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Agenda – THEMIS Review

3D PLUS COMPANY PRESENTATION THEMIS Project Review 7th April 2004 www.3d-plus.com 641, Rue Hélène Boucher 78532 BUC - FRANCE. Agenda – THEMIS Review. 15.30 Welcome 15.45 – 16.45 3D PLUS Presentation 16.45 – 17.30 Company Tour (2 groups) - Hi-Rel Facility - Industrial Facility.

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Agenda – THEMIS Review

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  1. 3D PLUSCOMPANY PRESENTATIONTHEMIS Project Review 7th April 2004www.3d-plus.com641, Rue Hélène Boucher78532 BUC - FRANCE

  2. Agenda – THEMIS Review • 15.30 Welcome • 15.45 – 16.45 3D PLUS Presentation • 16.45 – 17.30 Company Tour (2 groups) • - Hi-Rel Facility • - Industrial Facility

  3. Company overview • 3Dplusmission : • Design, manufacture and sell 3D modules for Active, Passive, Opto-electronics and MEMS components packagingin Hi-Rel and harsh environment electronic applications • 3DplusOffer : • Standard Products as well as Custom or Semi Custom Solutions. • Established on 1995, Independent • Technology and process are based on 3D PLUS's patents portofolio • 3Dplusis the only one in Europe to specialise in this technology. • Worldwide Rep network • Existing production capability: 20 000 High Rel. modules per year • Extension to 200 000 modules per year since Mid 2003 for Non Space • Markets

  4. Company – History • Created in 1995 by C. VAL who was previously member of scientist and technical council of Thomson Group • In 2001,3Dplusset up a subsidiary in Mc Kinney, Texas, USA. The head-quarter’s production Line was successfully evaluated/qualified by CNES, ESA and NASA. • In 2002,3Dplusreleased a increase of capital and built a new manufacturing plant in BUC, France for medium series manufacturing. • Quality: • ESA, CNES and NASA approval • Customers agreement • ISO 9001-(2000) certified in April 2003 • 3Dpluswill continue to strengthen its position in the following fields : • Space • Military / Aero • Niche Automotive and Industry • Medical • High Performance Computers, embedded Computers, Servers and Workstations, DIMM on Module Memory boards. • 3Dpluswill continue to set up partnerships with application specialists like Astrium, Alcatel, Hewlett Packard, Nortel, PNY, … to develop and offer state-of-the-art standard products.

  5. Company – Shareholders • Capital : 1 139 780 Euros • 3D PLUS is an independent Company

  6. Company – Locations 3DplusHead-Office, Design and Technology Center, High Rel. Manufacturing line qualified for Space Applications : 641, rue Helene-Boucher 78532 Buc, France 3DplusMedium Series Manufacturing Line : 423, rue Audemars 78532 Buc, France 3DplusUSA : Marketing and Sales Office for North America 2570 Eldorado Parkway, Suite 150 McKinney, TX  75070, USA

  7. Company – Key figures Annual Sales ( Million Euro) Annual Sales Market Split Annual Sales Product Split 2 % Sensors 5 %Power Supply and Misc. 6 % Camera 7 % Computer 80 % Memory

  8. Company – Organization Chart (1/3)

  9. Company – Organization Chart (2/3)

  10. Company – Organization Chart (3/3) People : 60 persons

  11. Company – Our Rep Network Canada Russia Netherlands Scandinavia Great Britain Germany China France USA Japan Spain Korea Italy Israël India Brazil Argentina South Africa

  12. 3D PLUS Standard Products MEMORY MODULES, COMPUTER MODULES, CAMERA HEADS, SENSORS, DC/DC CONVERTERS. CD-ROM Menu: Standard Product List, Flyers, Data sheets, User guides, Applications Notes, Starter Kits…

  13. Custom, semi-custom Products • Custom and Semi-custom Products • System In Package ( S.I.P ) • Hight density packaging with interconnection in 3 dimensions. • Drastic size, volume, weight reduction Calculation Core On this example, gain of : 14 times in weight , 16 times in volume

  14. TechnologyFlow Charts ( Flex Process ) 4 ) – Layers Stacking 5 ) – Cube Molding 1 ) - Flex Design 7 ) – Cube Plating ( Ni + Au ) 2 ) - Component attachment 8 ) – Circuit interconnection by laser grooving 3 ) - Circuit Test & Screening 6 ) – Cube Sawing 9 ) – Cube Test & Screening

