heterogeneous integration n.
Skip this Video
Download Presentation
Heterogeneous integration

Loading in 2 Seconds...

play fullscreen
1 / 18

Heterogeneous integration - PowerPoint PPT Presentation

  • Uploaded on

Heterogeneous integration. Presenter : Chia-Min Lin (9535811). Outline. Motivation Introduction Design concept / Fabrication process Results Conclusion Reference. Motivation. Y. – C. Tung et al., J. MEMS, 2005. Introduction. Pick/place method Connector/socket technique.

I am the owner, or an agent authorized to act on behalf of the owner, of the copyrighted work described.
Download Presentation

PowerPoint Slideshow about 'Heterogeneous integration' - cherie

Download Now An Image/Link below is provided (as is) to download presentation

Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author.While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server.

- - - - - - - - - - - - - - - - - - - - - - - - - - E N D - - - - - - - - - - - - - - - - - - - - - - - - - -
Presentation Transcript
heterogeneous integration

Heterogeneous integration

Presenter : Chia-Min Lin (9535811)

  • Motivation
  • Introduction
  • Design concept / Fabrication process
  • Results
  • Conclusion
  • Reference

Y. –C. Tung et al., J. MEMS, 2005


Pick/place method

Connector/socket technique

SAM technique to

assemble the LED

X. Xiong et al., J. MEMS, 2003

K. Tsui et al., JMM, 2004


Self-assembly, transfer, integration

Low melting point solder

T. Kraus et al., Adv. Mater., 2005

H. O. Jacobs et al., Science, 2002

design concept fabrication process
Design concept / Fabrication process

Liftoff technique

H. Onoe et al., MEMS’07, 2007

Stamp transfer technique

si transfer to glass
Si transfer to glass

M. A. Meitl et al., Nature materials, 2006

  • Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama, ”3D integration of heterogeneous MEMS structures by stamping transfer,” 20th IEEE MEMS Conference, Kobe, Japan, 2007, pp175-178.
  • Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama, ”Three-dimensional integration of heterogeneous silicon micro structures by liftoff and stamping transfer,” J. of Micromech. and Microeng., 17, pp1818-1827, 2007.
  • Kenneth Tsui, Aaron A Geisberger, Matt Ellis ,and George D Skidmore, “Micromachined end-effector and techniques for directed MEMS assembly,” J. of Micromech. and Microeng., 14, pp542-549, 2004.
  • Xiaorong Xiong, Yael Hanein, Jiandong Fang, Yanbing Wang, Weihua Wang, Daniel T. Schwartz, and Karl F. Böhringer, ” Controlled Multibatch Self-Assembly of Microdevices,” J. of Microelectromech. Syst., 12, pp117-127, 2003.
  • Yi-Chung Tung, and Katsuo Kurabayashi, “A single-layer PDMS-on-silicon hybrid microactuator with multi-axis out-of-plane motion capabilities-part II: fabrication and characterization,” J. of Microelectromech. Syst., 14, pp558-566, 2005.
  • Heiko O. Jacobs, Andrea R. Tao, Alexander Schwartz, David H. Gracias, and George M. Whitesides, ” Fabrication of a Cylindrical Display by Patterned Assembly,” Science, 296, pp323-325, 2002.
  • Tobias Kraus, Laurent Malaquin, Emmanuel Delamarche, Heinz Schmid, Nicholas D. Spencer, and Heiko Wolf, “Closing the Gap Between Self-Assembly and Microsystems Using Self-Assembly, Transfer, and Integration of Particles,” Adv. Mater., 17, pp2438-2442, 2005.’
  • Matthew A. Meitl, Zheng-Tao Zhu, Vipan Kumar, Keon Jae Lee, Xue Feng, Yonggang Y. Huang, Ilesanmi Adesida, Ralph G. Nuzzo, and John A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Materials, 5, pp33-38, 2006.
design concept
Design concept


F2=kPDMS x APDMS k:coefficient of bonding energy

F3=ksubstrate x Asubstrate A:contact area