BGA package underfill, BGA package underfill
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in industrial adhesives for semiconductor,home applicance and electronic applications and surface protection materials for chip packaging and testing. Based on the core technolo- gy of adhesives, DeepMaterial has developed industrial adhesives for chip packaging and testing, circuit board-level adhe- sives, and adhesives for e