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New Dimensions in Scribing and Cleaving. August 16, 2019. …Scribing and Cleaving, methods used for much more than Silicon. Silicon wafer. When you think about scribing and cleaving…. …you think handheld scribers, pins, dust , particle and a mess. There’s an alternative way to.
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New Dimensions in Scribing and Cleaving August 16, 2019
…Scribing and Cleaving, methods used for much more than Silicon... Silicon wafer
When you think about scribing and cleaving… …you think handheld scribers, pins, dust, particle and a mess.
There’s an alternative way to GaAs photonic devices Silicon Sapphire wafer and Cross-section Downsize Singulate prepare advanced materials in the cleanroom!
...a clean, dry way to cross-section targets and create mirror-finish facets. Singulated 200 µm thin InP substrate to 3x4mm dice with mirror finish facets.
…a reliable way to singulate wafers prior to and inspect after processing... 2” sapphire wafer GaN on Sapphire
...amorphous materials can be cleaved, thin and thick glass, even Gorilla glass Singulated 200 µm thin InP substrate to 3x4mm dice with mirror finish facets.
LatticeAx is a patented, dry, clean and easy-to-learn scribeless cleaving system—proven to save time and cost. The LatticeAx 420 covers a variety of sample prep needs in the cleanroom or nanofab.
“We saw a significant reduction in particulate contamination, as most users have shifted to cleaving with this tool.” US based nanofab manager Confidential
“…It is clear that reducing cycle time and cost while developing the best processes is critical in creating new materials and products...” LatticeGear customer feedback Confidential
We can help you… Cut your nanofab operating costs Make your users really happy? and
Talk to us. We’re here to help improve sample preparation.
