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Advances in Mass Assembly Techniques for AHCAL Component Integration

The recent Calice Collaboration meeting at LAPP highlighted significant progress in AHCAL (Analog Hadron Calorimeter) mass assembly. Key developments include the successful build and power-up tests of the AHCAL wing data aggregator, integration efforts, and initial firmware tests for Kintex FPGAs and Zynq processors. The need for automated placement systems is emphasized due to the extensive assembly requirements of approximately 8 million tiles on HBU boards, with innovative pick-and-place machines and vision systems being explored to enhance efficiency and precision.

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Advances in Mass Assembly Techniques for AHCAL Component Integration

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  1. MassAssembly 10.9.13 – CaliceCollaboration Meeting LAPP Annecy JGU Mainz - Phi Chau Bruno Bauss, Volker Büscher, Julien Caudron, Reinhold Degele, Karl Heinz Geib, Sascha Krause, Yong Liu, Lucia Masetti, Uli Schäfer, Rouven Spreckels, Stefan Tapprogge, Rainer Wanke

  2. Wing LDA/CCC Status • AHCAL wing data aggregator has been built • Initial power-up tests successful • System integration started (André, Rouven,…), but further effort required • Firmware for Kintex FPGAs • Firmware / Software for Zynq processor (“MARS ZX3”) • VME-sized clock/control unit acting as MARS test bench • Issues in firmware load stage observed on engineering sample • Further effort required to debug on production silicon available now • For the time being cover all immediate needs (AHCAL LDA/CCC) with adapter modules on “Zedboard” • Clock/control adapters available • Data aggregator adapter ready for production • New batch of clock fan-out units in production • Julien working on software integration

  3. Need for an automaticproduction • AHCAL (final design) • About 8.000.000 tileshavetobeplaced on HBU boards • With an effortof 10 s per tile ~ 8 yearsarenecessaryfortheassembling • Weneed an automaticplacement • With 1 second per placementweneed 1 year MassAssembly

  4. Massproduction • DESY: Productionof HBU boards • ITEP: Productionofthetiles • Heidelberg University: Characterisationoftiles/SiPM • Wuppertal: LEDs • Mainz University: Placement ofthetiles on the HBU board, functionalitytestsoftheassembledboards MassAssembly

  5. Automaticplacement • Pick-and-place machine • Cameradetectstiles/SiPMsandsuctioncupplacesthem on the HBU (SiPMpinsthroughthepinholes) • Vision systemdetectstilesandtheSiPMpinsqualityassurance • Problem: Reflectivesurfaceofthetiles • Pick-and-place maschineswith Vision systems workswithlight todetectthepins Pick-and-place machine MassAssembly

  6. Cameratests • Wehaveproduceddummytilesforcameratestsatmachinemanufactors • 3 companieshaveconfirmed, thatvisionsystemcan handle thetiles MassAssembly

  7. Current design • Mountingoftile on HBU board: • Tileshavetobeenpushedintothealignmentpinholes • Verysmalltolerancesareneededto fit • With 4 pins (2 SiPMpins, 2 allignmentpins), toleranceshavetobequitebig Original design: Alignmentpins HBU Pin (SiPM) SiPM Reflectorfoil Absorption layer MassAssembly

  8. Modified design: Option 1 – Not wrappedtile • Mountingofmodifiedtile on HBU board: • Plane tileswithoutalignmentpins • Requires: Fixation ofthetilewithgluepointbetweentileandreflectorfoil • Just 2 pins(fromSiPM)  tolerancesarelessdemanding Original design: Gluepoint HBU Pin (SiPM) SiPM Reflectorfoil Absorption layer MassAssembly

  9. Modified design: Option 2 – wrappedtile (Uni Hamburg) • Mountingofmodifiedwrappedtileon HBU board: • Tileiswrappedwithreflectorfoilandflexpinconnector • Fixation ofthetilewithgluepointbetweenHBU andreflectorfoil Hamburg design: Gluepoint HBU Pin (SiPM) Withreflectorfoilwrappedtile SiPM Absorption layer MassAssembly

  10. Automaticplacement • Screen printer • Sets gluepoints on thesurfaceofthe HBU • High adhesiveglueisneeded, becausewedon‘twantany time fordrying-out theglue • Silicone • Potential issue: DoesGluepointreduce light yield?  Tests Pick-and-place machine Screen printer MassAssembly

  11. Measurement Set-up • Measurement oftheinfluence on theopticalpropertieswithcosmics Amplifier Trigger scintillator MassAssembly

  12. Measurement Set-up • Measurement oftheinfluence on theopticalpropertieswithcosmics Trigger scintillator Amplifier Tilebetweentwolayersofreflectorfoil SiPM MassAssembly

  13. First measurement • The firstmeasurementsarefinished • 2 ITEP tileswith 2 Hamamatsu MPPC S10943-8584(X) aremeasuredwithcosmics • Unmodifiedwithoutgluepoints • Withoutallignmentpinswithgluepoints (allignmentpinsareremoved, << 1 ml siliconeisplacedon tile) Tileglued on reflectorfoil Gluepoints MassAssembly

  14. First results MassAssembly

  15. Result • Light yieldofthemodified design isbetterthan light yieldofcurrent design • Latertestscandeterminatetheconfigurationwiththebestopticalproperties. Wewanttotest different settingswith • Different glue • Glueshapes • Quantityofglue • Position oftheglue MassAssembly

