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Pixel Upgrade Status and Plan G.M. Bilei Firenze Mar. 6 th 2013

Pixel Upgrade Status and Plan G.M. Bilei Firenze Mar. 6 th 2013. Introduction and news. The Pixel project is progressing pretty much according to the plan ROC PSI46dig / TBM08 submission was done in early January 2013. - expect wafers (6) back in first half of April 2013

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Pixel Upgrade Status and Plan G.M. Bilei Firenze Mar. 6 th 2013

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  1. Pixel Upgrade Status and Plan G.M. Bilei Firenze Mar. 6th 2013

  2. Introduction and news • The Pixel project is progressing pretty much according to the plan • ROC PSI46dig / TBM08 submission was done in early January 2013. - expect wafers (6) back in first half of April 2013 - plan to order 24 additional wafers (delivery mid May) (enough for 3-4wafers for each production center) • Digital Test Boards will be produced by PSI (requested 15 for INFN) - Need to identify for each consortium one contact person to become expert in maintaining them and support the consortium. Look for volunteer • High rate Test Beam at FNAL with digital ROC this summer - Good opportunity to contribute and learn. As INFN we should participate.. • Pixel TDR Document now available, one per institute. G.M. Bilei

  3. 2013 Pixel activities and goals Many tasks to accomplish in 2013: • CO2 cooling plant & piping • Install extra LV-power cables for BPIX layer 1 (CAENPP1) • Submission of digital TBM & ROC (PSI46dig) for Pilot System • Production masks for PSI46dig ROC (BPIX Layer 2-4, FPIX) • Production of Pilot System and integration into present FPIX • Production of BPIX Supply Tubes & Mechanics for installation tests • Installation test without beam pipe • BPIX Supply Tube protoytpe with sector test of all electrical boards • Preseriesdigital pixel modules with full functionality (sensor, HDI, cables, BB) • High rate test pixel test beam at FNAL G.M. Bilei

  4. INFN plan and objectives for 2013 • Complete construction of 8 old modules with analog ROC at IZM - All parts are available. IZM delivery very soon - Complete setups and qualification of INFN production centers • Evaluate, qualify together with KIT the Selex BB process and reassess cost. • Select Bump Bonding vendor (IZM, Selex) by September at latest. • Set up new readout systems for digital ROC in the lab and get experience • Construction of few prototypes of new digital pixel modules • Preparation for mass construction (new readout cards, database, software analysis etc.) • Possibly participate to the FNAL high rate test beam in summer G.M. Bilei

  5. INFN draft Pixel schedule 2013 Milestone INFN Gruppo I Pixel Upgrade 1/12/2013Realizzazioneprimiprototipinuovi moduli Pixel Upgrade con ROC Digitale G.M. Bilei

  6. Overall schedule Pixel Construction Firenze 6.3.2013 G.M. Bilei

  7. Pixel Construction TDR milestones G.M. Bilei

  8. Contribution to 50% of BPix layer 3 Draft INFN Plan 2011 Start setting up 2012-13 Production ~8 old analog modules 2013 Production of few new modules 2014 Start mass production 2015 End module prod & integration 2016 Commissioning and Installation Half Layer 22 faces 8 modules/faces =176 modules Needs  250 modules allowing for 80% yield and 15% spares G.M. Bilei 8

  9. Module construction flow chart Pisa Sensors test Pisa Perugia Company Bump bond Bare Module test SiN-rails glue module characteri-zation Perugia/Pisa ROC Test after dicing Half Layer Assembly and testing Glue HDI to bare module Bond ROCs to HD Module testing Burn-in Padova X-ray calibration Bari TBM and HDI testing Glue/bond TBM to HDI Test before glue HDI to sensor Catania

  10. Pixel Construction Costs as TDR INFN contribution to construction 803 Ke (963 KCHF) UK contribution on FED withdrawn. Currently 690 KCHF are missing G.M. Bilei

  11. INFN Pixel Upgrade spending profile

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