3D Packaging Solutions for Future Pixel Detectors. Timo Tick – CERN 2.4.2009. Outline. Motivation Pixel detectors - Currently used packaging technology 3D packaging concept Trough Silicon Vias (TSV) TSV fabrication process
Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author.While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server.
Timo Tick – CERN 2.4.2009
9. Electroplate copper
1. Wafer with buried TSV landing pads
5. Deposit insulation and barrier
2. Deposit etch mask
6. Etch insulation
3. Etch vias
7. Reveal landing pads (active side)
4. Etch through insulation
8. Deposit field metal
Probing pads can be diced off for 2D tiling of structures.