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NSW Read-out spec

NSW Read-out spec. Rev:C. Modification history. Rev: A date: 4 December 2013 Rui : Creation of the document (19 pages) Rev: B date: 6 J anuary 2014 Rui : the misalignment tolerance for the resistive layer is added Rui : the starting copper thickness is changed

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NSW Read-out spec

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  1. NSW Read-out spec Rev:C Rev:C ( check-->20 pages document)

  2. Modification history • Rev: A date: 4 December 2013 • Rui : Creation of the document (19 pages) • Rev: B date: 6 January 2014 • Rui : the misalignment tolerance for the resistive layer is added • Rui: the starting copper thickness is changed • Rui : The board cutting accuracy is added • Rui: The board drilling accuracy is added • Rev:C date: 16/04/2014 • Rui : The accuracies of milling and drilling have change • Rui : a defect selection have been introduced slide 10 • Rui : a slide describing the resistive misalignment is added (slide 16) Document under the responsibility of Rui De Oliveira , no modification is allowed. Any request for modification should be sent to Rui De Oliveira (rui.de.oliveira@cern.ch) . The active document and all the previous revisions are stored in TE/DEM/EM/PMT data base. If you use this document for production purpose please contact Rui de Oliveira to know the active version. Rev:C ( check-->20 pages document)

  3. Chapters 1/Process description 2/PCB detailed description 3/Flex description 4/Gluing description 5/Pillar creation 6/files Rev:C ( check-->20 pages document)

  4. Chapter1:Process description Rev:C ( check-->20 pages document)

  5. 50um Kapton + resistive strips PCB + readout strips Rev:C ( check-->20 pages document)

  6. 50um Kapton + resistive strips PCB + readout strips 25um Glue Rev:C ( check-->20 pages document)

  7. 50um Kapton + resistive strips PCB + readout strips 25um Glue Isostatic Gluing Rev:C ( check-->20 pages document)

  8. 50um Kapton + resistive strips PCB + readout strips 25um solid Glue High temp Gluing Pillars creation Rev:C ( check-->20 pages document)

  9. Chapter 2:PCB detailed description Rev:C ( check-->20 pages document)

  10. PCB: -single side -0.5mm thick +/- 10% -Starting copper foil : 17um thick copper + 17um or 35um copper protection -Final copper thickness 17um -NI/Au or Ag plating on connector fingers -Visual inspection IPC-A-600 Class 2 Accuracy: -Pattern absolute accuracy: +/-30um referring to the GERBER file -line and space +/-20% -Cutting absolute position accuracy : +/-100um referring to the strips -Mechanical holes absolute position accuracy : +/-100um referring to the strips -Reference holes position accuracy: +/-20um max (hole to printed pattern misalignment) Test conditions: -Temp : 20 +/2degrees -Humidity: 50% +/-20% RH Defects: -Cuts Grade A : no cuts Grade B : 1/10000 Grade C: 1/1000 -Cuts location: Option A: Located Option B : non located -shorts Grade A : no short Grade B : 1/10000 Grade C: 1/1000 -Short location : Option A: located Option B: non located Stabilization -10 Cycles +200 deg /20 deg PCB + readout strips Base material, when used, shall be flame retardant rated UL 94V-0 laminate glass fibre epoxy and conform to L94 according to IPC-4101/94. Copper shall be type H with pits and dent, class B. When procuring base material the following are required: minimum TG 170°C, minimum TD(5%) 350°C, minimum T-288 35min, maximum Z-axis thermal expansion coefficient above TG 280PPM/°C (alternatively Z-axis thermal expansion coefficient between 50-260°C of 3.5% maximum is acceptable) Acceptance of finished printed boards shall be in accordance with IPC-A-600, class 2 Fabrication and inspection shall be according to IPC-6011 and IPC-6012, class 2 Rev:C ( check-->20 pages document)

  11. Chapter 3:Flex description Rev:C ( check-->20 pages document)

  12. 50um Kapton + resistive strips Flex: -single side -50m thick +/- 10% -Deposited resistor on top -Kapton HN substrate -400um line , 100um space -Visual inspection IPC-A-600 Class 2 Accuracy: -Pattern absolute accuracy: +/-1mm referring to the GERBER file -line and space +/-20% general accuracy -Cutting absolute position accuracy : +/-1mm referring to the cutting patterns Test conditions: -Temp : 20 +/2degrees -Humidity: 50% +/-20% RH Defects: -Resistive value Grade A : +/- 20% Grade B : +/- 100% Grade C: +/-200% -Cuts : Grade A : Grade B : Grade C : -shorts Grade A : Grade B : Grade C: Rev:C ( check-->20 pages document)

  13. Chapter 4:Gluing description Rev:C ( check-->20 pages document)

  14. Gluing Stack up SS main spacer 2mm mini Pacopad Aluminium 0.3mm Pacothane Flex 25um glue (KrempelAkaflex CDF 25) PCB Pacothane Aluminium 0.3mm Pacopad SS main spacer 2mm mini Rev:C ( check-->20 pages document)

  15. Gluing parameters • Pressure: 14 to 17 kg/cm2 • Ramp up temp: max 10deg/min • Polymerization time and temp: 45 min @ 170deg • Ramp down temp: max 10deg/min • Misalignment max: 0.06 degrees in strip direction • corresponding to max 1mm shift over 2.2m • Misalignment in the other axis 3mm max Rev:C ( check-->20 pages document)

  16. Resistive Copper 1mm max 2m 3mm max 2m accepted Rev:C ( check-->20 pages document)

  17. Chapter 5:Pillar creation Rev:C ( check-->20 pages document)

  18. Test conditions: -Temp : 20 +/2degrees -Humidity: 50% +/-20% RH Defects: -missing pillars Grade A : no Grade B : 1/1000 Grade C: 1/100 -extra structures Grade A : no Grade B : <5 Grade C : <10 Pillars: -Pyralux PC1025 -Curing 160deg 1hour min -Ramp up curing: 50 deg/hour max Accuracy: -pillar diameter 350 um +/-50um - -Pillar Height 128 um +/-2um -Position accuracy : +/-1mm referring to the board cutting Rev:C ( check-->20 pages document)

  19. Chapter 6:Files Rev:C ( check-->20 pages document)

  20. Files • Top copper strips: • Xxxx • Xxxx • Kapton area: • Xxxx • xxxx • Resistive layer: • Xxxx • Xxxx • Pillar layer: • Xxxx • Xxxx • Cutting file: • Xxxx • Xxxx • Drilling file: • Xxxx • Xxxx • Ni/Au or Au selective file: • Xxxx • Xxxx Rev:C ( check-->20 pages document)

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