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GTK General meeting. Michel Morel CERN PH/ESE/FE. GTK assembly carrier equipped with µchannel cooling. Top view. Bottom view. GTK carrier assembly specifications. !! High speed serial links (6 Gb/s per chip) between the readout chips and optical transmitter modules

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Gtk general meeting

GTK General meeting

Michel Morel

CERN PH/ESE/FE


Gtk general meeting

GTK assembly carrier equipped with µchannel cooling

Top view

Bottom view

GTK General meeting Louvain M.Morel


Gtk general meeting

GTK carrier assembly specifications

!! High speed serial links (6 Gb/s per chip) between the readout chips and optical transmitter modules

µ via technology board is foreseen around the readout chips

Each readout chip powered by 3 different power supplies

High current in the power supplies (25A)

GTK General meeting Louvain M.Morel


Gtk general meeting

GTK carrier assembly Bloc Diagram

12 X 3.125 Gbps

Parallel Optical link

P CLK LVDS

GTK Readout ASIC

0

Precision CLK

OC-12

Receiver

SY89113U

Fanout Buffer

SO-3 & Ser Conf

ZL60113

TRANSMITTER

GTK Readout ASIC

1

Dig CLK LVDS

GTK Readout ASIC

2

Dig CLK

OC-12

Receiver

SY89113U

Fanout Buffer

SO-3 & Ser Conf

ZL60113

TRANSMITTER

GTK Readout ASIC

3

Ser Conf LVDS

GTK Readout ASIC

4

ZL60114

RECEIVER

S0-3 & Ser Conf

ZL60113

TRANSMITTER

Serial Conf

GTK Readout ASIC

5

12 X 3.125 Gbps

Parallel Optical link

GTK Readout ASIC

6

Reset LVDS

S0-3 & Ser Conf

ZL60113

TRANSMITTER

SY89113U

Fanout Buffer

RESET

GTK Readout ASIC

7

GTK Readout ASIC

8

JTAG

S0-3 & Ser Conf

ZL60113

TRANSMITTER

GTK Readout ASIC

9

A<3..0> Adress

Global_Reset

10 x Test input

-----------------------------

10 x SEU

10 x Temp Monitoring

10 x Test output

10 x 1V2 A

10 x 1V2 D

10 x 2V5 D

1 x 3V3

1 x 5V

Power Supplies

GTK General meeting Louvain M.Morel