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AMICSA 200 6 8 summary. AMICSA 2006 in numbers. 48 51 participants From 11 12 countries GR, F, UK, NE, D, IT , BE, USA, SWI, SWE , AT , FI, P, NO

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AMICSA 20068

summary

AMICSA 2008

amicsa 2006 in numbers
AMICSA 2006 in numbers
  • 4851 participants
  • From 1112 countries GR, F, UK, NE, D, IT, BE, USA, SWI, SWE, AT, FI, P, NO
  • From 2627 different institutions/companies (more than half are new comers)DUTH, A2S, EADS Astrium (UK & F), E2V , ESA, CNES, National Semiconductor, TRAD, Aurelia, NTUA, STMicroelectronics, SODERN, SRON, Fraunhofer Inst IC, IHP, IMST, NISR, TESAT, ETH, SUPAERO, Saab, IMEC, AAS, Austria Space Research Inst, Nucletudes, ISD, EST Tomar, Instituto de Telecomunicações, Silicon SW Systems, Nova U., VTT, TKK, Gamma Medica Ideas, U. Bergen, Nemerix, Humboldt U., Kayser-Threde, Chipidea-MIPS, SABCA.
  • 1719 presentations in 2 days, plenty of discussions, questions and answers

AMICSA 2008

amicsa 200 8 in numbers
AMICSA 2008 in numbers
  • 4849 participants
  • From 1115 countries GR, F, UK, NE, D, IT, BE, USA, SWI, SWE, AT, FI, P, NO, E
  • From 2636 different institutions/companies (more than half are new comers)DUTH, A2S, EADS Astrium (UK & F), E2V , ESA, CNES, National Semiconductor, TRAD, Aurelia, NTUA, STMicroelectronics, SODERN, SRON, Fraunhofer Inst IC, IHP, IMST, NISR, TESAT, ETH, SUPAERO, Saab, IMEC, AAS, Austria Space Research Inst, Nucletudes, ISD, EST Tomar, Instituto de Telecomunicações, Silicon SW Systems, Nova U., VTT, TKK, Gamma Medica Ideas, U. Bergen, Nemerix, Humboldt U., Kayser-Threde, Chipidea-MIPS, SABCA, INTA, Insilition, RUAG,CNM/U. Seville, Arquimea,CERN, Dutch Space, ACTEL.
  • 1719 presentations in 2 days, plenty of discussions, questions and answers

AMICSA 2008

amicsa 06 applications
AMICSA’06 - Applications

CMOS Image sensors readout

Video processing chain

ADC/DAC/HSSL high speed low power telecom processors (mobile & broadband)

CAN1553 transceivers

TM acquisition & data handling IO control

Magnetometer front end

Slow sampling high resolution

Power converters

LASER interferometer

AOCS

Environmental monitoring

X,Gamma ray spectroscopy

GNSS receivers Front End

AMICSA 2008

amicsa 08 applications
AMICSA’08 - Applications

CMOS Image sensors readout

Video processing chain

ADC/DAC/HSSL high speed low power telecom processors (mobile & broadband)

CAN1553 transceivers

TM acquisition & data handling IO control

Magnetometer front end

Slow sampling high resolution

Power converters

LASER interferometer

AOCS

Environmental (T, wind, humidity) monitoring

X,Gamma ray spectroscopy readout

GNSS receivers Front End

AMICSA 2008

amicsa technology i ii
AMICSA – Technology (I/II)

PROCESSES

  • CMOS
  • Bipolar
  • BiCMOS
  • Si / SiGe / SiGeC
  • bulk / SOI
  • 1.0, 0.5, 0.35, 0.25, 0.18, 0.13 µm;
  • 90, 65nm

FOUNDRIES

  • AMS (AT)
  • AMIS (B)
  • STMicroelectronics (F)
  • IHP (D)
  • Infineon (D)
  • XFab (UK)
  • UMC (Taiwan)
  • TSMC (Taiwan)

AMICSA 2008

amicsa technology ii ii
AMICSA – Technology (II/II)

EDA tools, HDL & DK

  • Tanner
  • Cadence
  • Calibre (Mentor)
  • Pspice / Hspice
  • ADMS (Mentor)
  • VHDL-AMS / Verilog-A
  • proprietary simulators, optimizers: Astrium (UK), S3 (P)

MPW programmes

  • Europractice
  • CMP
  • MOSIS
  • vendor specific…
  • Multi-Layer Mask

AMICSA 2008

amicsa radiation effects
AMICSA – Radiation effects

Mitigation Techniques

(technology and function dependent)

  • enclosed/bigger transistors, H-shape
  • guardband rings / STI / LOCOS
  • avoid diffusion resistors in favour of oxide R
  • epi layer / hetero-epi
  • buried-layers
  • low gain artificially provoked parasitic transistors
  • DRC isolation rules + waving to allow ELT
  • SOI
  • thinner field oxide, thicker gate oxide
  • hardened libraries (re-size, cell-topology)
  • ADC offset auto-zeroing (analog and digital correction)
  • architecture hardening (open vs closed loop)
  • redundancy and voting/comparing
  • self-powering functions (reducing SEL options)

Rad Threats

(TID, SEE)

  • leakage currents
  • Vth shifts
  • parasitic transistors/ latch up
  • gate rupture
  • data corruption (bit flips)
  • transient pulses

AMICSA 2008

amicsa future challenges
AMICSA – Future Challenges

Easier selection of process, foundry, design kit & tools, rad mitigation techniques, quality level – feasibility!

Lower cost access to design kits, manufacturing services

Simulation tools. Characterising COTS (NPR,etc)

Supporting EU foundries in low volume market

Coordinating/reusing EU resources (e.g. rad tests, new libs/DK & IPs), preserving industry competition and individual commercial interests

Finding more resources (FP7?) for more tech/components evaluation and qualification. Sharing results !

Maintaining good (better) communication channels (ESCC Working Groups, Harmonisation/Tech Dossiers)

AMICSA 2010

AMICSA 2008

amicsa thanks
AMICSA – THANKS !

all participants

sponsors

National Semiconductor, E2V, Nova University of Lisbon, ESA

organizers

Boris Glass (ESTEC Microelectronics) and ESA Conference Bureau

João Goes et al.(Faculty of Sciences & Tech / Nova University of Lisbon)

AMICSA 2008