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Surface Mount Course

Surface Mount Course. based on: ECSS-Q-ST-70-38C dated 31 July 2008 High-Reliability Soldering for Surface-Mount and Mixed-Technology Course update: 20140124 wbs. Introduction: SMD Families. Component Land Patterns & Orientations

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Surface Mount Course

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  1. Surface Mount Course based on: ECSS-Q-ST-70-38C dated 31 July 2008 High-Reliability Soldering for Surface-Mount and Mixed-Technology Course update: 20140124 wbs

  2. Introduction: SMD Families • Component Land Patterns & Orientations • http://tesla.unh.edu/courses/ece711/refrense_material/Expedition/Component%20Zero%20Orientations%20for%20CAD%20Libraries.pdf

  3. 1: Scope • technical requirements and Quality Assurance provisions for the manufacture of high reliability electronic circuits based on Surface Mounted Device (SMD) and Mixed Technology, intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight • proper tools, correct materials, design and workmanship are covered by this document • assembly of leaded devices to through-hole terminations and general soldering principles covered in ECSS-Q-ST-70-08 • printed circuit board substrates covered by this document are placed into five classes in accordance with their average X & Y coefficient of thermal expansion (CTE)

  4. 1: Scope, continued • verification of SMD assembly processes is made on test vehicles (surface mount verification samples). Temperature cycling ensures the operational lifetime for spacecraft. However, mechanical testing only indicates SMD reliability as it is unlikely that the test vehicle represents every flight configuration. • examples of the method for achieving SMD verification approval and guidelines for the soldering of area array devices are given in the Annexes. • this Standard does not cover the qualification and acceptance of EQM and FM equipment with surface-mount and mixed-technology.

  5. 3: Terms, definitions and abbreviations 3.2: Terms • 3.2.4 scavenging (leaching) basis metal or metallization partly or wholly dissolved in melted solder during a soldering operation

  6. 3.2: Terms (cont’d) 3.2.6 solder balling (solder balls) numerous spheres of solder having not melted in with the joint form and being scattered around the joint area normally attached by flux residues NOTE Can be caused by incorrect preheating or poor quality solder.

  7. 3.2: Terms (cont’d) • 3.2.7 tombstoning chip components lifting off one of their two terminal pads causing the chip to stand up like a tombstone. NOTE Normally caused by: • bad design where one pad reaches solder reflow temperature before the other; • different quantities of solder paste on each pad; • different solderability of one pad or one termination with respect to the other.

  8. 3.2: Terms (cont’d) 3.2.7 tombstoning (menhir) http://www.youtube.com/watch?v=Lq6zJAUn74Q Click to run movie…..

  9. 3.3: Abbreviated terms • BGA ball grid array • CBGA ceramic ball grid array • CGA column grid array • CCGA ceramic column grid array • CLCC ceramic leaded chip carrier • CTE coefficient of thermal expansion • JEDEC Joint Electron Device Engineering Council • LCCC leadless ceramic chip carrier • MELF metal electrode face bonded NOTE Also known as minimelf or micromelf • MCGA multichip column grid array

  10. 3.3: Abbreviated terms (cont’d) • PCB printed circuit board • PLCC plastic leaded chip carrier • PID process identification document • QFP quad flat pack • r.m.s. root–mean–square • SMD surface mounted device • SMT surface-mount technology • SO small outline • SOD small outline device • SOT small outline transistor • TO transistor outline

  11. 4: Principles of reliable soldered connections • Reliable soldered connections are the result of proper design, control of tools, materials, processes and work environments, and workmanship performed in accordance to verified and approved procedures, inspection control and precautions.

