Simulation of Nanoparticle Incorporation during Electrocodeposition Process

1. Simulation of Nanoparticle Incorporation during Electrocodeposition Process

2. Abstract Electrocodeposition is the process in which nanoparticles are absorbed and plated into a metal film. The growth of an electrodeposited film along the electrode is controlled by the local current density affected by the presence of an insulating particle during electrocodeposition. The objective of this research is to simulate using COMSOL the incorporation of a particle by the growing metal film for primary, secondary, and tertiary current distributions. Future work includes coupling COMSOL with NIMROD to study how different process variables such as particle properties and deposition conditions affect the formation of thin metallic nanoparticle coatings.

3. What is “nano” and why is it important? Applications Aerospace Automotive Construction Power Generation UCSD Nanoengineering Smaller, Stronger, Faster, Lighter Materials reduced to the nanoscale can show different properties compared to what they exhibit on a macroscale, enabling unique applications. For instance, opaque substances become transparent (copper); stable materials turn combustible (aluminum); solids turn into liquids at room temperature (gold); insulators become conductors (silicon). A material such as gold, which is chemically inert at normal scales, can serve as a potent chemical catalyst at nanoscales. Much of the fascination with nanotechnology stems from these quantum and surface phenomena that matter exhibits at the nanoscale. UCSD Nanoengineering Smaller, Stronger, Faster, Lighter Materials reduced to the nanoscale can show different properties compared to what they exhibit on a macroscale, enabling unique applications. For instance, opaque substances become transparent (copper); stable materials turn combustible (aluminum); solids turn into liquids at room temperature (gold); insulators become conductors (silicon). A material such as gold, which is chemically inert at normal scales, can serve as a potent chemical catalyst at nanoscales. Much of the fascination with nanotechnology stems from these quantum and surface phenomena that matter exhibits at the nanoscale.

4. What is electrocodeposition? Electrocodeposition (ECD), the process of particle incorporation during electrolytic deposition, forms composite films from baths containing a dispersion of fine particles. Anode (+), Cathode (-) Applied DC current to cathode e.g. Cu Metal Al203 (aluminum oxide) nanoparticle copper sulfate bath Anode (+), Cathode (-) Applied DC current to cathode e.g. Cu Metal Al203 (aluminum oxide) nanoparticle copper sulfate bath

5. What is COMSOL?

6. Sample Simulations

7. Real-time Sample Simulation

8. COMSOL Modeling Steps 1. Creating or importing the geometry 2. Meshing the geometry 3. Defining the physics on the domains and at the boundaries 4. Solving the model 5. Postprocessing the solution 6. Performing parametric studies.

9. Geometry and Mesh

10. Arrow plot at time=0

11. Level Set Method at time=0

12. Future Work Simulate evolution of a growing films for the effects of a conducting particle versus a non-conducting particle Study evolution when another particle, conducting or non-conducting is added. Couple Nimrod with COMSOL using COMSOL Script and perform parameter sweeps

13. Acknowledgements Dr. Jan B. Talbot-UCSD Dr. David Abramson-Monash Lab Members at DSSE-Monash NSF, Calit2 PRIME, Dr. Peter Arzberger, Dr. Gabriele Wienhausen ,Teri Simas