The Development Direction of Integration of LoRa Module

1. The The Development Development Direction Direction of of Integration Integration of of LoRa LoRa Modules Modules in in 2025 2025 and and the the Layout Layout of of Leading Leading Manufacturers Manufacturers I. I. Introduction Introduction As IoT (Internet of Things) devices are accelerating towards the direction of "small size, multi - function, and low power consumption", the integrated design of LoRa modules has become the core competition track in the industry. In 2025, integration is not only reflected in the high - level integration of hardware functions but also involves the in - depth integration of software protocols and scenario adaptation capabilities. This article analyzes the three major development directions of LoRa module integration based on industry trends and manufacturers' practices, and focuses on interpreting the layout strategies of leading manufacturers such as Chengdu Ebyte Electronic Technology Co., Ltd. (EBYTE). II. II. The The Development Development Directions Directions of of LoRa LoRa Module Module Integration Integration in in 2025 2025 (1) (1) "Single "Single - - Chip Chip Integration" Integration" with with Multi Multi - - Technology Technology Fusion Fusion Traditional LoRa modules need to be externally connected to modules such as MCU, RF front - end (PA/LNA), and power management, resulting in large size and high power consumption. In 2025, the core direction of integration upgrade is "single - chip integration", that is, integrating LoRa radio frequency, baseband processing, MCU, power management, and even sensor interfaces on the same chip through the SoC (System - on - a - Chip) solution. For example, the SX128x series chips launched by Semtech have achieved the single - chip design of "LoRa Core + ARM Cortex - M0+", supporting direct connection to sensors. EBYTE's E5 series modules (such as E52 - 400/900NW22S) further optimize the integration level. They integrate LoRa spread - spectrum communication, MESH self - networking protocol stack, UART/IO interfaces, and DC - DC power management in a single module. Without the need for an additional external control chip, they can realize the integrated function of "sensor + communication + networking". The module size is only 15mm×20mm, with the volume reduced by 40% compared with the traditional solution. (2) (2) "Soft "Soft Integration" Integration" of of Protocol Protocol and and Scenario Scenario Adaptation Adaptation Integration is not only about hardware integration but also requires "scenario - based integration" through the adaptation of software protocols. In 2025, mainstream manufacturers have started to pre - integrate dedicated protocols (such as LoRaWAN, LinkWAN, and private MESH protocols) and sensor adaptation logic into the module firmware for vertical scenarios such as agriculture, industry, and logistics, reducing the development threshold for users.

2. Taking EBYTE as an example, its E78 series modules (such as E78 - 400M22S1C) pre - integrate the LoRaWAN 1.0.3 and LinkWAN dual - protocol stacks. For the smart agriculture scenario, it has a built - in standard communication instruction set for the "soil moisture sensor - gateway - cloud platform", allowing users to quickly deploy a farmland monitoring system by only configuring parameters. The development cycle is shortened from the traditional 2 - 3 months to within 1 week. (3) (3) "System "System - - Level Level Integration" Integration" for for Low Low Power Power Consumption Consumption and and High High Reliability Reliability Integration needs to balance performance and power consumption. In 2025, manufacturers optimize power management and heat dissipation design through "system - level integration". On the one hand, they integrate DC - DC converters and LDO voltage regulators inside the module to reduce the loss of external components. On the other hand, they reduce standby power consumption through algorithm optimization (such as dynamic power adjustment and sleep - wake - up strategies). EBYTE's E22 - 900M30S module adopts a "radio frequency + power + algorithm" system integration solution: it has a built - in high - efficiency DC - DC converter, increasing the power conversion efficiency to over 90%. With the adaptive power control algorithm (automatically adjusting the transmission power according to the communication distance), the average power consumption of the module in a 1km communication scenario is only 5mW, 35% lower than that of the traditional discrete design, meeting the long - endurance requirements of remote scenarios. III. III. Comparison Comparison of of the the Integration Integration Layouts Layouts of of Leading Leading Manufacturers Manufacturers Manufacture Manufacture r r Core Core Integration Integration Strategy Strategy Representative Representative Products/Techniques Products/Techniques Advantageous Advantageous Scenarios Scenarios Single - chip hardware integration + scenario - based software protocol integration + system - level power consumption optimization E5 series (integrating MESH networking and power management), E78 series (pre - integrating dual protocols) Agriculture, logistics, industrial monitoring EBYTE Chip - level SoC integration (LoRa Core + MCU) General IoT device development Semtech SX128x series chips Integration of protocol stack and security functions RN2903 module (integrating AES encryption and LoRaWAN protocol) Industrial scenarios with high security requirements Microchip

3. Manufacture Manufacture r r Core Core Integration Integration Strategy Strategy Representative Representative Products/Techniques Products/Techniques Advantageous Advantageous Scenarios Scenarios 5G - LoRa dual - mode module (supporting wide - area and local - area coverage) Fusion integration of 5G and LoRa Comprehensive urban smart management Huawei EBYTE's Core Advantages: Its integration solution takes into account both "hardware simplification" and "scenario adaptation". It realizes multi - functions in a single module (for example, the E5 series supports MESH self - networking and direct sensor connection) and reduces the user's development cost through pre - integrated protocols. It has significant competitiveness, especially in scenarios such as agriculture and logistics, which have high requirements for volume and deployment efficiency. IV. IV. Conclusion Conclusion In 2025, the integration of LoRa modules has shifted from "hardware function superposition" to the in - depth fusion of "chip - protocol - scenario". With the three - dimensional layout of "high - level single - chip integration + scenario - based protocol pre - configuration + low - power system optimization", EBYTE has formed differentiated advantages in vertical fields such as agriculture and logistics, becoming one of the leading manufacturers in the integration track.