  12. 4: Principles of reliable soldered connections(cont’d) basic design concepts to ensure reliable connections and avoid solder joint failure are: • stress relief inherent part of design… reduces thermal and mechanical stresses on solder connections • where adequate stress relief is not possible, materials selected to minimise mismatch of thermal expansion coefficients • assembled substrates designed to allow easy inspection. • since only outer row of solder joints to area array packages can be visually inspected, inner rows use X-ray techniques teardrop-shaped solder pads facilitate X-ray inspection • circuit designs for area array devices, have clearance around the perimeter so that reflow nozzles can perform rework or repair operations (see ECSS-Q-ST-70-28 [12]).The clearance depends on the equipment used for reworking and the height of adjacent components. NOTE Unpopulated areas on the underside of the substrate assist indirect heating for removal of these packages. See also Annex C, subclause C.3. • soldering to gold using tin-lead alloy can cause failure.

  13. 5: Process Identification Document (PID) 5.1 General 5.1.1 Purpose PID ensures that a precise reference is established for assembly processes approved in accordance with this Standard PID provides standard reference against which any anomalies occurring after approval can be examined and resolved

  14. 5: Process Identification Document (PID) (cont’d) 5.1 General (continued) 5.1.3 Content PID comprises (a) the assembly design configuration (b) materials and components used in manufacture (c) all manufacturing assembly processes and production controls (d) all inspection steps with associated methods This ensures that all future assemblies supplied by the manufacturer are manufactured according to procedures that are identical to those for which approval was granted All processes and procedures shall be verified and approved

  15. 6: Preparatory Conditions 6.1 – 6.6.6: ECSS-Q-ST-70-08 applies 6.6.7 Soldering irons and resistance soldering equipment a. ECSS-Q-ST-70-08 shall apply for “Soldering irons and resistance soldering equipment”. b. For surface mounted devices, the soldering tip shall not exceed 340 °C. NOTE Based on the component manufacturer’s recommendations, solder iron can be substituted by applying, for instance, hot air in order to avoid thermal shock.

  16. 6.6.8 – 6.6.9: ECSS-Q-ST-70-08 applies 6: Preparatory Conditions 16

  17. 6.7 Soldering Machines and Equipment 6.7.1 General • Machines and equipment used to solder surface mount devices shall either be: - dynamic single or dual solder wave, http://www.youtube.com/watch?v=WXLv7MNjGL0 - or be of the solder reflow type. http://www.youtube.com/watch?v=Axg72ih9Hwo Components may be: - leadless and leaded devices designed for surface mounting, - components initially designed for insertion mounting, b. The soldering machine shall be grounded in order to avoid electrostatic discharge. . Wave process Reflow process

  18. 6.7 Soldering Machines and Equipment 6.7.1 General (continued) c. The supplier shall ensure that the soldering conditions do not exceed the values given by the individual component data sheets (e.g. maximum temperature to avoid internal melting, removal of marking ink, degradation of encapsulating plastic). d. Temperature and time profiles for assembly shall be identified by the supplier and approved by the approval authority.

  19. 6.7.2 Dynamic wave-solder machines 6.7 Soldering Machines and Equipment(cont’d) Traditional conveyor wave-solder machine Selective wave-solder machine http://www.youtube.com/watch?v=WtYT-srb63A 19

  20. 6.7.2 Dynamic wave-solder machines 6.7 Soldering Machines and Equipment(cont’d) 20

  21. 6.7 Soldering Machines and Equipment (cont’d) 6.7.2 Dynamic wave-solder machines (continued) Fluxer Preheater Solder wave

  22. 6.7 Soldering Machines and Equipment (cont’d) 6.7.2 Dynamic wave-solder machines (continued) Selective wave-solder machine http://www.ersa.com/art-selective-soldering-344-4915.html

  23. 6.7 Soldering Machines and Equipment (cont’d) 6.7.2 Dynamic wave-solder machines (continued) Note: preheat is necessary to: • activate the flux • evaporate volatile solvents • reduce thermal shock Preheat

  24. 6.7 Soldering Machines and Equipment (cont’d) 6.7.3 Condensation (vapour phase) reflow machines 6.7.3(c ) use a reflow fluid whose boiling point is a minimum of 12ºC above the melting point of the solder being used. Fluid examples: Galden HP215 for SnPb http://www.solvaysolexis.com/producthide/0,,52519-2-0,00.htm Galden HP240 for Pb free http://www.solvaysolexis.com/producthide/0,,49357-2-0,00.htm

  25. 6.7 Soldering Machines and Equipment (cont’d) Click to run movie……..