  16. Automaticplacement • Conveyor • Transports theboardsfrom Pick-and-place machinetosolderingmaschine • Problem: Board iscompletelyfilledwithtiles  Transportation is not possible Pick-and-place machine Screen printer MassAssembly

  17. 5 mm Perforation • Solution: theexistingperforatedframeshouldstayuntilthewholeplacementprocessisfinished • After thatitcanberemoved Proposalformodificationsofmassproduction

  18. Automaticplacement selectivesolderingwouldtake 3-8s per solderingposition (x144 solderingpositions per board)  Wave solderingmachine • Fastest solderingtechnique Pick-and-place machine Wave solderingmachine Screen printer MassAssembly

  19. Wave solderingmachine https://www.youtube.com/watch?v=inHzaJIE7-4 MassAssembly

  20. Automaticplacement • Wave solderingmachine • Problem: Board isallreadyassembled  Weneed a solderingmask Pick-and-place machine Wave solderingmachine Screen printer MassAssembly

  21. Solderingmask Solderingpositions Protectivebagfor SMD components MassAssembly

  22. Automaticplacement • Wave solderingmachine • Solderingprocessdefines (andlimits) the design ofthe HBU boardandthestructureoftheSiPMpins: • thediameteroftheSiPMpinsandboreholes • positionofcomponents • SiPMpin hole position  Modificationsofthe HBU boardisneeded Pick-and-place machine Wave solderingmachine Screen printer MassAssembly

  23. SiPMpin-, boreholediameterandshape • pinholesshouldbe 3 mm larger thanthepins • We also wantmaximally robust pins • Pins couldbepushedawayfromthesolder Pins with ~ 0,5 mm diameterare optimal • The pinlengthshouldbearound1 mm outside thehole 3 mm Pin Pin hole 1 mm MassAssembly

  24. SiPMpin-, boreholediameterandshape • Recommended Area aroundtheSiPMholeswithoutany SMD components: 3 mm radius • Asymmetric Area aroundtheSiPMholeswithout SMD componentsarepossiblewith a minimumradiusof 1 mm and 3 mm on theotherside 3 mm Pin hole 1 mm Area without SMD components MassAssembly

  25. Additional advice: • Components neartheSiPMconnectorsshouldbeplacedwiththeshortsidetotheholes • The componentsstayfixed on oneside, evenifone pad isheatedup • componentsnearthepinholescan‘tbesoldered out good bad

  26. Bridge effect In thisorientation problematicforsomewavesolderingmachines 2 1 3 Soldering Wave pins Solderingbridge pinholes Withthisorientation, thebridgeeffectcanoccur The pinholesarefilledwithsolder The HBU boardistransportedfromrighttoleft (In thecoordinatesystemoftheboard Wave movedfromlefttoright) MassAssembly

  27. Solderingdirection Forexample: atthisposition a rotationis not possible • Ideal conditions: Pin holeshavepreferreddirections • Newerwavesolderingmachinescan handle thiswithoutdesign changes • SolderingmaskcanberotatedEffectivesizeoftheboardin transportationdirectionisbigger (just withbigsolderingmachines)

  28. Additional testsforsoldering • Temperaturetestsforeverycomponent (simulationofSolderingwave) • If HBU boardcouldbechange Create a solderingmaskandsolderingtests MassAssembly

  29. SMD SiPMs • With SMD SiPMstheassemblingwouldbeeasier • Wewon‘tneed a solderingmachineandthe THT optimization • More s. nextpresentationfrom Yong Liu MassAssembly

  30. Automaticplacement • Functionalitytests • Fullyassembled HBU testset-up (with LEDs on the Board) • Currentlysettingup AHCAL DAQ for fast testing Pick-and-place machine Wave solderingmachine Screen printer Functionalitytests MassAssembly

  31. Conclusion • Procedurefor fast massassemblyhasbeendefined • Massassemblyrequiresnumerous design modifications • Initial testssucessful • Fullproductionline will besetup in Mainz fordemonstratingmassassemblywiththe large prototype MassAssembly

  32. Thankyouforyourattention!

  33. Backup

  34. Reference labels • Finetuningadvice: More referencelabels on theperforatedframe (Mydata) • Existinglabelscan‘tberecognized after assembling • Reference labelsshouldbe on thesideofthetilesandtheyshouldbe on theframe MassAssembly

  35. Tiles/SiPM • Mountingof Hamburg tileon HBU board: • Black surfaceofthewrappedtile opticalcapturewithcamerasiseasiertorealize Hamburg design: Gluepoint HBU Pin (SiPM) Withreflectorfoilwrappedtile SiPM PborFeabsorptionlayer MassAssembly

  36. Tiles/SiPM • MountingofHamburg tileon HBU board: • Noteststillnowforwrappedsurface (testsofsuctioncupof pick-and-place machine) Hamburg design: Gluepoint HBU Pin (SiPM) Withreflectorfoilwrappedtile SiPM PborFeabsorptionlayer MassAssembly

  37. SiPMpinshape • Round pinsare easy, rectangularpinsaremoredifficulttosolder ( distances in the hole aren‘tconstant) MassAssembly

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