五、 照相手機 CCM 模組 SMIA 標準

1. 五、照相手機CCM模組SMIA標準

2. SMIA (Standard Mobile Imaging Architecture) • Specifications of camera modules for provision of mobile device manufacturers’ convenience for mounting of a module in mobile phones, by functionally or optically standardizing operation performance of camera modules • SMIA is proposed by Nokia and ST-Microelectronics on 1st.07.2004. • It is possible that SMIA will be part standard of MIPI(Mobile lndustry Processor lnterface)

3. SMIA Overview • Making a Raw Bayer Sensor Module easier to integrate in a system to create a ‘camera’. • Creating a standard applicable to a wide range of sensor resolutions and frame-rates, to proliferate a family of ‘like’ modules with known upgrade paths. • Improving design and verification cycles. • Enabling true second sourcing of sensor modules.

4. Interface of SMIA standard □CCP2 (Compact Camera Port 2) CCP2 is a 4-wrie Low EMI SubLVDS data link. The maximum data rate is 650 Mbps. This is sufficient to support readout of an image of up to 2 Mega Pixels in a 1/30th of a second using the RAW8 CCP2 mode. It fully defines the sensor modules electrical, control and image data interfaces. □CCI (Camera Control Interface) The 2-wire camera control interface is I2C compatible. The maximum data rare is 400 kHz. • Low frequency external clock (6-27MHz) • Chip enable signal - XSHUTDOWN • Analogue Power • Digital Power

5. SMIA 六大範圍 1.The functional specification: frame and field formats, register maps for set-up and control and has three profiles that helps easy video usability with high resolution sensors. 2.The electrical interface: the physical layer (voltage levels, pin-count, timing), data rate (up to 650Mb/sec), EMI (electro-magnetic interference) performance, and output image format. 3.The mechanical interface proposes a family of set of modules that provide mechanical outlines specifically designed for volume manufacturing. 4.The characterization chapter provides for optical-performance metrics and sensor noise standards. 5.The reliability chapter includes environmental-test and drop-test standards. 6.A software model is also provided in the SMIA specification, including reference devuce drivers and software architecture. Source: SMIA/2004

6. SMIA (Functional specification) SMIA 1.0 Part 1: -Electrical Interface– inculding pin out Functional -Operating Modes– how to power up and down the specification module -Data format, and data arrangement -Video Timing, cropping and decimation modes -Integration Time and Gain Control -Reporting of Sensor capabilities and key performances (e.g. Color Matrix) -Test Modes -CCI Register Map -A baseline profile -Image Scaling profiles to aid software viewfinder implementations -Image Compression -Recommended Host Behavior Source: SMIA/2004

8. System State Diagram

9. Operating Modes

10. Sensor Module / Host Electrical Interface

11. SMIA (Electrical Interface) • Signal List • 12/14/16 Pin Out options • Electrical characteristics of EXTCLK and XSHUTDOWN • Operating Conditions • Absolute Maximum Ratings • Power Consumption Source: SMIA/2004

12. 16-Pin Standard Support Circuit Source: SMIA/2004

13. Electrical Specification and Environmental Requirements Table12: Operating Conditions 3.Digital Inputs: EXTCLK, XSHUTDOWN, SCL, SDA 4.Test Temperature – image quality test conditions 5.Optimum Operating Temperature – no visible degradation in image quality 6.Normal Operating Temperature – camera produces acceptable images 7.Functional Operating Temperature – camera fully functional