  26. 6.7 Soldering Machines and Equipment (cont’d) 6.7.4 Hot gas reflow machines

  27. 6.7 Soldering Machines and Equipment (cont’d) 6.7.5 Shorted bar and parallel gap resistance reflow machines Shorted bar system (Fancort) Parallel gap electrodes

  28. 6.7 Soldering Machines and Equipment (cont’d) 6.7.6 Convection and radiation reflow systems (Most IR Reflow systems come under this category) Radiation heating Convection heating Convection and Radiation heating 6.7.6 b Preheat according to solder paste manufacturer recommendations 6.7.6 c Peak temperature minimum 12ºC above melting point of solder used (ie 195ºC for Sn63, 201ºC for Sn62 or 229ºC for SAC).

  29. 6.7 Soldering Machines and Equipment (cont’d) Reflow Click to run movie……..

  30. 6.7 Soldering Machines and Equipment (cont’d) 6.7.6 Convection and radiation reflow systems (continued) Note: this and the next slide provide general thermal profile data from different sources Time above liquidus: 30-60s Peak Temp: 20-35ºC above melt temp a Initial ramp 2-4ºC/s 90-180s @ 120-170ºC Example of Convection/Radiation Reflow Temperature Profile

  31. 6.7 Soldering Machines and Equipment (cont’d) Initial ramp: 2-4ºC/s (excessive: component shock and solder balling) Soak: 90-180s @ 120-170ºC (excessive: depletion of activators, solder balling and poor wetting; insufficient: flux fails to activate, poor wetting) Time above liquidus: 30-60s Peak Temp: 20-35ºC above melt temp = 203-218ºC for Sn63, 209-224ºC for Sn62 or 237-252ºC for SAC (excessive: dark flux residues, oxidised solder, intermetallic growth; insufficient: poor wetting, flux voids). Cooling: rapid cooling gives fine grain structure; too slow gives frosty or dull solder joints. Source: http://www.loctite.com/int_henkel/loctite/binarydata/pdf/elec_Chemistries_and_Thermal_Profiing.pdf General thermal profile data (continued)

  32. 6.7 Soldering Machines and Equipment (cont’d) Comparison of Heat Transmission Paths for Different Heating Methods

  33. 6.8 Ancillary equipment 6.8.2 Solder Deposition Equipment Equipment used to deposit solder pastes may be of a screening, stencilling, dispensing, roller coating or dotting type.

  34. 6.8 Ancillary equipment (cont’d) 6.8.6 Magnification Aids Refer to 13.1 13.1b. Inspection shall be aided by magnification appropriate to the size of the connections between 4X and 10X. 13.1c. Additional magnification shall be used to resolve suspected anomalies or defects.

  35. 6.8 Ancillary equipment (cont’d) 6.8.7 X-ray inspection equipment a. X-ray inspection shall not damage the components. b. X-ray equipment shall be calibrated in order to evaluate total dose received by the components during inspection. NOTE minimize dose given to component: • Record total dose received. • Use off-line image analysis as much as possible. • Use filters, optimizing direction of X-ray beam and masking sensitive areas. c. The resolution of X-ray equipment shall be able to detect solder balls having diameter of 0,03 mm. (Note, correction to spec required m  mm) d. The sensitivity shall be demonstrated by means of actual 0,03 mm diameter solder balls, stuck to adhesive tape, attached to multilayer board assembly being inspected. NOTE For guidelines, see C.4.3 and E.1 for X-ray inspection.

  36. Further info: http://www.avx.com/docs/techinfo/paramimp.pdf 6. Preparatory conditions (cont’d) 36

  37. 7: Materials selection 7.2 SOLDER 7.2.2 Composition: Table 7-1 Chemical composition of solders

  38. Annex E.2 Melting temperatures and choice

  39. 7: Materials selection(cont’d) 7.2.3 Solder Paste Solder paste consists of: solder balls + flux + solvent + gelling agent The solder ball size and flux percentage are selected depending on the process employed, ie screen, stencil or needle application.

