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Topic 4: Digital Circuits

Topic 4: Digital Circuits. (Integrated Circuits Technology) Part two. Logic Levels: Practical Scenario. The two sets of levels are motivated by these scenarios. Scenario 1: Source outputs logic high at lowest threshold, V OHMIN. Scenario 2:

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Topic 4: Digital Circuits

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  1. Topic 4: Digital Circuits (Integrated Circuits Technology) Part two

  2. Logic Levels: Practical Scenario • The two sets of levels are motivated by these scenarios Scenario 1: Source outputs logic high at lowest threshold, VOHMIN Scenario 2: Source outputs logic low at highest threshold, VOLMAX

  3. DC Loading • The output high and low limits are exceeded only if a device output is heavily loaded. Logic device loading is specified by • maximum current • Fanout := max. number of similar devices that can be connected to a load without exceeding high and low state current limits Current Specs

  4. DC Loading: Current specs • Scenario 1: Output high connected to more than one sink. The current outputted by the source increases with the number of sinks.Io = Iinj = nIin (for n similar sinks) • Scenario 2: Output low connected to more than one sink. Note that the current now flows into the output terminal (logic source becomes a current sink). Again current increases with the number of logic sinks. Io = Iinj = nIin (for n similar sinks)

  5. Each gate input requires a certain amount of current to maintain it in the LOW state or in the HIGH state. IIL and IIH These are specified by the manufacturer. DC Loading: Fanout • Fanout calculation • Low state fanout, nFlow:= maximum number of similar gates that can be driven low so that Vo < VOLMAX • High state fanout, nFhigh:= maximum number of similar gates that can be driven high so that Vo > VOHMIN • Need to do current loading calculation for non-gate loads (LEDs, termination resistors, etc.)

  6. AC Loading • All gate outputs have associated parasitic capacitances due to external wiring (including their gate pins) as well as internal semiconductor storage effects (junction capacitances). In addition there are parasitic capacitances associated with each gate input. Typically the capacitance component due to IC pins is of the order of 10-15pF. • The final transistor which drives the gate output acts as an electronically controlled switch with a pull-up to Vcc.

  7. 3. CMOS Technology • Static complementary CMOS - except during switching, output connected to either VDD or GND via a low-resistance path • high noise margins • full rail to rail swing • VOH and VOL are at VDD and GND, respectively • low output impedance, high input impedance • no steady state path between VDD and GND (no static power consumption) • delay a function of load capacitance and transistor resistance • comparable rise and fall times (under the appropriate transistor sizing conditions) • Dynamic CMOS - relies on temporary storage of signal values on the capacitance of high-impedance circuit nodes • simpler, faster gates • increased sensitivity to noise

  8. PMOS transistors only pull-up: make a connection from VDD to F when F(In1,In2,…InN) = 1 pull-down: make a connection from F to GND when F(In1,In2,…InN) = 0 NMOS transistors only 3.1. CMOS Circuit Topology • Pull-up network (PUN) and pull-down network (PDN) VDD In1 In2 PUN … InN F(In1,In2,…InN) In1 In2 PDN … InN PUN and PDN are dual logic networks

  9. b) Dual PUN and PDN • PUN and PDN are dual networks • DeMorgan’s theorems • (A + B)’ = A’.B’ • (A.B)’ = A’ + B’ • a parallel connection of transistors in the PUN corresponds to a series connection of the PDN • Complementary gate is naturally inverting (NAND, NOR, NOT) • Number of transistors for an N-input logic gate is 2N

  10. CMOS Complements

  11. PDN PUN

  12. CMOS inverter 3.2 Examples of CMOS Gates VDD = 5V Vi Q1 Q2 Vo 0(L) OFF ON 5(H) 5(H) ON OFF 0(L) Q2 p-channel Vo Vi Q1 n-channel

  13. CMOS NAND • Use 2n transistors for n-input gate • p-channel in parallel, n-channel in series • Add output inverter to convert to AND

  14. CMOS NOR • Like NAND -- 2n transistors for n-input gate • p-channel series, n-channels in parallel

  15. NAND NOR NAND vs NOR • For a given silicon area, PMOS transistors are have higher ON resistance than NMOS transistors => Output High voltage is lower due to series connection in NOR. • NAND output LOW voltage is not as badly compromised • Result: NAND gates are preferred in CMOS.