14. SMIA (Mechanical interface) Source: SMIA/2004

15. SMIA (Camera Characterizations Specification) • A set of measurement methods and limits for assessment of camera module performance -noise performance -optical performance 5.1 Dynamic Range 5.2 Vertical Fixed Pattern Noise 5.3 Horizontal Fixed Pattern Noise 5.4 Temporal Noise 5.5 Column Noise 5.6 Row Noise 5.7 Frame to Frame Flicker 5.8 Dark Signal 5.9 Dark Signal Non-uniformity 5.10 Power Supply Rejection Ratio 5.11 Signal to Noise Ratio 5.12 Sensitivity 5.13 Maximum Illumination 5.14 Minimum Illumination 5.15 Module Response Non-Linearity 5.16 Photo-Response Non-Uniformity 5.17 Relative Illumination 5.18 Spatial Frequency Response 5.19 Image Sharpness Measurement 5.20 TV Distortion 5.21 Field of View 5.22 Color Accuracy 5.23 Image Lag 5.24 Veiling Glare Source: SMIA/2004

16. SMIA Reliability—(Group A&B) • Lot Acceptance Tests (Group A)lot based on statistically meaningful sampling plan. A1,Electrical Characteristics A2,Mechanical Characteristics A3,Optical Characteristics A4,Shipping Packages and Labels • Reliability Monitoring Test (Group B) B1,High Temperature Operating Life Test / Early Life Failure Rate Estimation B2,Temperature & Humidity Stress Test - B2.1 Temperature Cycling - B2.2 Damp Heat Cycling - B2.3 Mechanical Impact Tests - B2.3.1 Shock Test Source: SMIA/2004

17. SMIA Reliability—(Group C) Research & Development Level Test (Group C) C1: Do B1 Test Again C2: Combination Test; Test B2 + (B2.2and B2.3) C3: High Temperature C4: Random Vibration C5: Latch Up Test C6: Steady State Temperature Humidity Bias Life Test C7: High Temperature Operating Life Test C8: Low Temperature Operating Life Test C9: Solar Radiation Test Source: SMIA/2004

18. C9: Solar Radiation Test • The purpose of C9 test is to verify the effects of solar radiation exposure to the camera modules, especially to lens and IR glass. Test samples shall be tested in its non-operating mode. - Test Temperature: 55 deg.C during irradiation cycle, 25°C during dark cycle -Irradiance: 1120W/m2 -Test Duration: 8hours for irradiation and 16 hours for darkness (=1 cycle) -Sample Size: Minimum 10 pcs -References: IEC 60068-2-5 Sa, Procedure A

19. SMIA Reliability –(Group D) Mechanical Tests for Connection Systems (Group D) • D1 Vibration Tests D1.1 Random Vibration EUT Power On D1.2 Bump Vibration (half cycle sinusoidal) • D2 Pull-Out Test (Camera Module from the Socket In case Applicable) • D3 Peel-Out Test of the FPC (in Case Applicable) • D4 Module Insertion Test • D5 Flex Bending Test • D6 Connector Quality Check • D7 Mechanical Impact Tests D7.1 Free Fall Test for Module + Socket (Including Connector) D7.2 Free Fall Repeated Test for Module + Socket (Including Connector) Source: SMIA/2004

20. SMIA (Software model) Source: SMIA/2004

21. 六、CCM模組SMIA測試範例 Sensitivity Dynamic Range Color Accuracy

23. Sensitivity Test Methods 1. Sensitivity is a measure of the response of a camera module to a stimulus of known brightness (luminance). The sensitivity of the module is taken to be white-light sensitivity to a standard source of measured luminance. 2. The white-light sensitivity of a Bayer patterned color is best evaluated in terms of the color channels (RGrGbB). Given that the color response of the module is be characterized elsewhere, the sensitivity to light levels can be assessed using one color channel only (e.g. Green) without loss of information on module performance. 3. The sensitivity of a module can be measured by taking the difference between an illuminated frame and a dark frame, captured with the same integration time.

