BGA Package Underfill Epoxy, BGA Package Underfill Epoxy
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technolo- gy of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhe-sives, and adhesives for electronic products. Based on adhesives