  40. 7: Materials selection(cont’d) 7.2.4 Maintenance of paste purity a. When purchased premixed or mixed in house, purity of solder paste shall be maintained. b. Manufacturers’ instructions shall be applied for handling and storage of containers of solder paste purchased premixed. c. Refrigerated solder paste shall reach room temperature before opening the container. d. Neither paste purchased premixed nor paste mixed in-house shall be used if the use-by date or shelf life recommended by the manufacturer of the paste or paste constituents has expired. e. When the solder paste’s shelf life has expired (see ECSS-Q-ST-70-22 [11]), it shall not be used unless: 1. relifing is performed 2. tests that include visual inspection and viscosity measurements (according to the manufacturer’s recommendations) are passed successfully. f. When relifing is performed, and the material passes the specified tests, the new shelf life shall be half the initial shelf life.

  41. 7: Materials selection(cont’d) 7.3 Flux 7.3.1 Rosin based flux ECSS-Q-ST-70-08 shall apply for ‘Rosin-based flux’. 7.3.2 Corrosive acid flux ECSS-Q-ST-70-08, shall apply for ‘INH1 Corrosive acid flux’. 7.3.3 Flux controls for wave-soldering equipment A controlled method shall be established and implemented for wave-soldering machines such that the flux is not contaminated with remaining residues from previous non-space works.

  42. 7: Materials selection(cont’d)

  43. 7: Materials selection(cont’d) 7.8 Printed circuit substrates

  44. Warp & Twist from ECSS-Q-70-11 Table 4 Twist % = Max. twist in mm x 100 Length of the diagonal in mm Note: points A, B & C in contact with surface plate Warp % = Max. bow in mm x 100 Length of the PCB in mm For rigid multilayer warp & twist limits are: <1.1% for >1.6mm thick <1.5% for <1.6mm thick. This shall be measured as shown on a Surface Plate, with the maximum height measured to the underside of the board. e.g. If the warp is over a length of 100.0 mm, the maximum height for a 1.7 mm board will be 1.1 mm

  45. 7: Materials selection(cont’d)

  46. 7: Materials selection(cont’d) 46

  47. Thermal Coefficient of Expansion (CTE) Typical CTE Values in Electronics: glass or ceramic => 5 - 7ppm/°C FR4 x-y axis => 14 - 17ppm/°C FR4 z axis => 180ppm/°C Polyimide-glass x-y axis => 12 - 16ppm/°C Polyimide-glass z axis => 40 - 60ppm/°C Copper => 16 ppm/°C Aluminium => 24 ppm/°C Solder (Sn60) => 25 ppm/°C Dielectric, polytetrafluoroethylene (PTFE) or fluorinated ethylene propylene (FEP) => approx 160 ppm/degC Need for Stress Relief to accommodate differential expansion across 135deg DT (full sun to earth shadow) Or…. 300deg DT (room temp to soldering temp)

  48. 7: Materials selection(cont’d) 7.9 Components

  49. 7: Materials selection(cont’d) 7.9 Components 7.9.1 General (cont’d) c. Solder may be applied to the leads by hot dipping or by plating from a solution. d. Plated solder terminations shall be subjected to a post plating reflow operation to fuse the solder. e. The incoming inspection of each component batch shall include the verification of the termination composition (to avoid assembly of pure tin finish). f. Pure tin finish with more than 97% purity shall not be used. NOTE This is due to the possibility of whisker growth and transformation to grey tin powder at low temperatures.

  50. 7: Materials selection(cont’d) 7.9 Components 7.9.2 Active components • Active leadless devices (e.g. transistors, thyristors, diodes, and integrated circuit devices) shall be of a configuration incorporating sintered metal-on-ceramic terminations, solid- reflow termination pads integrated to the device body. • Axial leads, wire or ribbon non-axial leads shall be hermetically sealed. • Castellated chip carrier components shall have no discontinuities in the metallized terminal areas on the mounting pattern of the device.

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