24. Sensitivity Test Conditions Table26: Sensitivity Test Conditions Table13: Default Lighting Conditions

26. SMIA Illumination Specification

27. Mathematically the sensitivity of the device is given by 1 μ( image 1) - μ( image 2) （ ） Sensitivty (1/cdm-2 ‧sec) = FSD‧B Tint Analysis FOR ALL LUM AND INTEGRATION_TIME VALUES ARRAY1 = ROI (a,a;x,y; GREENRED(FRAME_LUM(T))) ARRAY2 = ROI (a,a;x,y; GREENRED(FRAME (T))) SENSITIVITY_LUM = (MEAN(ARRAY1)- MEAN(ARRAY2))/ (LUM_LEV*INTEGRATION_TIME*FSD) END FOR Repeat process until luminance range complete Where the means are taken from image 1, the image of an object of luminance B (Cd/m2), and Image 2, the image taken in the dark.

28. Dynamic Range Test Methods • Description：The dynamic range of a camera module is a measure of the range of light levels that may be present within one scene and reproduced faithfully. The upper useable limit of the light response of the camera is termed the full-scale deflection (FSD) of the camera. The minimum discernable response is taken to be at one standard deviation of the noise. • Test Conditions (如次表) • Analysis： The dynamic range is usually expressed logarithmically in terms of power levels and is stated mathematically as follow; Dynamic_Range=20xLOG10(FSD/STDEV(IMAGE))

29. Dynamic Range Test Conditions

30. Dynamic Range • Dynamic range interpreting the ability of detecting the strong and weak light at same time Low dynamic range High dynamic range (120dB)

31. Dynamic Range Test 測量輸出飽和電壓與 雜訊電壓

32. Color Accuracy Test Methods This test measures the absolute color difference (in CIELAB (1976) color space) and the Hue difference, between a reference color patch from a GretagMacBeth Color Checker illuminated under specific lighting conditions and the camera’s output. The color difference and the hue difference (abE*△*H △) may be calculated as follows:- √ ΔE*ab = (ΔL*)2 + (Δa*)2 + (Δb*)2 And ΔH* = (ΔE*ab)2 - (ΔL*)2 – (CPatch – Ccolorimeter) Where Cn = an2 + bn2 √ √

33. Table37: Color Accuracy Test Conditions

34. Using the set up shown in Figure 7 capture a Bayer image of the White Macbeth patch with the sensors’ integration time adjusted to give 90% FSD. Use this integration time to capture a Bayer image for each of the other GretagMacbeth color patches. Record the Yxy color value for each patch using a Colorimeter eg. Minolta CS100.

35. Macbeth Characterization with Color Chart

36. Having captured the images, all the process shown in Figure 8 must be followed to convert the data into CIELAB color space.For the colorimeter data this is a straightforward conversion using XYZ 1931 CIE (tri-stimulus) values for each color patch referenced to the white patch value, before its conversion into CIELAB color space.Conversion of Colorimeter Data from Yxy Values to XYZ 1931 CIE Tri-stimulus. x X = ( )‧Y Y = X Z = ( )‧Y y 1 - ( x - y ) y

37. COLOR CORRECTION • Color correction refers to matching the response of the imager with that of the display system, and correcting for filter leakage and cross-talk • Typically carried on independently on a pixel-by-pixel basis (order of matrix = 3x3 ) • Color is checked against Macbeth color chart (24 different colors) to estimate the matrix and offset coefficients by minimizing an error function

38. 影像IC (FSD)

39. 日本消費者需求調查

40. 結論與建議 • 前全球主要品牌大廠中，包括Nokia、Motorola、Sony-Ericsson、Siemens、Philips均已大量將產品外包給ODM業者，預期此趨勢仍將持續。 • 汽車相機圖像晶片與CCM市場：汽車廠商面臨壓力，需要提高汽車的安全性和易用性，正開發相機輔助操控、車道偏離警告系統、自動巡航控制和乘員探測功能，而這些功能都要靠CCM之輔助。 • 日本廠商因擅長高精密技術與光學高度之整合調製功力，不僅在技術搶得領先，日系業者間之市場默契也是非日系業者所能及。 • 台灣業者較晚進入CCM這塊市場，憑藉著cost down能力與隨機應變之技巧，在需要大量邁入低價化與手機產品生命週期短於半年之影響下，預期將有很大競爭優勢。