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ICT Test Probes

The ICT Test Probes have the high heat accuracy power and durability that delivers the accurate testing result, mainly used in the ICT test fixture. For more detail, visit http://equip-test.com

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ICT Test Probes

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  1. What is an ICT Test Probes? The ICT test probes are the test probe for centers from 50 mil to 100 mil with a vast collection of different tip styles and contact pressures for almost all test requirements. For the 2-level adaptation, test probe units with a longer test probe travel are available. Receptacles with a press ring can be supplied for this series of combination. The press ring also allows variable heights if the press ring is pressed into a defined setting in the take-up drill hole. This press ring can be used as a stop to achieve a constant extension height in the adapter. The ICT receptacles are available for various types of connections. In addition to these standards, PTR also offers metric types for the ICT/FT. In this case, the receptacles are normally pressed into the take-up drill hole as far as the stop. Here, too, test probe barrels with different collar heights allow variable extension heights in the adapter. To interface the main tester with the particular board under test the requirement of ICT test probe occurs. It will have a main connector that interfaces to the tester and wires that are taken from the connector to individual pins / probes that make contact with the required nodes on the board under test. The probes are placed in a base board. There are various series of ICT test probe depending on the tip size, mechanical features, electrical features, materials used and the diameter of drill. The tip size is different in form of diameter and plating. All components on the PCB are measured during ICT. It is possible to undertake a very comprehensive form of printed circuit board test by using the ICT test probe, by determining that the circuit has been manufactured correctly. It provides a useful and efficient form of printed circuit board test by measuring each component. It can easily detect the manufacturing defects and its program generation is easy.

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