Transient thermal + fatigue analysis in ASONIKA

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# Transient thermal + fatigue analysis in ASONIKA - PowerPoint PPT Presentation

Transient thermal + fatigue analysis in ASONIKA. Specify a name for the project. Select 3d model to import. Quarter-symmetry model of PCB + BGA Package. Specify initial temperature for entire model (20 degrees C).

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## Transient thermal + fatigue analysis in ASONIKA

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Presentation Transcript

### Transient thermal + fatigue analysis in ASONIKA

Specify initial temperature for entire model (20 degrees C)

This temperature will be also used as reference temperature for thermal stress calculation

Select external surfaces and set the thermal condition:convection and radiation (from these surfaces) to the environment

Specify film coefficient, emissivity, view factor and ambient temperature values

Surfaces with thermal conditions become meshed

Symmetry planes should not have thermal conditions

Input heat power vs time curve.

In this example two thermal cycles are modeled. Time dependent heat power will cause cyclic temperatures and stresses. Cyclic thermal stresses are used for fatigue calculation

One thermal (heat power) cycle has range of 8-18 Watt (2-4.5 Watt for quarter symmetry model)

Set material properties for all parts of the modelFor solder balls the following parameters will be used:
Set solution parameters

Specify the end time of the analysis, the time integration step and the number of thermal cycles contained in the solution interval

Temperature – time curve at nodes

Two arbitrary nodes were selected

Temperature vs time curves for two nodes

Stress-time curve

Two arbitrary nodes were selected

Stress vs time curves for two nodes

Fatigue plot

Plot shows minimum fatigue life (451.9 thermal cycles) in solder balls