Status report on segmented mesh microbulk
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RD51 Common fund project. Status report on segmented mesh microbulk. Fransisco Aznar 1 , Theopisti Dafni 1 , Martyn Davenport 3, Rui De Oliveira 3 , Esther Ferrer Ribas 2 , Serge Ferry 3 , Theo Geralis Fransisco J. Iguaz 1 , Thanos Kalamaris , Mariam Kebbiri 2 ,Thomas Papaevangelou 2.

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Status report on segmented mesh microbulk

RD51 Common fund project

Status report on segmented mesh microbulk

FransiscoAznar1, Theopisti Dafni1, Martyn Davenport3,Rui De Oliveira3, Esther Ferrer Ribas2, Serge Ferry3, Theo Geralis Fransisco J. Iguaz1, ThanosKalamaris, Mariam Kebbiri2 ,Thomas Papaevangelou2

1University of Zaragoza, 2IRFU/CEA, 3CERN, 4NCSR Demokritos,

6thFebruary 2014, RD51 Collaboration Meeting


Status report on segmented mesh microbulk

Motivations

  • Develop a 2D low mass intrinsic X-Y detector

  • Strategyused up to now (CAST, MIMAC, NTOF…)

  • Disadvantages:

  • In the limit of no diffussion, the 2D capabilities are lost

  • Charge collection in X-Y is not completelyequivalent

  • Complexityin the manufacturing of a multilayerstackmicrobulk


Status report on segmented mesh microbulk

Intrinsic true 2D Microbulks

  • Signal X-Y completelycorrelated

  • Minimisation of the mass budget

  • Coupled to autotriggerelectronics Verylowthreshold

X-strips

Y-strips

Interest: rare eventdetectionexperiments, neutron beamimagers…


Status report on segmented mesh microbulk

Segmented mesh microbulk



Status report on segmented mesh microbulk

Evolution

1st batch: February 2012

Active area ~ 38 x 38 mm2, Cu strips, pitch 1mm, strips interspacing 100 μm, amplification gap 50 μm could not hold HV, only a few strips were operational

2nd batch: November 2012

New production technique, 4 Micromegas prototypes Hold HV, No spectrum from an 55Fe source, pitch 1mm, strips interspacing 100 μm, amplification gap 50 μm

3rd batch: September 2013

5 Detectors manufactured with different holes diameters: 2 with 45µm and 3 with 60 µm. Pitch is 1 mm and strip interspacing reduced to 40 µm

Manufacturing: first the x-strips then the mesh holes and finally the y strips.

No holes on top of the x-strips gaps.


Status report on segmented mesh microbulk

3rd Batch



Status report on segmented mesh microbulk

First characterisations (3rd batch)

Ar + 5% Isobutane

Reading the mesh (PA Ortec+ Shaper+MCA)

55Fe source


Status report on segmented mesh microbulk

Testing the x-strips with Gassiplex electronics


Status report on segmented mesh microbulk

Testing the x-strips with Gassiplex electronics

12% FWHM


Status report on segmented mesh microbulk

Conclusions and perspectives

  • First operationalsegmentedmicrobulks have been produced: theybehave as standard microbulks (high gains, Eres=12% reached)

  • Differences of behaviour (Eres) between 40 and 60 µm holes: in the 60 µm therewas an alignmentproblemduringmanufaturing.

  • HV front end card has been validated

  • Characterisation on going

  • Nextsteps:

  • Read Y signalswithGassiplexelectronics

  • Test withautotriggerelectronics: VMM1/AGET

  • Optimise design

  • Built a large detector withconnector: NTOF neutron beam profiler