1 / 12

Full Mission Simulation Report

Full Mission Simulation Report. NNU University Dr. Lawrence, Dr. Parke, Chad Larson, Ben Gordon, Seth Leija , David Vinson, Drew Johnson, Zach Thomas April 22 nd 2012. Mission Overview.

chipo
Download Presentation

Full Mission Simulation Report

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Full Mission Simulation Report NNU University Dr. Lawrence, Dr. Parke, Chad Larson, Ben Gordon, Seth Leija, David Vinson, Drew Johnson, Zach Thomas April 22nd 2012

  2. Mission Overview • The experiment is designed to test the feasibility of using Superhydrophobic materials in the presence of high acceleration and vibration for possible use on space missions. • The other half of the experiment is to test radiation hardened chips in the presence of high radiation in a true space flight.

  3. Mechanical/Structure • The structure has not been machined but will be done this week • The integration procedure is simply mounting the Arduino and SH boxes to the lower plate and wiring power down from the top plate • A partial parts list has been written up Action Items • Finish making boxes – April 23 to 25th • Test for leakage – April 28th

  4. Mechanical/Structure Team Pairing • We are interfacing with 4 supports with our payload on the bottom half. • Working on communicating complete project specifications

  5. Design View Flexible & Radiation Hardened Chips AVR Board Geiger Counter Board Arduino Board Superhydrophobic “Boxes”

  6. Electrical/CDH • Not all of the electronics have been integrated • The activation system works perfectly • The data has been sampled but not yet written to an SD card • The data does make sense • Action Items • The data needs to be written to the SD card • The last chip needs to be wire-bonded April 22nd to 25th

  7. Testing Chips Ring Oscillator Voltage testing

  8. Power (EPS) • Doing a 15 min test without the chips running The batteries’ voltage initially 9.31V, 9.32V The batteries’ voltage after 8.57V, 8.58V • The circuit is loading the Arduino microcontroller for power resulting in not enough power for writing correct data • Action items • Retest with both chips attached and reading data • Fix voltage loading • Permanent jumper wires to main power

  9. Software • The preliminary software cannot be tested due to the header pins not yet connected. • Expected sampling rate is 1kHz currently 60Hz has been achieved • This is due to delay times in the test code • Action items • Determine pattern for and how to stream 1’s and 0’s to hexidecimal • Write output code

  10. Action Item Summary • Mechanical • A machinist will finish making boxes • Test for leakage • Electrical • The data needs to be written to the SD card • The last chip needs to be wire-bonded • Power • Retest with both chips attached and reading data • Fix voltage loading • Permanent jumper wires to main power • Software • Determine pattern for and how to stream 1’s and 0’s to hexidecimal • Write output code

  11. Weight

  12. Conclusions • The project is behind schedule but can be completed with the main electrical student working May 7th to 11th once school is done • The mechanical portion should be completed May 3rd to 6th • The main problem is voltage loading. Once that is fixed the electrical side should be able to continue good progress

More Related