Turnkey IC and Device Packaging

1. Package Science Services LLC Turnkey IC and Device Packaging Package design, characterization, simulation, modeling, measurements and analysis

2. Package Science Services Mission Our mission is to provide best-in-class technical services for packaging of high technology single and multi-chip integrated circuits and discrete devices from concept through mass production using our extensive inventory of hardware and software tools and copious experience in microelectronic and technology package engineering. PSS can help to provide a solution for a broad array of design and performance problems. Expert packaging, design, materials and supply chain personnel are on board to completely support the packaging process and work with your device and engineering staff to match your needs with the right package and supplier for your prototype and volume IC packaging needs. Our goal is to serve semiconductor companies that need a knowledgeable, veteran staff to take the worry and learning curve out of packaging complex products. Need developmental or prototype packaging? Let PSS help you with engineering lots to provide concepts and demonstrate performance. PSS also supports services at any point in the packaging chain with a full array of software, hardware and measurement tools.

3. Package Science Services PSS provides turnkey IC and technology packaging services. We can help to develop the right package with the right performance and cost in tandem with your chip design. We can take the process from concept to mass volume with industry experts who have been in the IC packaging business for three decades. We can reduce your learning curve and decrease time to market by supporting your packaging needs, allowing you to free up your internal resources for other critical tasks. Package Science has the tools and staff to efficiently solve your IC packaging issues.

4. Turnkey support for all types of IC and discrete device packaging: • Package selection based on form factor, cost and performance criteria • Design and layout for wire bond, flip-chip, 3D, SIP, lead-frame and CSP • Single chip, multi-chip, discrete devices • Electromagnetic modeling, simulation and measurement tools • Thermal modeling, simulation and measurement tools • Material set selection, supply chain support • Assembly process development • Prototype assembly • Qualification / Reliability plan • Transfer to mass production • Failure analysis and physical deconstruction • www.pkgscience.com

5. Packaging for High Technology Products • Chip manufacturing has evolved to where simple, low-performance designs can be packaged in the millions and billions with high yield and extremely low cost • This presents the illusion that all packaging is simple and should be relatively easy and low cost • The old model of creating the device followed by packaging it is obsolete • Successful packaging of high technology devices requires consideration at the outset of the product design cycle • Concurrent design practices for the device and package are mandatory for high performance products High-Frequency Electrical Measurement Probe Station

6. 3287 Kifer Road Santa Clara, CA 95051 tel: +1-408-969-2388 fax: +1-408-841-7597 email: info@pkgscience.com web: www.pkgscience.com