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Advanced Laser Technology Solutions for Precision Industrial Processing

Introducing cutting-edge laser technologies such as Synova Water Jet Laser, II-VI Lasertech Pico Laser, and II-VI Lasertech Fiber Laser for various industrial applications. These advanced tools offer superior precision, efficiency, and versatility in materials processing, including electronic components, diamonds, and special tools. Explore a range of capabilities from high-speed cutting to intricate wire EDM machining and hole dicing materials. View laser processing examples and learn about the benefits of these innovative solutions through detailed images and videos.

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Advanced Laser Technology Solutions for Precision Industrial Processing

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  1. 구성 1. 연혁 및 회사 사진소개 2. 시노바레이저 3. 피코레이저 4. 파이버레이저- 칩브레이커형상 5. 공구관련 6. EDM 7. 전자재료-hole dicing 재료사진 8. -? 색상은 로고색상을 기본으로 사용하면 됩니다.

  2. 1. 연혁 및 회사 사진소개

  3. 2.시노바레이저 ◀ Synova Water Jet Laser - Green 532nm wave length - 200W 32kHz - 50㎛ ~80㎛ No33k https://youtu.be/mqzGvSVbuiI 시노바레이저 특성- 일반 레이저에 비해 직진도가 우수함 taper지지않은 가공면이 장점 (유투브영상에서 캡쳐) 레이저 가공사진 (전자재료,다이아몬드재료)

  4. 3.피코레이저 ◀ II-VI Lasertech Pico Laser - Pico second Pulse - IR 1064nm wave length - 50W line/3D mode 레이저 가공사진 (Pig 소재가공)

  5. 4.파이버레이저- 칩브레이커형상 ◀ II-VI Lasertech Fiber Laser - IR 1064nm wave length - 100W 4200m/sec 레이저 가공사진 (PCD chip breaker)

  6. 5.다이아몬드 특수 공구관련- 기존 카다로그 내용 그대로 사용

  7. 6.EDM Wire cut electric discharge machine (와이어컷 방전가공기 -diamond PCD , PCBN, WC, metal cutting - tolerance±0.01mm EDM 가공사진

  8. 7. 전자재료-hole dicing 재료사진

  9. Diamond 상태도

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