  15. TechnologyFlow Charts ( TSOP Stacking Process) 4 ) – Cube Molding 6 ) – Cube Plating ( Ni + Au ) 1 ) – Package Selection and Procurement ( TSOP, CSP…) 7 ) – Circuit interconnection by laser grooving 2 ) – Modify Component Pins 3 ) – Components Stacking 5 ) – Cube Sawing 8 ) – Cube Test & Screening

  16. Main Features and Benefits The components are stacked up Size reduction on the PCB, weight savings for the application. The components are fixed into resin High mechanical resistance (vibrations, shocks, …) Humidity resistance enhancement The interconnection is reduced and Higher electrical performance, simplified electrical signal integrity The components can be shielded Considerable parasitic effect decrease, EM and Radiation tolerance enhancement Simplified Manufacturing processes Flexibility and short development time of new designs Cost effectiveness, short manufacturing lead times due to the use of simple and well proven technologies ‘Cold’ Plating Process compatibility with future lead free soldering processes used for the 3-D interconnection

  17. Qualification tests withstanded by 3D PLUS Modules ( Thermal Cycling ( Temperature Storage ( Endurance Testing ( Resistance to Humidity ( Mechanical Resistance ( Outgazing ( MIL-883 packaging tests for standard components

  18. Technology Vehicle Definition : Module : test vehicle integrating 4 TSOP 64 Mb, 8 chip capacitors, 8 chip resistors, 2 thermal sensors, 2 mechanical constraint sensors. Constitution : 10 internal layers + SMT connexion layer Dimensions : 26 * 15 * 16,2 mm Number of I/O : 114 Manufacturing : According to PID 3D PLUS “Process Identification Document – Technologie 3D” Ref. 3300-0546. Screening : According to PSS-01-608 Tests under approval of ESA, CNES and NASA. CORROSION CHIP Film 10 2x R 0505 2x R 1206 CONSTRAINT CHIP Film 9 TSOP 64Mb DRAM Film 8 TSOP 64Mb DRAM 2x C 0805 2x C 0805 Film 7 THERMAL CHIP Film 6 2x R 0505 2x R 1206 CONSTRAINT CHIP Film 5 Film 4 THERMAL CHIP 2x C Tantal Film 3 TSOP 64Mb DRAM 2x C 1210 TSOP 64Mb DRAM Film 2 Film 1 CORROSION CHIP Grid 0 3D Technology Evaluation (1/5)

  19. 3D Technology Evaluation (2/5) • Technology vehicle Description Flex 5 Flex 6 Flex 4 Flex 7 Flex 3 Flex 8 Flex 2 Flex 9 Flex 1 Flex 10 CESAR Module : 114 I/O

  20. 3D Technology Evaluation (3/5) • Evaluation flow-chart :

  21. TEST RESULTS All test results are satisfactory Evaluation successful and huge margins defined versus space qualification level requirements. Remark : Evaluation report written by ESA, CNES and NASA are available. Evaluation approval successfully pronounced by ESA, CNES and NASA 3D PLUS was introduced in NASA QPL Kick-Off for formal generic qualification 3D Technology Evaluation (4/5)

  22. Initiated in September 2001 under control of ESA and CNES Choice of 3 functional qualification type 3D modules Memory stack of 8 TSOP (SDRAM) Microcomputer DC/DC converter 4W Qualification phase : Approval of the formal 3D Plus PID Manufacturing of 12 modules of each type Qualification test sequence 3D Technology Evaluation (5/5) Memory Cube (8 stacked TSOP) DSP Computer Core DC/DC Converter 4 W

  23. Several Project/Product Qualification successfully passed since the beginning of 3D PLUS for COROT, CLUSTER II, PROBA, SMART 1, ROSETTA, MARS EXPRESS, ENVISAT… Successful Generic Evaluation by CNES/ESA/NASA on December 2001 See CNES/ESA Evaluation report (ESCCON 2002 – France) See NASA Evaluation report (ESCCON 2002 – France) Generic Qualification by CNES/ESA on 4Q2003 Final Presentation of the 3D qualification (Document ref. 3300-0563-3) will take place at ESTEC on 28th April 2004. Several Customer’s Internal Agreements in the Space Industry Successful ISO 9001-2000 Certification on April 2003 3D PLUS Technology, Processes and Products benefit from a large experience and a high quality referential 3D PLUS Technology Qualification

