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"There Is More Than Moore in Automotive …"

"There Is More Than Moore in Automotive …". Hartmut Hiller Infineon Technologies AG Senior Director Design Methodology Business Group Automotive, Industrial & Multimarket. Body & Convenience Xenon Light, Seat Position, Climate Control, Dashboard. Powertrain

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"There Is More Than Moore in Automotive …"

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  1. "There Is More Than Moore in Automotive …" Hartmut Hiller Infineon Technologies AG Senior Director Design Methodology Business Group Automotive, Industrial & Multimarket

  2. Body & Convenience Xenon Light, Seat Position,Climate Control, Dashboard Powertrain Engine ControlTransmission ControlBattery Management Climate Control Airbag Night Vision Park DistanceControl Steering Transmission Hybrid Dashboard Blindspot Detection Engine Suspension CoolingFAN TPMS Mirror Brake BatteryManagement Door Light ABS Central Lock ESP AdaptiveCruise Control Chassis Active Suspension, Power Steering Safety Airbag, ABS Brakes,Adaptive Cruise Control Some Semi-conductor enabled functions of a typical car Nico Kelling (IFJ AIM MC)

  3. Growth in % (1995 = 100%) 450% CAGR 11.3% Semiconductor content of car 425% Value of Semiconductor per car 2008: 320 US$ 2020: 700 US$ 400% 350% 300% Electronics content of car 255% CAGR 6.9% 250% 200% Car volume 144% 150% CAGR 2.6% 100% 1995 1997 1999 2001 2003 2005 2007 2009 Source: ZVEI Automotive Microelectronics Trends  More Than 50% of $-value of Electronics is Semiconductors

  4. Full spectrum of semi-conductor technologies is needed Computing Power Semicon. High current High voltage High temperatures Silicon Sensors Special processes High precision Great robustness Sensing Actuating Microcontrollers 50 m transistors Non-volatile memory SmartSensors Smart Power

  5. 1000 130nm 90nm Emerging Memories 100 2-year Cycle Technology Node – Minimum structure (nm) 65nm Bipolar CMOS DMOS 3-year Cycle eFlash Automotive MC 22nm DRAM ½ Pitch MPU/ASIC ½ Pitch 10 1995 1998 2001 2004 2007 2010 2013 2016 Year of Production While technologies for Automotive follow at a distance Moore’s Law: Driver for CMOS & DRAM Source: ITRS Roadmap, Infineon, Internet Announcements

  6. The special challenges for Automotive Technologies 1. Extended Temperature Range: -50° C to 175+° C 2. Extreme mechanical stress (vibration, pressure, temp. cycles) 3. Extreme voltages/currents for Power-Semiconductors (Switches) 4. Long term reliability requirement 5. Large eFlash with 10 years data stability 6. Demanding ESD / EMC / EOS requirements 7. Zero Defect Requirement

  7. The special challenges for Automotive Technologies QUALITY( No compromises ) This builds the basis for our RELIGION which is called

  8. Infineon’s Automotive Excellence Program 44th Design Automation Conference San Diego, June 2007

  9. Secure Ramp Former We deliver "World Class Quality" from Day Zero Quality * Effort Wspw Time * := Functionality, Zero Defect, Yield, Reliability, Robustness, Spec. Corners

  10. Learning Learning Test-Chip Learning Product A-Step Product A-Step Product B-Step Unfortunately "World Class" does not come for free The Goal Quality Wspw Test-Chip Effort Time

  11. Our today’s "Top 3 Challenges" (w/o good EDA solutions) Today’s EDA Tools provide "sub-optimal" Support for: 1. The embedded Flash Challenge 2. EMC Modelling 3. To overcome the "Analogue / Digital Wall"

  12. A typical InfineonHigh-End µC 1. The embedded Flash challenge The eFlash challenges: 1. Tremendous analogue complexity pushing the tool limits ( 18 Mio Transistors  100 Mio extr. Devices) 2. Complex Mixed Signal function; FSI with own CPU for calibration 3. Electro-Migration verification 4. Dynamic IR Drop verification 5. Hierarchical Extraction 6. True Latchup Issues (due to high Voltages during write/erase)

  13. Chip Real Layout Abstraction via Own Tool Netlist Package • Simulations: • VDD/VSS-Currents • Voltage Drop • Noise Crosstalk • EME • ESD • Parasitic Resonances EME Simulation Results 2. EMC Modelling

  14. Timing closure; Behavioral Correctness; non distrubant analogue Transitor level opt.; Transient behavior; Noise; … Sys- Level Dig. Design AMS Design SIP Abstraction Abstraction Abstraction Abstraction 3. The digital / analogue Wall Abstraction 1-2 Iterations / macro Macro + FRUSTRATION  AMS community / db Full-Chip community / db And that‘s what we strive for Common database & Common Methods (example: Full Chip Crosstalk analysis )

  15. The "Monsters ahead": Tomorrows "Top 3 Challenges" 1. Modelling Parasitic devices 2. "Adding Brain to Power" 3. On the Way to "Zero Pin Sensors"

  16.  if potential drops below Vdd (!!! critical with inductive loads !!!) "One" Problem: Parasitic NPN 1. Modelling Parasitic Devices Modelling of parasitic devices/substrates is "the blind spot" in today’s EDA (Example: ReverseCurrent Injection for Power-Semi): Today’s solutions: Expert Reviews & Checklists to ensure that proper design measures are taken But unfortunately you see such a problem the first time on Si(  lack of EDA supported methods )

  17. µ-Controller Power-Chip 2. "Adding Brain To Power" Next Step: Current Product (MCM): horizontal integration(based on IFX 130nm node) and the Next Challenges (w/o good EDA answers): 1. Voltage Dependent Design Rules 2. New effects (parasitcs) due to substrate coupling  substrate Modelling 3. Diverging Time Constants (kHz  100s of MHz) 4. Diverging Current Ranges (µA  some A) 5. Thermal simulation with analogue view ( matching  isotherm req.) 6. Digital / Analogue / High Voltage Co-Design 7. . . . . . .

  18. The Next Level of Sensor Integration(!!! truly autonomous !!!): 3. On the Way to "Zero Pin Sensors" European Commission #026461 – e-CUBES and the Next (EDA) Challenges coming with it: 1. How to test an pin-less device (new BIST methods)? 2. Overall System Level verification  Full Range: mechanical thru High Speed-RF 3. Highly sophisticated System In Package (SIP) flow / methodology needed 4. Sophisticated Power Saving techniques 5. High density interchip wiring & interchip vias 6. Interchip Crosstalk 7. . . . . . .

  19. Conclusions Quality & Reliability are the driving forces for Automotive Products are facing (simultaneously) a broad range of challenges: * Mechanical * Thermal * Robustness * Mixed Signal Complexity * ESD / EOS / EMC The EDA issues shown are our prominent ones beside HW / SW integration, Funct. (MS) Verification, ESD robustness,. . . . . .

  20. http://www.infineon.com Thank you for your attention Hope you got some MORE insight why "There is MORE than MOORE in Automotive …"

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