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Embodiment 1: Large die 를 위한 새로운 TMV 구조 TSV version TVM RDL for die backside metallization

Embodiment 1: Large die 를 위한 새로운 TMV 구조 TSV version TVM RDL for die backside metallization. RDL. TSV. Embodiment 2: Method for large Die size TMV Narrow pitch I/O with Post or Stud. Stud or Post. Grinding. interposer. No laser via. RDL. Embodiment 3:

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Embodiment 1: Large die 를 위한 새로운 TMV 구조 TSV version TVM RDL for die backside metallization

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  1. Embodiment 1: • Large die를 위한 새로운 TMV구조 • TSV version TVM • RDL for die backside metallization RDL TSV

  2. Embodiment 2: • Method for large Die size TMV • Narrow pitch I/O with Post or Stud Stud or Post Grinding interposer No laser via RDL

  3. Embodiment 3: • Top ball pad를 마스킹후 Chip attach 공정  UF 공정 실시 • No risk of RBO • Maximize die size • No risk of contamination on ball pad film underfilling Film Striping

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