  24. Manufacturing and quality assurance of stack production Quality Assurance Documents • 3D PLUS Quality Manual • Generic quality process at 3D PLUS. • Process Identification Document • Freeze the qualified technological capability domain of 3D PLUS (i.e Process list, inspection criteria, material list, parts procurement rules, screening test, …) • Product Configuration Management : CADM • Module procurement specification • Product definition • Manufacturing travelers • Test specification • Product Assurance Plan • End Item Data Package : • Include all the traceability information (material, parts, operations, LAT,…) of the manufactured lot • As built/As design configuration list for the manufactured modules

  25. Quality levels and screening flow chart • Product Identification Document (PID) ref. 3300-0546-2 for : • Parts procurement, • Modules manufacturing, • Modules screening, • Lot Acceptance Test. The PID is compliant to ESA quality standard for Space applications. • Quality levels for Space applications : 3 quality levels are defined in 3D PLUS PID and described in the document ref. 3DPA0350 : • Commercial • Industrial => Engineering Models for Space applications • Space => Flight Models for Space applications

  26. 3D PLUS Standard Services For Space Application • Basic Parts Procurement and Selection (Lot Acceptance Tests) • Radiation Tolerance Verification Tests (Radiation Hardness Assurance activity of 3D PLUS includes Total Dose and SEU/SEL tests) • 3D Modules Manufacturing • 3D Modules Lot Acceptance Tests and DPA • End-Item-Data Package (full trace for manufacturig, screening, tests results, parts and material …) • 3D PLUS is the One-Stop Shop for Space Qualified Parts procurement

  27. 1997: First order of Memory Modules (Flex process) for Space Applications – Cluster 2 - ASTRIUM GmbH – Cooperation with IBM Product : Stacks of 10 Die 16Mb DRAM FPM from IBM (4 stacks mounted in an hermetic package) with a total capacity of 640Mb (40Mx16) ~1000 Flight Models manufactured for Cluster-2 / Envisat / Metop projects for ASTRIUM 1998: First order of Memory Modules (TSOP process) for Space Applications –Microsat Project - CNES Product : Stacks of 4 TSOPs 64Mb DRAM EDO from Samsung Capacity: 256Mb (32Mx8) 2000: 512Mb SDRAM Development for Space applications Product : Stacks of 8 TSOPs 64Mb SDRAM From Samsung ~5000 Flight Models manufactured For Radarsat (Canada), Cosmo/Skymed (Italy)  2001: Development of a Micro Computer module based on the TSC21020 DSP and replacing a double Euro Computer board ~50 Flight Models manufactured for Rosetta, Mars Express, Smart-1, Net-Lander (ESA) 2001 : Development of a micro camera for space applications ~50 Flight Models manufactured for Rosetta and Smart-1 3D PLUSHeritage for Space Applications (1/2)

  28. 2001: 16 Mb SRAM and 4 Mb EEPROM Development for Space applications ~1000 Flight Models manufactured For USA / Germany / France / Spain ... 2001: 2Gb SDRAM Development for Space applications 2002 Stacks of 8 TSOPs 256Mb SDRAM From Samsung and Elpida ~2000 Flight Models manufactured For Canada / Israel / USA / Argentina / Sweden / France... ~500 Flight Models manufactured for CryoSat & TerraSAR Projects with ASTRIUM GmbH 2002: Successful evaluation from CNES / ESA / NASA(GSFC) 2003 Stacks of 4/8 TSOPs 512 Mb SDRAM From Samsung and Elpida ~ 3500 Flight Models manufactured For Israel / Japan … 2003: Qualification CNES / ESA Today: 3D PLUS is involved in the major European space projects with the delivery of memory modules for Solid State Recorders as well as On-board Computers. 3D PLUSHeritage for Space Applications (2/2)

  29. ALCATELANURAGASIEOASTRIUMATMELBALL AEROSPACEBRISTOL AEROSPACECALCULEXCNESCNRSCONAECONRAD TECHNOLOGIESCONTRAVESCSEMDGADLRDORNIEREADS AIRBUSEADS SIEFERESAFORTFRAMATOMEGAIA CONVERTERSHEWLETT PACKARDHIGHWAVE OPTICALIAIIGG IMECINVAPISROLABENLATECOEREMBTMEDIGUSMERCURY COMPUTERSNASA (GSFC, JPL)NEOGUIDENORTELNT SPACEOPSITECHPHS MEMSPNYRICHARD WOLF ENDOSCOPESSAAB ERICSSON SPACESATRECISCHLUMBERGERSOPROSURREY SATELLITE TECHNOLOGYTECHNO SYSTEMSTECHNOLOGICATHALESUTMC - AEROFLEXVALEOWEDC Company – References

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