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How to use Thermal Design Software. Paul Rose European Electronics AE Manager LuxLive 2013. Design Challenges in Electronics Design. Figure 1 : Junction Life Statistics. ( Source : GEC Research). Overheating is the major reason for electronics failures

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how to use thermal design software

How to use Thermal Design Software

Paul Rose

European Electronics AE Manager

LuxLive 2013

design challenges in electronics design
Design Challenges in Electronics Design

Figure 1 : Junction Life Statistics

(Source : GEC Research)

  • Overheating is the major reason for electronics failures
  • There is a need to remove the heat generated by the electronic components.
    • Whether or not using mechanical means

PMR, Fast and Accurate Predictability of CFD Thermal Analysis for PCB Design, June 2010

design challenges in electronics design1
Design Challenges in Electronics Design
  • Working against us…
    • Moore’s Law (increasing power)
    • Increased functionality
    • Reduce size
    • Reduce noise
    • Increase reliability
    • Constrictions of manufacture

PMR, Fast and Accurate Predictability of CFD Thermal Analysis for PCB Design, June 2010

design challenges in luminaire design
Design Challenges in Luminaire Design
  • Junction temperature directly impacts light efficiency.
  • Heat transfer paths have changed:
  • Challenge is to ensure sufficient conduction to the environment.

Light

Light & Heat

TJ = 2000+ ˚C

TJ = 50 - 100 ˚C

Heat

thermal analysis of electronics
Thermal analysis of Electronics

Concept

Detailing

Final Design

Testing

CFD

CFD

CFD

  • Could employ physical testing
    • Cost of redesign / testing
    • Over engineer to avoid possibility of failure
  • Use numerical computer based virtual testing which is where Computational Fluid Dynamics comes into play

Concept

Detailing

Final Design

Testing

CAD

CAD

CAD

CAD

Manufacture

Prototype

Prototype

Prototype

CAD

Manufacture

5

what is cfd
What is CFD?
  • From a text book (Versteeg & Malalasekera, “An Introduction to Computational Fluid Dynamics: The Finite Volume Method”)
  • “Computational Fluid Dynamics or CFD is the analysis of systems involving fluid flow, heat transfer and associated phenomena, such as chemical reactions by means of computer-based simulation”
what is cfd1
What is CFD?
  • In Pictures…
what is cfd2
What is CFD?
  • 18th and 19th Century many eminent scientists carried out research to mathematically describe the motion of Fluids:
    • Daniel Bernoulli (1700 – 1782)
    • Leonhard Euler (1707 – 1783
    • Claude Louis Marie Henry Navier (1785 – 1836) and George Gabriel Stokes (1819 – 1903)
  • Navier Stokes equations forms the basis of modern day CFD – based around conservation laws
  • Late 20th Century and beyond…
    • Research to create numerical methods to solve the basic equations
    • A number of general purpose codes developed and marketed
    • Computer power increasing allowing more accurate analysis to be performed
analysis process
Analysis Process
  • Create geometry
  • Create an analysis project
analysis process1
Analysis Process
  • Add thermal properties / heat sources / environmental conditions
  • Look at the results….
a system level problem
A System Level Problem

Max. Allowable Junction temperature

Available Headroom

PCB

Heat sink

Air

Ambient temperature

  • Helpful to think in terms of ‘thermal headroom’

LED Package

Vendor

Designer’s job is to decide how to split up the temperature rise from ambient to case

System Designer

thermal head room
“Thermal Head Room”

Acceptable LED Temperature = 70.0°C

Predicted LED Temperature = 65.1°C

Available Headroom 4.9°C

design challenge
Design Challenge

Heat flow from device to Heat Sink

Heat flows within Heat sink to its surface

Transfer from Surface into surrounding air

design challenge1
Design Challenge

Surface Area

Alter Number of Fins

Transfer from Surface into surrounding air

Aerodynamics

what about the components
What about the components

active layer to submount

classical die attach (TIM1)

solder/glue to MCPCB

  • Can use simulation to investigation component level thermal performance…
  • …but also transient measurement techniques can accurately characterize the LED

classical TIM to heat-sink (TIM2)

System-Level Thermal Management of LEDs

John Parry & Paul Rose, 07 July 2009

role of physical testing
Role of Physical Testing
  • Combined thermal and radiometric characterization: T3Ster + TERALED
completing the circle
Completing the Circle
  • Characterization of the LED from the physical test can be used in the simulation software…
final thoughts
Final Thoughts…
  • Thermal analysis should be an integrated part of the design process to:
    • Optimise thermal performance at the earliest possible stage
    • Prevent over engineering required to sort out problems that occur at a late stage of the design
    • Design a system that you know will work
  • Stand G42

“FloEFD from Mentor helps us to understand and optimize headlamps. Even very complex geometries and test conditions can be investigated with a minimum of effort.“

Peter Jauernig,

Head of Department Automotive Lighting

http://www.mentor.com/products/mechanical