1 / 78

MPI 6.1 – Solver Enhancements

MPI 6.1 – Solver Enhancements. Presentation Outline. New Solver Features 3D Birefringence 3D Parallel Warp Solver Enhancements Flow Cool Warp/Fiber OPTIM Enhancements to Structural CAE Interfaces Miscellaneous. 3D Birefringence Analysis. Background: Refractive Index.

coxk
Download Presentation

MPI 6.1 – Solver Enhancements

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. MPI 6.1 – Solver Enhancements

  2. Presentation Outline • New Solver Features • 3D Birefringence • 3D Parallel Warp • Solver Enhancements • Flow • Cool • Warp/Fiber • OPTIM • Enhancements to Structural CAE Interfaces • Miscellaneous

  3. 3D Birefringence Analysis

  4. Background: Refractive Index • Refractive index is the property of a material to bend and slow down light (called retardation) nlens > nair nlens < nair

  5. ni: refractive index of principle directions Background: Anisotropy • If a material is not isotropic, the refractive index will be different in different directions • Called birefringence • Components of the light become out of phase • Components bend by differing amounts • Image becomes blurred • Crystals are an example of an anisotropic material

  6. Background: Anisotropy • Viewing birefringence with cross-polarizers • Components of the light will become out of phase after passing through the sample

  7. Background: Anisotropy • Passing through birefringent material, the components of light become: • Out of phase • Blurred image

  8. Optical Path Difference: Retardation • For a light source coming from some direction and traveling through the part, the retardation is the difference in the length of the optical path (nm) • Depends on the direction • Equivalent to how far out of phase are the two components of the light wave • Can be different at each point of an object

  9. Phase Difference • Expresses the retardation relative to the wavelength of the light (color) • Unit is radians • Still depends on the direction of the light • Can be different at each point of an object • See birefringence bands in cross-polarizers when the phase shift is more than 2p • That is when Retardation is greater than Wavelength

  10. Birefringence in Polymers • Example of Birefringence in a polymer due to Flow & post-warp induced stresses

  11. Birefringence in Polymers • Birefringence can be caused by the stresses in a polymer • Stress-Optic Law • Flow induced stresses • Post warpage residual stresses • Will not be uniform in all regions of the part • Will not be uniform through the thickness • Must use the integral form

  12. Birefringence in Polymers • Birefringence comes from the difference in refractive indices caused by residual stresses in the polymer • We do not need to know the refractive index exactly to calculate this stress difference • After ejection, deformation allows most of the thermal (shrinkage) stresses to be relaxed • The viscoelastic stresses are a significant component of the remaining stresses • Need viscoelastic material data to predict the viscoelastic stresses

  13. Birefringence: Analysis Setup • Run: 3D Flow + Warp • Check analysis option • Analysis Requirements • Birefringence license • Optical material data

  14. Material Data Inputs • Base refractive index (can be approximate) • Stress-Optical Coefficient (published values) • Relaxation times (viscoelastic measurements) • From a parallel plate rheometer • Solid and Melt phase • Need molded sample for solid phase

  15. Analysis Results • Change in refractive index: tensor (anisotropic) • Includes flow induced, and • Post-warpage residual stress effects • Retardance for light from +/- Z direction (nm) • Surface result which integrates the effect through the thickness • Phase shift for light from +/- Z direction (radians) • Surface result which integrates the effect through the thickness • Relative to the wavelength of the light

  16. Analysis Results (contd.) • Can use Custom plots to change direction of Light source and the wavelength of incident light • Need to first define a local coordinate system

  17. Birefringence Results • Change in refractive index (after Warp) • First principle direction • Cutting plane through thickness

  18. Tensor sized based on principal value Shaded Tensor Birefringence Results • Change in refractive index tensor result

  19. Retardation Birefringence Results • Retardation for light from –z direction • Surface only result (integrated through thickness

  20. Validation Experiments • Validation experiments on plaque model • (1mm & 3mm) cavities • 2 Flow rates • PMMA & COP materials • 10 duplicates are used for stabilization • Measure retardation at 45 positions in each sample

  21. Validation Experiments • Retardation: PMMA, 3mm cavity, Slow Fill Much less than one wavelength Retardation along centerline MPI (Green) Exp (Blue)

  22. MPI (Green) Exp (Blue) Validation Experiments • Retardation: COP, 2mm cavity, Fast Fill Much less than one wavelength Retardation along centerline

  23. Parallel 3D Warp Analysis

  24. Parallel 3D Warp • Solve 3D Warp analysis simultaneously on a multi-processor system (i.e., parallel solution) • For shared memory systems (SMP) • Will not support distributed memory clusters • Support on Windows & Linux (no UNIX) • No additional license required

  25. Processor Processor Memory Parallelization – Shared Memory • All processors are in the same computer and can see the full system memory • Fast data sharing • This is the “Dual Core” model used by Intel and AMD. • Intel expects 70% of all chips sold by 2007 to be dual core or more (quad-core)

  26. Analysis Setup • Parallel option not enabled by default • Does not change memory requirement • User controls: • No parallelization • Limit to a Max. number of processors • Specify number of processors

