachtsweg 172222 AH Katwijk ZHtel.: +31 31-4029154fax.: +31 71-4030091e-mail: info@head.nl Internet: www.head.nl

  36. Next steps ……. • HEAD • Next Steps …… MovingaHEADforyou!

More Related