  16. CMOS characteristics • Essentially no DC current flow into MOS gate terminal • Gate has capacitance, C which MUST be charged then discharged for switching • Required power is CPDV2f; where f is switching frequency, CPD is the power dissipation capacitance • Very little (0(nA)) current in output chain, except during switching when both transistors are partially on • More power required when signal rise times are small since transistors are on longer • Symmetric output structure ==> equally strong drive (IOH, IOL) in LOW and HIGH states • This is why.. • Power dissipation in PCs increase with clock frequency • There is a lot of research on low voltage logic devices (5V, now 3.3V common)

  17. CMOS families and typical specifications • VOHMIN=VDD-0.1V, VIHMIN=0.7Vcc, VILMAX=0.3VDD, VOLMAX=0.1V • 3V  VDD  18V (original 4000 family), 2V  VDD  6V (newer HC family) • Input source and leakage currents: <1A • Output current: typically 4mA but can be as high as 24mA • Families: original 4000 family (slower, lower power dissip.) • 74FAMnnn: FAM = family type, nnn=function number – faster • 54FAMnnn: same as 74FAMnnn but for military apps. • FAM : HC (High Speed CMOS), HCT (HC TTL compatible), VHC/VHCT (Very High speed), FCT/FCT-T(Fast CMOS TTL compatible/ with TTL VOH) • Egs: 74HC04 – hex inverter. IOLMAX=20  A, IOHMAX=-20A. • NB: Special handling precautions hold as CMOS can be damaged by very a small electrostatic discharge

  18. Vcc Vcc R R R IN1 IN2 OUT L L L L H L H L L H H H IN1 IN2 OUT L L H L H H H L H H H L IN1 IN1 OUT IN2 IN2 Vi OUT 4. TTL = Transistor-Transistor Logic. Uses bipolar transistors and diodes Diode Logic AND gate Problem… defined levels change easily when loaded. E.g. when diode gates are cascaded. Need for transistor buffering NAND gate!

  19. Dynamic resistance: lower ON (L) voltage, faster switching Limits current in transition Diode AND gate Totem Pole Output TTL: practical realisation Schottky Diodes Clamp diodes

  20. TTL Logic families and specs • Vcc=5V±10%, Vohmin=2.7V, Vihmin=2.0V, Volmax=0.5V, Vilmax=0.8V •  NMh = 0.7V, NML=0.3V • Families: TTL e.g. 7404, 74H04, 74L04 original family • Schottky e.g. 74S04: faster, hi power consumption • Low Power Schottky e.g. 74LS04: lower Pd, Slower Schottky (common) • Advanced Schottky e.g. 74AS04 2x speed of S, same Pd • Adv. Low Pwr Sky e.g. 74ALS04 • see table 3-11, Wakerly • For LS, typically: IILmax=-0.4mA, IIHmax=20uA, IOLmax=8mA, IOHmax=-400uA. • FANOUT (LSTTL into LSTTL)=20 • NB: TTL outputs can sink more current than they can source.

