HCC – present status. Original estimate of device size was 3.5mm x 3.5mm (area ~ 12.25mm 2 ) All costing based on this size Any changes in area can impact upon price... Lots of progress now made BUT device is coming in with 117 bond pads (see below)
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As of today – needs to be checked
Chip area ~ 13.5mm2 (10% oversize compared to original)
Does it fit on a hybrid? Appears to with no change to hybrid geometry
ABC130 TTC Bus yet to be routed
PLL and Bandgap Decoupling
Power Supply decoupling (100nF and 1µF)