Na62 gigatracker cooling requirements
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NA62 Gigatracker cooling requirements. Gigatracker (GTK) modules will operate in vacuum and under high radiation Module has to be replaced on a regular basis C ooling system required to avoid performance loss

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Na62 gigatracker cooling requirements
NA62 Gigatrackercoolingrequirements

  • Gigatracker (GTK) modules will operate in vacuum and under highradiation

  • Module hastobereplaced on a regularbasis

  • Cooling system required to avoid performance loss

  • The operation temperature for thefrontendelectronics will be 5°C orlower

  • Low material budgetforthecoolingsystem


Gigatracker module
Gigatracker Module

supportandalignementstructure

Coolingplate

Readoutchip

(12.5 x 20 mm), heatproduction ca. 3.2W per chip (2 W/cm2)

beam direction

Sensor, siliconpixels

(27 x 60 mm)

3D schematicdrawing of the GTK module


Materials in the sensor area
Materials in thesensorarea

The total material budget (material in the beam) allowedfor the GTK module is 0.5% X0(radiation length).


Cooling systems under investigation
Coolingsystemsunderinvestigation

  • carbonplate, conductivecooling

  • convectivecooling in a vessel

  • microchannels


Our proposal microchannel cooling
Ourproposal: Microchannelcooling

  • Goals ofdevelopment:

  • Integration ofmicrochannelsintofrontendelectronics

  • Cooling via an separate coolingplatewithmicrochannels

    • 150mm thickness

    • 300mm thickness

  • Benefits:

  • Uniform temperaturedistribution in theareatobecooled

  • Small DT betweencoolantandreadoutchip => reduced thermal stress

  • Single-phaseandtwo-phasecoolingpossible

  • Technology studiedat EPFL with strong supportofindustrialpartners

  • Mutual understandingtoshareknowledge (EPFL <> CERN)

  • Specifityofourapplication:

  • Verylow material budget

  • Low heatflux


Tentative layout of micro channels for the gigatracker
Tentative layoutofmicrochannelsfortheGigatracker

  • areatobecooled ~40 x 60mm

  • channellength ~40mm

  • channelcrosssection 50mm x 50mm

  • separationwalls 25mm thick

  • heatflux in thecoolingregion 2W/cm2

  • Support and Connection ofservicesoutside the sensor area and on one side

  • Single-phasecooling

  • Open pointsforthe prototype:

  • U-shapedchannelsorsinglelinechannels (pressureloss <> massflowneeded)

  • Thermal connectionofthereadoutchiptothecoolingplate


C 6 f 14 cooling liquid of choice
C6F14 cooling liquid ofchoice

  • radiationhard

  • thermallyandchemicallystable

  • nonflammable, nontoxic, nonconducting

  • knownandusedat CERN (CMS and Atlas Tracker)

  • used in liquid phase


More people for the gtk cooling
More peopleforthe GTK cooling

Paolo Petagna, CERN PH-DT-PO, DT cooling Project Leader

Alessandro Mapelli, EPFL Mircrosystems Laboratory, Microfabricationtechnologies

Piet Wertelaers, CERN PH-DT-PO, Consultant for design andlayoutofcoolingcircuit

JerômeDaguin, PH-DT, Experience in C6F14plantsat CERN


Plans for the next months
Plans forthenextmonths

August/September:

  • firstlayoutforthemicrochannels

  • productionof a prototype atthe EPFL clean room

  • preparation teststand (coolingunit, instrumention …)

  • design ofconnectingcomponent

  • developmentof a CFD-Model

Oktober/November:

  • commissioning teststand

  • firsttestatroomtemperature

  • preparationoftestatcoldtemperature, cryostat

  • assembly prototype andmockupchips

Thermal interfacetobedesignedaccordingtochip design andfabrication!!!