  21. TTL vs CMOS

  22. VOHMIN, VOLMAX VOHMIN, VOLMAX VIHMIN, VILMAX VIHMIN, VILMAX 4.9 3.5 2.0 2.7 1.5 0.5 0.8 0.1 CMOS TTL TTL CMOS Applications: CMOS/TTL interfacing    

  23. 5. Applications: Unused inputs Floating inputs can lead to unreliable operation!!! Unused (Floating) Inputs [] Tie together and bundle with used inputs OR [] Tie HIGH thru pull up resitor, Rpu OR [] Tie LOW thru pull down resistor, Rpd [] For CMOS use 1K-10K values [] For TTL calculate based on # of inputs tied thru resistor so that: Vcc-RpuIIHmax > VIHmin RpdIILmax < VILmax []Too small Rpu makes TTL susceptible to spikes etc. over 5.5V. See Sec 3.10.4, 3.5.6 Wake. Must ensure that does not affect design function. E.g. tie HIGH for AND/NAND or LOW for OR/NOR

  24. Power supply filtering • For each logic IC place a small capacitor (0.01uF tp 0.1uF) across Vcc and ground in close proximity to the IC • Reduces transient effect of switching on power supply, particularly when supply source is connected via long circuit path (resistive and inductive effects). Essentially each capacitor provides a local reservoir for fast supply of charge required when the device switches

  25. Vcc Vcc A B Q1 Q2 Z 0 0 open open 1 0 1 open ON 1 1 0 ON open 1 1 1 ON ON 0 Applications: Open-drain (CMOS) or open collector (TTL) outputs • In CMOS no PMOS transistor, use external pull-up resistor for Vcc drive Calculate external Rpu so that VOLMAX achieved at IOLMAX. Must include other loads so this gives minimum Rpu. Rpu IC Z A Q1 B Q2 Output stage of Open Drain NAND

  26. Why ? • Slightly higher current capability • Can form an open-drain/collector bus. Can select data for access to common bus.. E.g for Dataout = Datai set Enablej =0, jI, Enablei =1, Problem -- really bad rise time due to all O/P capacitances in parallel and large pullup.

  27. Vout EN EN Vin Vout 0 x HiZ 1 1 0 1 0 1 Applications: Bus Access - Contention and Tristate Logic Common bus Best “fix”…. Tristate logic Vin 0 1 a 1 b ?? 0 “regular TTL or CMOS • Get bus contentionwhen two outputs try to drive the bus to different states. • Value on the bus may be indeterminate; • Damage possible (a driving b!!) • On a PC data bus, can cause PC to crash • Available in inverting or non-inverting .. Sec 3.7.3 Wakerly. • NO Pull-up needed • NO degradation in transition speed

  28. Applications: Digital meets analog Schmitt Trigger Inputs…Sec3.7.2/Wakerly • Schmitt trigger devices are used primarily to deal with signal levels which are not at valid logic levels. They can therefore be used for • interfacing noisy analogue signals to a logic circuit e.g. signals from switches, RC networks etc. • interfacing slow signals (i.e. signals which remain in the invalid range for relatively long periods) • regenerating degraded logic signals e.g. signals on a long serial communication line. Schmitt trigger devices do comply with the input thresholds of the respective family. However, they employ a bit of hysterisis (memory!!) to take care of invalid signal levels. The devices are characterised by upper and lower thresholds (UT, LT). When the input exceeds UT it is treated as a logic 1 UNTIL it goes below LT. Then, and only then, is it treated as a logic 0. Vo VT Vi VL VH Schmitt Trigger o/p Characteristic Standard logic o/p Characteristic

  29. Vcc R Logic Device Applications: Logic Drive • ILED is 10mA typically worst case • Use formula: • VOL+VLED+(ILED*R)=VCC • to determine R. • NB……. • Can assume worst case VOL=VOLMAX for some CMOS as well as TTL at IOL=ILED. • Best to use device for which IOLMAX>ILED. Driving a LED with TTL ILED VLED VOL Low output turns LED ON Drive current typ 5 -10mA Use buffers for extra drive

  30. Vcc Free-wheeling diode protects electronics from coil back emf Logic Device Low output turns activates relay or solenoid Applications: Logic Drive • 5V relays do exist. • Some incorporate the free wheeling Diode. • Most have enough internal resistance to operate directly as shown. • Check using LED computation if built in resistance is sufficient or if an external series resitance is needed Driving a Solenoid or relay with TTL

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