Epoxy underfill chip level adhesive

, Epoxy underfill chip level adhesives

This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.

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• China
• https://www.deepmaterialcn.com/epoxy-underfill-chip-level-adhesives.html
• Joined 11/27/2022