  27. Parallel 3D Warp Performance • Speed-up on Intel Pentium/Xeon (1MB L2 Cache per Processor) • 1.3 (2 processors) • 1.5 (4 processors) • Speed-up on AMD Athlon & Intel Core Duo/Extreme (2MB L2 Cache per Processor) • 1.5 (2 processors) • 2.0 (4 processors)

  28. Parallelization – Speed Up Results • Some sections of code have not yet been parallelized • This noticeably affects some large models

  29. Flow Solver Enhancements

  30. Flow Solver Enhancements • Midplane, Fusion & 3D • Improved selection of Ram-speed profiles • Explicit switchover by ram-position • Midplane & Fusion • Account for Compressive heating • 3D • 3-stage HTC • AMG Matrix solution • Fill time output at intermediate times • Barrel Compression • Entrance Pressure • Variable Thermal Properties

  31. Improved Selection of Ram-Speed Profiles • Ram-Speed Profiles split into two groups • Relative ram speed & Absolute ram speed • Old study files will use “Legacy” profiles

  32. Improved Selection of Ram-Speed Profiles • Ram-Speed Profiles split into two groups • Relative • %Flow rate vs. %shot volume • %Ram speed vs. %stroke • Absolute • Ram speed vs. ram position • Flow rate vs. ram position • %Maximum ram speed vs. ram position • Ram speed vs. time • Flow rate vs. time • %Maximum ram speed vs. time

  33. Ram-Speed Profiles • Use Relative, if • Machine unknown (or) • A recommended ram speed result is desired • Use Absolute, if • Machine data available (or) • Duplicating an existing process (or) • Switchover by ram position is used

  34. Explicit Switch-Over By Ram-Position • Velocity/pressure switch-over has new option • By ram position • Can only be used with absolute ram speed profile

  35. Compressive Heating • Compressive heating now accounted for in Midplane & Fusion • Melt temperature increases as material gets compressed Melt Temp = 310.0 C • Generally MPI 6.1 pressures will be 4% to 5% lower than MPI 6.0 MPI 6.0 MPI 6.1

  36. 3-Stage HTC in 3D Flow • 3D Flow Solver uses 3-stage Heat Transfer Coefficient (HTC) similar to Midplane & Fusion • Defaults: • 5,000 W/m2 Filling • 2,500 W/m2 Packing • 1,250 W/m2 Detached (pressure = 0) • HTC can also be set on individual elements by the element properties

  37. AMG Matrix Solver Option in 3D Flow • AMG matrix solver option to reduce analysis time

  38. AMG Matrix Solver Option in 3D Flow • Limitations: • Total memory usage increased around 30% • Does not need to be concurrent (Can swap) • Some Gas Injection and Reactive molding models showing poor performance • Currently under investigation • AMG matrix solution is not on by default • Will not be used if model size is VERY small

  39. Intermediate Fill-time result in 3D Flow • In MPI 6.0, the Coupled 3D Flow solver did not output fill time until the analysis was finished • In MPI 6.1, the Fill time result is output each time the intermediate results are written • The filling pattern can be checked while the analysis is running • # of intermediate results can be specified in the solver parameters

  40. Other 3D Flow improvements • Include barrel compression effect • Consider variable thermal properties • Include entrance pressure loss in beam contractions • These feature were previously available in Midplane/Fusion Flow • Some of these features were introduced in MPI 6.0 revisions

  41. Cool Solver Enhancements

  42. Cool Solver Enhancements • Uses multi-point thermal (Cp & K) data • New hot runner heat loss setting • HTC used in cooling • New cooling results • Metal side of the plastic/metal interface • Difference between the plastic and metal sides of the interface

  43. Single point Multi point Multi-Point Thermal Data Used • Multi-point Cp & K material data used • Previous releases used average value • Results typically will have only a subtle change

  44. New Hot Runner Heat Loss Setting • As an alternative to specifying the heat flux, insulating properties can now be set • Properties needed • Insulating layer conductance • Air gap • Set as property • Hot gate • Hot runner • Hot sprue

  45. Heat Transfer Coefficient (HTC) Used • HTC value of Packing (2500 W/m2) is used • Now the Plastic and metal at the plastic/metal interface have different temperatures • Typically only a few degrees different • The interface to Flow is the metal side of the interface which is the same value as it was in previous releases

  46. New Cooling Results • Due to use of HTC, results have been modified • The Temperature (XXX), part results have been replaced by Temperature (XXX), mold results • The result represents the mold side of the plastic metal interface • A new result • Mold-melt temperature difference (XXX), part • Shows the difference in temperature due to the HTC value • Temperature profile, part values of -1 and 1 represent the plastic surface temperature

  47. Summary of New Cooling Results

  48. Warp/Fiber Enhancements

  49. Warp Solver Enhancements • Four matrix solver options available for Midplane & Fusion, set in solver options • Automatic • Chooses the best option for the model size (new) • Direct solver • Simple matrix solver, efficient for small to medium models • AMG • Efficient for large models but takes a large amount of memory (new) • SSORCG • Formerly called iterative solver, less efficient than AMG but uses less memory

  50. MPI 6.0 rev 2 MPI 6.0 rev 3 Fiber Solver Enhancements • Improved orientation matching for top & bottom surfaces of Fusion models • This enhancement was introduced in MPI 6.0 revision 3

More Related