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Electrostatics in Advanced 300 mm Semiconductor Operations

Electrostatics in Advanced 300 mm Semiconductor Operations. Larry Levit, Ph.D. Chief Scientist ION Systems, Inc. Berkeley, California USA NARTE Certified ESD Engineer. Cleanrooms and Static Charge. Insulators Like Teflon Quartz SiO 2 Low Humidity Ions Swept Away by HEPAs.

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Electrostatics in Advanced 300 mm Semiconductor Operations

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  1. Electrostatics in Advanced 300 mm Semiconductor Operations Larry Levit, Ph.D. Chief Scientist ION Systems, Inc. Berkeley, California USA NARTE Certified ESD Engineer

  2. Cleanrooms and Static Charge • Insulators Like • Teflon • Quartz • SiO2 • Low Humidity • Ions Swept Away by HEPAs

  3. Typical ESD Audit Data

  4. Problems Caused By Static Charge

  5. Particle attraction & bonding to charged surfaces • Damage to product • Robotic lockup

  6. Electrostatics and Contamination

  7. Electrostatic Attraction and Particle Size

  8. Wafer charged to 500V Without static charge Wafer charged to 4000V ESA (electrostatic attraction)

  9. Air Ionizaton Design Parameters

  10. Problem: How To Dissipate Static Charge on an Insulator? Solution: Make the Air Conductive Air Ions neutralize surface charge by contact.

  11. 10-20 kV Intense Electric Field A Basic Corona Ionizer Positive HV makes Positive Ions Negative HV makes Negative Ions

  12. Ceiling Emitter- neutralizes FOUP shells, windows and other insulators In-Tool Bars- neutralize end effectors, Teflon handling parts, wafers and FOUP insides In-Tool vs. Ceiling IonizersDifferent functions

  13. Bars are Used in Tools

  14. Bars Put in the EFEM

  15. Microcontamination Histogram for a PVD Tool

  16. Microcontamination Histogram For an Etch Tool Ch1

  17. Microcontamination Histogram For an Etch Tool Ch2

  18. Microcontamination Histogram Etch Tool Ch 2 • Ions On 11.6 ± 4.4 • Ions Off 25.3 ± 6.8

  19. Microcontamination Histogram For an Etch Tool Ch3 On

  20. Microcontamination Histogram For an Etch Tool Ch4

  21. Microcontamination Histogram For an Etch Tool

  22. 0.4 0.35 Ionization Off: 8.2 ± 3.6 Ionization On: 3.3 ± 0.9 0.3 0.25 Frequencey of Occurrence 0.2 ( per wafer) On Off 0.15 0.1 0.05 0 0 2 4 6 8 10 12 14 16 More Number of Defects Microcontamination Histogram For an Implant Tool

  23. Microcontamination Histogram For an XRF Tool

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