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SNAP NIR Detector Packaging Development: Universal SiC Package

SNAP NIR Detector Packaging Development: Universal SiC Package. Bruce C. Bigelow Department of Physics, University of Michigan 30 June 2005. SiC NIR Package Design Issues. Neither vendor is producing a package we want to use for SNAP SiC is currently favored for focal plane components

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SNAP NIR Detector Packaging Development: Universal SiC Package

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  1. SNAP NIR Detector Packaging Development:Universal SiC Package Bruce C. Bigelow Department of Physics, University of Michigan 30 June 2005

  2. SiC NIR Package Design Issues • Neither vendor is producing a package we want to use for SNAP • SiC is currently favored for focal plane components • Need a package design that can accommodate either RSC or RVS designs • Main details are package size, connectors, and interface to FP B. C. Bigelow -- UM Physics

  3. Current Rockwell Package Design B. C. Bigelow -- UM Physics

  4. Current Rockwell Package Design H2RG package and mounting details B. C. Bigelow -- UM Physics

  5. Current RVS Package Dimensions B. C. Bigelow -- UM Physics

  6. Current RVS Package Raytheon Proprietary / Competition Sensitive B. C. Bigelow -- UM Physics

  7. UM SNAP NIR Package Design B. C. Bigelow -- UM Physics

  8. UM SNAP NIR Package Design B. C. Bigelow -- UM Physics

  9. UM SNAP NIR Package Design B. C. Bigelow -- UM Physics

  10. UM SNAP NIR Package Design B. C. Bigelow -- UM Physics

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