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CHAPTER 9

CHAPTER 9. Master Figure. Fig. 9.1. Figs. 9.2 a, b, c. (a). (b). (c). Polysilicon bond ring. Getter. Gold. Bond pad. Feedthrough. Figs. 9.3 a, b, c. (a). (b). (c). Figs. 9.4 a, b. (a). (b). Figs. 9.5 a, b. (a). (b). Fig. 9.6. Figs. 9.7 a, b, c. (a). (b). (c).

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CHAPTER 9

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  1. CHAPTER 9

  2. Master Figure

  3. Fig. 9.1

  4. Figs. 9.2 a, b, c (a) (b) (c)

  5. Polysilicon bond ring Getter Gold Bond pad Feedthrough Figs. 9.3 a, b, c (a) (b) (c)

  6. Figs. 9.4 a, b (a) (b)

  7. Figs. 9.5 a, b (a) (b)

  8. Fig. 9.6

  9. Figs. 9.7 a, b, c (a) (b) (c)

  10. Figs. 9.8 a, b, c, d, e (c) (b) (d) (e) (a)

  11. Figs. 9.9 a, b (a) (b)

  12. Fig. 9.10

  13. Fig. 9.11 a, b, c (a) (b) (c)

  14. Fig. 9.12 a, b (a) (b)

  15. Fig. 9.13 a, b (a) (b)

  16. Sac. Polymer (a) (c) tCap Metal Polymer Overcoat tCh tChan (b) (d) Figs. 9.14 a, b, c, d

  17. Au/Ti Embedded channel Avatrel Cavity Silicon beam Figs. 9.15 a, b, c, d (a) (b) (c) (d)

  18. Q=5100 Q=5400 Figs. 9.16 a, b (a) (b)

  19. Figs. 9.17 a, b, c (a) (b) (c)

  20. Figs. 9.18 a, b (a) (b)

  21. Fig. 9.19

  22. 150C 25C 100C Avatrel Figs. 9.20 a, b (a) (b) (a) (b)

  23. Figs. 9.21 a, b, c (a) (b) (c)

  24. Fig. 9.22

  25. Opening for Gas Gettering Particles from the Sintered NEG cap 2 NEG Wire Bond cap 1 Micromachined Device Vacuum Cavity Element Element Fig. 9.23

  26. Fig. 9.24

  27. Fig. 9.25

  28. Fig. 9.26 a, b (a) (b)

  29. Fig. 9.27

  30. Fig. 9.28

  31. Fig. 9.29

  32. Q Versus Time - 95C Soak 35000 30000 Q 25000 20000 15000 0 500 1000 1500 2000 2500 3000 Time @95C (hrs) Fig. 9.30 a, b (a) (b)

  33. Q vs Shelf-Time y = 4.199x + 27236 60000 2 R = 0.0004 Q 30000 10000 0 0 50 100 150 200 250 300 Time on Shelf (days) Fig. 9.31

  34. Cap Cap Figs. 9.32 a, b, c, d, e Cap (a) (e) (b) Cap (c) (d)

  35. Fig. 9.33

  36. Figs. 9.34 a, b (a) (b)

  37. Fig. 9.35

  38. Fig. 9.36 Wafer Wafer MEMS MEMS Wafer Wafer Pick & Pick & Saw Saw Test Test Fabrication Fabrication Bonding Bonding Place Place Solder PCB Solder PCB Adhesive Adhesive Components Components Dispense Dispense Cure Cure Wirebond Wirebond Wirebond Wirebond System Test & System Test & Module Module PCB to PCB to MEMS chip MEMS chip Coat PCB Coat PCB Calibration Calibration Lid Attach Lid Attach Leadframe Leadframe to PCB to PCB

  39. Plastic mold Die Pad Die attach Lead frame Fig. 9.37

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